1 / 3 www.asb.co.kr november 2008 p lerow tm aln2330t2 internally matched lna module parameter unit specifications min typ max frequency range mhz 2300 2360 gain db 20 21 gain flatness db ? 0.2 ? 0.3 noise figure (nf) db 0.70 0.75 output ip3 (1) dbm 34 35 s11 / s22 (2) db - 18 / - 10 output p1db dbm 20 21 switching time (3) ? sec - supply current ma 100 120 supply voltage v 5 impedance ? 50 max. rf input power dbm c.w 29 ~ 31 (before fail) package type & size mm surface mount type, 10wx10lx3.8h operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured wi th two tones at an output power of 4 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage from 0 v to v s . pin number function 2 rf in 5 rf out 6 +vcc other s ground s 21 = 21.2 db @ 2300 mhz = 20.8 db @ 2360 mhz nf of 0.7 db over fr e quency unconditionally stable single 5 v supply high oip3 @ low current the plerow tm aln - series is the compactly designed surface - mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application b and in order to ensure its unconditionally stable implementation to the application system environment. the surface - mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. ou t line drawing (unit: mm) feature s specifications (in pr o duction) note: 1. the number and size of ground via holes in a circuit board is critical for therma l rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left side. description aln2330t2 asb inc. (top view) (bottom view) solder stencil area ? 0.4 plated thru holes to ground plane plerow (side view) (recommended footprint) typ. @ t = 2 5 ? c, v s = 5 v, freq. = 2330 mhz, z o.sys = 50 ohm c o u pl er website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion c o u pl er c o u pl er c o u pl er 2 - stage single type
2 / 3 www.asb.co.kr november 2008 p lerow tm aln2330t2 internally matched lna module s - param e ters noise figure oip3 p1db 2300~2360 mhz +5 v typical performance (measured) s - parameters & k factor
3 / 3 www.asb.co.kr november 2008 p lerow tm aln2330t2 internally matched lna module 1) the tantal capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be determined by customers dc supply status. 2) so - called dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking th e dc component in the signal. the dc blocking capacitors are included inside the lna module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the ap plication frequency. application circuit recommended soldering reflow process evaluation board layout + - aln out in c1 c2 tantal capacitor v dc 20~40 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) size 2.5 x 2.5mm in out +vcc (for aln - at, bt, t series C 10x10mm)
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