? halogen-free / rohs compliant (eu rohs / ul-94 v-0 / msl:level 1 compliant) 000 ? absolute maximum ratings ta = 25 ?? c page channel temperature tch storage temperature -55 tstg ?c to +150 of 15 drain current total power dissipation pulse drain current idp pd product standards mos fet FK3906010L internal connection ? low drive voltage : 2.5 v drive FK3906010L silicon n-channel mosfet parameter vgs ? 12 v unit : mm ? packaging embossed type (thermo-compression sealing) : 3 pcs / reel (standard) ? features ? marking symbol : cv for switching fk350601 in ssmini3 type package ?c ma 150 rating unit 125 200 mw v ma 100 symbol 60 id vds drain-source voltage gate-source voltage 1. gate 2. source 3. drain jeita sc-89 panasonic ssmini3-f3-b code sot-490 pin name 1. gate 2. source 3. drain + 85 ?c operating ambient temperature topr -40 to 1 (g) 2 (s) (d) 3 1.6 1.6 0.7 0.85 0.13 0.26 (0.5) 1.0 12 3 (0.5) doc no. tt4 -ea-12654 revision . 3 established : 2010-06-30 revised 2013-08-28
measuring methods are based on japanese industrial standard jis c 7030 measuring methods for transistors. *1 turn-on and turn-off test circuit page note) 1. ? electrical characteristics ta = 25 ?? c ? 3 ?? c parameter symbol drain-source cutoff current drain-source breakdown voltage vdss idss unit conditions min typ max product standards mos fet FK3906010L 2of5 ? a vgs = ? 10 v, vds = 0 id = 1.0 ? a, vds = 3.0 v id = 10 ma, vgs = 2.5 v 1.0 2. input capacitance output capacitance reverse transfer capacitance turn-on time *1 v id = 1 ma, vgs = 0 60 vds = 60 v, vgs = 0 toff gate-source cutoff current gate threshold voltage drain-source on resistance forward transfer admittance turn-off time *1 igss vth rds(on) |yfs| vds = 3 v, vgs = 0, f = 1 mhz vdd = 3 v, vgs = 0 to 3 v, coss crss ton ciss id = 10 ma 0.9 20 id = 10 ma, vgs = 4.0 v id = 10 ma, vds = 3.0 v 1.2 8 6 60 12 7 ? 10 1.5 15 12 3 100 100 id = 10 ma vdd = 3 v, vgs = 3 to 0 v, ? a v ? ? ns ns ms pf pf pf 50 vdd=3v vin vgs=03v id=10ma rl=300 vout d s g 50 vdd=3v vin vgs=03v id=10ma rl=300 vout d s g 10% 90% 10% 90% v gs v out ton toff doc no. tt4 -ea-12654 revision . 3 established : 2010-06-30 revised 2013-08-28
page product standards vds - vgs rds(on) - id id - vds id - vgs capacitance - vds FK3906010L mos fet 3of5 0 0.05 0.1 0 0.2 0.4 0.6 0.8 1 1.2 drain-source voltage vds (v) drain current id (a) 4.0 v 2.5 v 2.0 v vgs = 1.5 v 1 10 100 0.1 1 10 100 drain-source voltage vds (v) capacitance c (pf) ciss coss crss 0 0.05 0.1 0.15 0.2 0.25 0.3 23456 gate-source voltage vgs (v) drain-source voltage vds (v) id = 20.0 ma 10.0 ma 5.0 ma 1 10 1 10 100 drain current id (ma) drain-source on-state resistance rds(on) ( ? ) vgs = 4.0 v 2.5 v 0 0.05 0.1 0123 gate-source voltage vgs (v) drain current id (a) 25 ta = 85 -40 doc no. tt4 -ea-12654 revision . 3 established : 2010-06-30 revised 2013-08-28
page of 54 pd - ta rth -tsw safe operating area vth - ta rds(on) - ta FK3906010L mos fet product standards 0 0.05 0.1 0.15 0 50 100 150 temperature ta ( ? c) total power dissipation pd (w) 1 10 100 1000 0.01 0.1 1 10 100 1000 pulse width tsw (s) thermal resistance rth ( ? c/w) 0 0.5 1 1.5 2 2.5 -50 0 50 100 150 temperature ( ) gate-source threshold voltage vth (v) 0 2 4 6 8 10 12 -50 0 50 100 150 temperature ( ) drain-source on-resistance rds(on) ( ? ) vgs = 2.5v 4.0 v 0.0001 0.001 0.01 0.1 1 10 0.01 0.1 1 10 100 drain-source voltage vds (v) drain current ids (a) operation in this area is limited by rds(on) ta=25 , glass epoxy board (25.425.4t0.8mm) coated with copper foil, which has more than 1 ms 10 ms 100 ms 1 s dc idp = 0.2 a doc no. tt4 -ea-12654 revision . 3 established : 2010-06-30 revised 2013-08-28
page ssmini3-f3-b unit : mm product standards mos fet FK3906010L 5of5 ? land pattern (reference) (unit : mm) 0.26 +0.05 -0.02 1.60 0.05 0.85 +0.05 -0.03 0.13 +0.05 -0.02 0 to 0.1 1.00 0.05 1.60 +0.05 -0.03 0.375 0.050 (0.5) (0.5) 0.70 +0.05 -0.03 (0.45) (5) (5) 12 3 0.6 1.0 0.6 1.4 doc no. tt4 -ea-12654 revision . 3 established : 2010-06-30 revised 2013-08-28
request for your special attention and precautions in using the technical information and semiconductors described in this book (1) if any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) t he technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. no license is granted in and to any intellectual property right or other right owned by panasonic corporation or any other company. therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) the products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. it is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) the products and product specifications described in this book are subject to change without notice for modification and/or im- provement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (esd, eos, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) this book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202
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