JBTC94B12-AS 2011-05-17 1 3 6 2 1 5 4 amp. Sadc vdd gnd mic in clk data l/r clk index (1pin) toshiba cmos digital integrat ed circuit silicon monolithic JBTC94B12-AS microphone amplifier + 4 th delta-sigma adc for digital ecm the JBTC94B12-AS is developed for ecm (electret condenser microphone) ic. it is built in a microphone amplifier and a 4 th delta-sigma adc. feature ? excellent noise characteristic vno = -91.5dbfs typ. ? built-in a sleep mode ? supply current iddq = 7 a typ. idd = 470 a typ. ? operating supply vo ltage range : ta=25 vdd(opr)= 1.64 3.65v block diagram some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purpose. s-xfbga6-0102-0.50-001 weight : 0.64mg (typ.) marking x y y z z b 1 2 x : one digit of year yy : weekly code zz : lot code b12 : type no.
JBTC94B12-AS 2011-05-17 2 pin assignment top view (the bump is reverse side.) pin function functional description timing charts may be simplifi ed for explanatory purpose. no. name i/o function note 1 clk i clock input ? 2 gnd - gnd ? 3 data o output from pdm data ? 4 vdd - power supply ? 5 mic in i input to microphone amplifier ? 6 l/r i channel selection h level : data2 output l level : data1 output ?
JBTC94B12-AS 2011-05-17 3 absolute maximum ratings ( unless otherwise specified, referred to gnd, ta = 25c characteristics symbol rating unit note supply voltage vdd -0.3 3.8 v ? applied voltage of mic in pin v(mic) -0.3 3.8 v ? applied voltage of clk pin v(clk) -0.3 3.8 v ? applied voltage of l/r pin v(l/r) -0.3 3.8 v ? operating temperature t opr -30 to 85 c ? storage temperature t stg ? 55 to 150 c ? the absolute maximum ratings of a semiconductor device ar e a set of specified parame ter values, which must not be exceeded during operatio n, even for an instant. if any of these rating would be exc eeded during operation, the device el ectrical may be irreparably altered. moreover, these operations with exceeded ratings may ca use break down, damage and/or degradation to any other equipment. applications using the device should be designed such that each maximum rating will never be exceeded in any operating conditions. before using, creating and/or producin g designs refer to and comply with the precautions and conditions set forth in these documents. operating conditions ( unless otherwi se specified, referred to gnd, ta = 25c characteristics symbol min. typ. max. unit operating voltage vdd( opr) 1.64 1.8 3.65 v clock frequency fclk 1 2.4 3.25 mhz clock duty clk(duty) 40 50 60 % output of data level ?low level? vth(l) -0.3 ? 0.35*vdd v output of data level ?high level? vth(h) 0.65* vdd - vdd+ 0.3v v
JBTC94B12-AS 2011-05-17 4 electrical characteristics ( unless otherwise specified, vdd=1.8v, fclk=2.4mhz, f=1khz, referred to gnd, ta = 25c characteristics symbol test condition min. typ. max. unit sleep mode supply current iddq fclk Q1khz - 7 20 a supply current idd non-load - 470 550 a voltage gain gv vin=10mvrms 14.5 15.5 16.5 db frequency response 1 Sf(res) vin=94dbspl f=20hz 20khz 0db : output level of f=1khz - +0.3 - db thd+n(1) vin=20mvrms - 0.2 (1) % thd+n(2) vin=112mvrms - 0.9 (5) % total harmonic distortion thd+n(3) vin=200mvrms - 1.2 (10) % output of digital noise level vno a-weight - -91.5 -89.5 dbfs ripple rejection ratio rr fr=217hz(square wave), vr=100mvp-p - -72 (-70) dbfs load capacitance cl(max) - - (100) pf wake-up time tstart sleep mode operation mode - - (10) ms fall-asleep time tsleep operation mode sleep mode - - (10) ms note : ( ) tested by internal verification
JBTC94B12-AS 2011-05-17 5 dimensions unit mm s-xfbga6-0102-0.50-001
JBTC94B12-AS 2011-05-17 6 ? use an appropriate power supply fuse to ensure that a lar ge current does not continuously flow in case of over current and/or ic failure. the ic will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. to minimize the effects of the flow of a large current in case of breakdown, appropriate settings , such as fuse capacity, fusing time and insertion circuit location, are required. ? if your design includes an inductive load such as a moto r coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power on or the negative current resulting from the back electromotive force at powe r off. for details on how to connect a protection circuit such as a current lim iting resistor or back electromotive forc e adsorption diode, refer to individual ic datasheets or the ic databook. ic breakdown may cause injury, smoke or ignition. ? carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, powe r amp and regulator. if there is a lar ge amount of leakage current such as input or negative feedback condenser, the ic output dc voltage will increase. if this output voltage is connected to a speaker with low input withstand voltage, overcurrent or ic failure can cause smoke or ignition. (the over current can cause smoke or ignition from the ic itself.) in particular, please pay attention when using a bridge tied load (btl) connection type ic that inputs output dc voltage to a speaker directly. ?
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and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) eval uating and determining the applicability of any info rmation contained in this document, or in c harts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operatin g parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic s ignaling equipment, equipment used to control combustions or explosions, safety dev ices, elevators and escalato rs, devices related to el ectric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in thi s document. ? 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