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  NJL6170R/6171r -1- pin photo diode general description the NJL6170R/6171r are the 6-divided pin photo diode, which used in cd audio player. it shrinks the outline by cobp (chip on board package), and attain under half package volume compared with lead frame type. features ? miniature, thin type (2.5mmx3.0mmx1.16mm) applications ? cd audio player etc. absolute maximum ratings (ta=25 c) parameter symbol ratings unit reverse voltage operating temperature storage temperature reflow soldering temperature v r t opr t stg t sol 30 -30 to +85 -40 to +100 260 (10sec.) v c c c electro-optical characteristics (ta=25 c) parameter symbol test condition min typ max unit reverse voltage dark current capacitance short circuit current sensitivity response time peak wavelength forward voltage v r i d c t isc s tr,tf p v f i r =10 a v r =15v v r =15v, f=1mhz ev=1000lx =780nm v r =15v, rl=180 ? ? i f =1ma * 1, 2 * 2 * 1 * 2 * 1 * 2 * 1 * 1, 2 * 2 * 1 * 1, 2 * 1, 2 30 ? ? ? ? 17 110 ? ? ? ? ? ? ? ? 2 3 ? ? 0.5 100 200 800 ? ? 0.2 0.3 ? ? 53 330 ? ? ? ? 1.7 v na na pf pf na na a/w ns ns nm v * see pattern segment no.
NJL6170R/6171r - 2 - outline (typ.) unit : mm NJL6170R njl6171r pattern segment no. 1 e, f 2 a, b, c, d pattern segment no. 1 e, f 2 a, b, c, d cathode anode nc anode cathode anode nc anode
NJL6170R / 6171r - 3 - 50% 60% 70% 80% 90% 100% 110% 120% 130% 140% 150% -40-20 0 20406080100 ambient temperature ta(c) relative sensitivity (%) typical characteristics relative sensitivity vs. illuminance (ta=25 c) spectral response (ta=25 c) dark current vs. temperature relative sensitivity vs. temperature rise time vs. reverse voltage (ta=25 c) fall time vs. reverse voltage (ta=25 c) 1.0.e-14 1.0.e-13 1.0.e-12 1.0.e-11 1.0.e-10 1.0.e-09 -40 -20 0 20 40 60 80 100 ambient teperature() dark currentid(a) vr=15.0v 1.00e-08 1.00e-07 1.00e-06 1.00e-05 1.00e-04 1.00e-03 0.01 0.1 1 10 100 illuminance (mw/cm2) light current il( ) vr=15.0v, =780nm vr=15.0v, =780nm 0 100 200 300 400 500 0123456789101112131415 reverse voltage vr(v) rise time tr(ns) pd : a to 0 100 200 300 400 500 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 reverse voltage vr(v) fall time tf(ns) pd : a to d pd : e , f 0 10 20 30 40 50 60 70 80 90 100 500 600 700 800 900 1000 1100 wavelength (nm) relative sensitivity (%)
NJL6170R/6171r - 4 - capacitance vs. reverse voltage (ta=25 c) measuring circuit for response time 0 1 2 3 4 5 0123456789101112131415 reverse voltage vr(v) capacitance cj(pf) pd : a to d pd : e , f oscillosco p e 50 lase r NJL6170R/ njl6171r pulse generato r input output 90% 10% tr tf
NJL6170R / 6171r - 5 - 250 200 150 100 50 0 precaution for handling 1. soldering to actual circuit board soldering condition - heated condition of plastic package. lower than 240 c of maximum surface temperature, less than 30 seconds of time kept higher than 200 c. soldering method 1) reflow method recommended temperature profile of its method. ? preparatory heating condition : 120 to 150 c about 60 sec. ? recommended soldering temperature : 230 to 240 c about 3 to 5 sec. ? slowly cool down right after soldering. ? soldering to be done within twice under this condition. ( c) 3 to 5 sec. 240 c max. preparatory heating less than 60 to 120 sec. 30 sec. time 2) reflow method (in case of infrared heating) - temperature profile : same to the above - avoid direct i rradiation to the plastic package because it is mold resin, absorbs the infrared radiation and its sur face temperature will be higher than lead itself. 3) the other method avoid rapid heating up like dipping the devices directly into the melting solder or vapor phase method (vps). if the device is heated to high temperature and kept in its condition for longer time, it would affect to its reliabi lity. it is necessary to solder in short time as soon as possible. 2. cleaning avoid washing of the device afte r soldering by reflow method. 3. attention in handling 1) treat not to touch the lens surface. 2) avoid dust and any other foreign material s (paint, bonding material, etc.) on the lens surface. 3) when mounting, special care has to be taken on the mounting position and tilting of the device because it is very important to place the device to the optimum position to the object. 4. storage in order to prevent from degradation of th is device in moisturing at reflow method, so that this device is contained in deaeration packaging. so that mounts the device as short as possible after opening the envelope.
NJL6170R/6171r - 6 - memo [caution] the specifications on this databook are only given for information , without any guarantee as regards either mistakes or omissions. the application circuits in this databook are described only to show representative usages of the product and not intended for the guarantee or permission of any right including the industrial rights.


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