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  1 sheet no.: d1-a00501en date: october 1, 2007 ?sharp corporation GA1A2S100SS/ga1a2s100ly GA1A2S100SS/ ga1a2s100ly opic? linear output ambient light sensor notice the content of data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the la test device specification sheets before usin g any sharp device. features 1. linear output, suitable for indoor or outdoor use 2. light sensitivity and response curve similar to that of the human eye 3. opic light detector: integrated photodiode and sig- nal processing circuit 4. lead frame packages: straight leads: GA1A2S100SS l-bend: ga1a2s100ly 5. stable over specified temperature range 6. lead-free and rohs-directive compliant agency approvals/compliance 1. compliant with rohs directive (2002/95/ec) 2. content information about the six substances specified in ?management methods for control of pollution caused by electronic information prod- ucts regulation? (popular name: china rohs) (chinese: ); refer to page 7. applications 1. auto-dimming circuits 2. office automation equipment 3. audio visual equipment 4. home appliances 5. touch panels opic is a trademark of sharp corporation.
sheet no.: d1-a00501en 2 GA1A2S100SS/ga1a2s100ly external dimensions 2-c0.5 center of light detection GA1A2S100SS 1.8 3.0 0.7 0.7 0.1 max. 0.15 (4) (4) (1.7) (2.54) (1.27) 0.2 max. resin bu rr 16.8 2.0 1.45 2.6 (4) (52) (6) (6) (6) (6) (4) 1.27 1.27 1.27 1.4 4.0 0.3 max. gate bu rr 1.4 max. resin bu rr 3 - 0.4 +0.3 -0.1 3 - 0.45 +0.3 -0.1 2 - 0.9 0.50 r0.5 1.5e.pi n 1.60 3- 0.90 2 1 1 2 v cc g n d no. name 3 i o pin arran g ement notes: 1. units: mm 2. unspecified tolerence: 0.2 mm 3. ( ): reference dimensions 4. package: transparent 5. the thin bu rr thickness (0.05 mm max.) and the gate bu rr (0.3 mm max.) are not incl u ded in o u tline dimensions 6. resin protr u sion: 1.4 mm max. ho w e v er, the thin bu rr adheres to the lead 1.4 mm max. from the resin 3
sheet no.: d1-a00501en 3 GA1A2S100SS/ga1a2s100ly 1 2 3 1 2 v cc g n d 3 i o no. name 0.87 (1.7) (6) (6) (4) (4) (4) (4) (2.54) 3.0 center of light detection 1.8 0.7 0.7 0.1 max. 2.54 3 - 1.0 1.80 2.54 2.20 1.27 pcb layo u t pattern 1.27 0.15 1.5 2 - c0.5 r0.7 r0.7 1.45 4.0 1.4 1.4 max. resin bu rr 0.3 max. gate bu rr 0.2 max. resin bu rr pin arran g ement 14.5 1.5 16.7 1.5 3 - 0.45 +0.3 -0.1 0.4 +0.30 -0.10 (3.70) 2.20 notes: 1. units: mm 2. unspecified tolerance: 0.2 mm 3. ( ): reference dimensions 4. package: transparent 5. b u rr thickness (0.05 mm max.) and gate bu rr thickness (0.3 mm max.) are not incl u ded in the o u tline dimensions. 6. resin protr u sion: 1.4 mm max. ho w e v er, the thin bu rr adheres to the lead 1.4 mm max. from the resin. ga1a2s100ly
sheet no.: d1-a00501en 4 GA1A2S100SS/ga1a2s100ly detector shape absolute maximum ratings * 1 within 5 s (max.), no closer than 1.4 mm from edge. recommended operat ing conditions parameter symbol rating unit supply voltage v cc -0.3 to +7.0 v output current i o 5ma operating temperature topr -40 to + 8 5c storage temperature tstg -40 to + 8 5c soldering temperature *1 tsol 260 c parameter symbol min. max. unit operating supply v oltage v cc 2.7 3.6 v output v oltage v out 0 v cc ? 1.0 v illuminance range e v 10 10000 lx 328 center of light detection (pdb center) pda center detector chip note: unit: m 328 88 88 pdc center (ta = 25c) (ta = 0c to 70c)
sheet no.: d1-a00501en 5 GA1A2S100SS/ga1a2s100ly electro-optical characteristics * 1 ev = illuminance by cie standard light source a (tungsten lamp). * 2 illuminance is white led. parameter symbol condition min. typ. max. unit supply current i cc e v = 1000 lx 325 500 675 a output current *1 i o 1e v = 1000 lx 312 4 8 064 8 a i o 2e v = 100 lx 31.2 4 8 64. 8 a i o 3e v = 10 lx 3.12 4. 8 6.4 8 a i o 4e v = 0 lx ? ? 1 a output current temperature coefficient *2 e v = 1000 lx ta = -20c to +60c -10 ? +10 % peak sensitivity p ?555 ? nm rise time (10% to 90%)*2 tr1 e v = 10 to 100 lx, r l = 1 k ?? 10 ms tr2 e v = 100 to 1000 lx, r l = 1 k ?? 2 ms tr3 e v = 1000 to 10000 lx, r l = 100 k ?? 500 s fall time (10% to 90%)*2 tf1 e v = 10 to 100 lx, r l = 1 k ?? 10 ms tf2 e v = 100 to 1000 lx, r l = 1 k ?? 1 ms tf3 e v = 1000 to 10000 lx, r l = 100 ?? 250 s fig. 1 output current characteristics (typ.) 10000 1000 100 o u tp u t c u rrent i o (a) ill u minance e v (lx) 10 1 1 10 100 1000 10000 100000 (ta = 25c, v cc = 3.3 v )
sheet no.: d1-a00501en 6 GA1A2S100SS/ga1a2s100ly design considerations design guidelines 1. this product is not designed to be electroma gnetic- and ionized-particle-radiation resistant. 2. sharp recommends bypass capacitors of at least 0.01 f between v cc and ground, as close as possible to the device. 3. this device contains three photodiodes and amplifies the differential of the photocurrent in each diode. sharp recommends that the light which falls on the device illuminate it as uniformly as possible. 4. for the most reliable sensing, sharp recommends guarding the device from stray incident light. manufacturing guidelines soldering instructions 1. sharp does not recommend soldering this part using methods that include preheat or solder reflow. 2. when mounting, care should be taken to avoid boundary exfoliation (pad lifting) between the solder and the cir- cuit board. 3. if hand soldering, use temperatures 260c for 5 seconds. 4. do not subject the package to excessive mechanical force during soldering as it may cause deformation or defects in plated connections. internal connections may be severed due to mechanical force placed on the pack- age due to the pcb flexing during the soldering process. cleaning instructions 1. confirm this device's resistance to process chemicals be fore use, as certain process chemicals may affect the optical characteristics. 2. solvent cleaning: solvent temperature should be 45c or below. immersion time should be 3 minutes or less. 3. ultrasonic cleaning: the effect upon devices varies d ue to cleaning bath size, ultrasonic power output, cleaning time, pcb size and device mounting circumstances. sharp recommends testing using actual production condi- tions to confirm the harmlessness of the ultrasonic cleaning methods. 4. recommended solvent materials: ethyl alcohol, methyl alcohol, and isopropyl alcohol. fig. 2 block diagram (equivalent circuit) c u rrent amp 2 ( w ith temperat u re compensation f u nction) c u rrent amp 1 v cc out g n d pd for spectral sensiti v ity compensation (pdb) main pd (pda, pdc)
sheet no.: d1-a00501en 7 GA1A2S100SS/ga1a2s100ly presence of odcs (rohs compliance) this product shall not contain the following materials, and they are not used in the production process for this product: ? regulated substances: cfcs, halon, carbon tetrachlor ide, 1,1,1-trichloroethane (methylchloroform). specific brominated flame retardants such as the pbbos and pbbs are not used in this product at all. this product shall not contain the following materials banned in the rohs directive (2002/95/ec). ? lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb), polybrominated diphenyl ethers (pbde). ? content information about the six substances specified in ?management methods for control of pollution caused by electronic informatio n products regulation? (chinese: ) note: ? indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the conc entration limit requirement as described in sj/t 11363-2006 standard. packing specifications 1. box shape and general dimensions for GA1A2S100SS conform to those shown in fig. 3, and to those shown in fig. 4 for ga1a2s100ly. 2. inner packing is as shown in the figures. 3. for GA1A2S100SS: average quantity per bag = 1000 pcs. average quantity per box = 2000 pcs. 4. for ga1a2s100ly: average quantity per sleeve = 100 pcs. average quantity per box = 2000 pcs. 5. product mass: 0.1 g (approximately) category toxic and hazdardous substances lead (pb) mercury (hg) cadmium (cd) hexavalent chromiun (cr 6+ ) polybrominated biphenyls (pbb) polybrominated diphenyl ethers (pbde) opic light sensors ??????
sheet no.: d1-a00501en 8 GA1A2S100SS/ga1a2s100ly packing specification fig. 3 GA1A2S100SS packing composition inner packin g antistatic zipper b ag w ith prod u cts (2 b ags) cellophane tape packing case model n o., q u antity, and lot n o. c u shioning material (2 sheets) antistatic zipper b ag prod u ct (1000 pieces) notes: 1. inner packing material : antistatic zipper b ag (polyethylene) 2. q u antity: 1000 pieces/ b ag notes: 1. o u ter material : packing case (corr u gated card b oard), c u shioning material (urethane), cellophane tape 2. q u antity: 2000 pieces/ b ox 3. reg u lar packaged mass: approximately 280 g 4. indication: model n o., q u antity, and lot n o. outer packin g c u shioning material (2 sheets)
sheet no.: d1-a00501en 9 GA1A2S100SS/ga1a2s100ly fig. 4 ga1a2s100ly packing composition inner packin g ga1a2s100ly ta b less stopper ta bb ed stopper slee v e slee v e (5 each in 4 ro w s) notes: 1. inner packing material: slee v e (hips), stopper (sbr) 2. q u antity: 100 pieces/slee v e outer packin g notes: 1. o u ter material: packing case (corr u gated card b oard), packing tape 2. q u antity: 2000 pieces/ b ox 3. la b el: model n u m b er, qu antity, and inspection date inspection date q u antity model n u m b er packing case packing tape
important notices the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of sharp?s devices. contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the specifications, characteristi cs, data materials, struc- ture, and other contents described herein at any time without notice in order to im prove design or reliability. manufacturing locations are also subject to change without notice. observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment (terminal) --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to en sure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliabilty such as: --- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- v arious safety devices, etc. (iii) sharp devices shall not be used for or in connec- tion with equipment that requires an extremely high level of reliability an d safety such as: --- space applications --- telecommunication equipment (trunk lines) --- nuclear power control equipment --- medical and other life support equipment (e.g. scuba) if the sharp devices listed in this publication fall within the scope of strategic products described in the foreign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp devices. this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be repro- duced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. contact and consult with a sharp representative if there are any questions about the contents of this pub- lication. sheet no.: d1-a00501en 10 GA1A2S100SS/ga1a2s100ly


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