mlx12115 13.56mhz rfid transceiver 3901012115 page 1 data sheet rev. 001 may-2008 features and benefits conforms with iso/iec 14443a (1) conforms with iso/iec 15693 compatible with tag-it? (2) transponders low external component count application examples portable data terminals access control readers contact-less payment terminals smart label printers ordering information part no. temperature suffix package code option code mlx12115 e (-40c to 85c) fr (lead free ssop20, 2 09 mils) -- 1. functional diagram microcontroller mlx12115 serial data interface tx rx impedance matching attenuation resistor analog functions digital functions 2. description the mlx12115 is an iso compliant 13.56mhz rfid transceiver integrated circuit. it can be used as a drop-in replacement of texas instruments s6700. the device supports multiple rf air interfaces, such as tag-it? (2) , iso15693 and iso14443a (1) and opens with the direct mode where data can be passed directly to a transponder. the main features include user selectable modulation depth in write mode, whereas single sub-carrier ask and fsk modulations are recognized in the read mode. its low power consumption enable design of portable and fixed reader designs requiring tight footprint constraints. the ic minimizes onboard power requirements and reduces parts count in a final reader product. with the addition of a micro-processor, crystal, and a few passive components a full functioning reader can be easily developed. it can provide up to 200 milliwatts of rf power to a 50 ohms load with a 5 volts power supply using the recommended matching network. this is suitable for most short to mid range applications. a simplified antenna and matching network can be used, at the expense of a reduced reading range, for example in hand-held reader applications. the chip is configured with a serial interface. a synchronization signal is available when the majority voting is used. (1) purchase of mlx12115s doesnt imply any grant of any iso14443a license. customers are advised to sign pa tent licensing agreements with all third parties, especially those companies listed in the introduction of the corres ponding standard. (2) purchase of mlx12115s doesnt imply any grant of any tag-it? license. customers are advised to sign pat ent licensing agreements with texas instruments. tag-it? is a tra demark of texas instruments incorporated
mlx12115 13.56mhz rfid transceiver 3901012115 page 2 data sheet rev. 001 may-2008 table of contents 1. functional diagram................................. ................................................... ............................... 1-1 2. description........................................ ................................................... ......................................... 2-1 3. glossary of terms .................................. ................................................... ............................... 3-3 4. absolute maximum ratings ........................... ................................................... ...................... 4-3 5. electrical specifications .......................... ................................................... ......................... 5-3 6. block diagram ...................................... ................................................... .................................... 6-6 7. pin definitions and descriptions ................... ................................................... ................... 7-6 8. esd precautions.................................... ................................................... ................................... 8-6 9. reliability information............................ ................................................... ............................. 9-7 10. package information................................ ................................................... ........................... 10-8 11. disclaimer ......................................... ................................................... ........................................ 11-9
mlx12115 13.56mhz rfid transceiver 3901012115 page 3 data sheet rev. 001 may-2008 3. glossary of terms rfid radiofrequencyidentification iso internationalorganizationforstandardization /internationalelectrotechnicalcommission. am amplitudemodulation fm frequencymodulation ask amplitudeshiftkeying fsk frequencyshiftkeying 4. absolute maximum ratings parameter symbol condition min max unit supplyvoltage(v dd with respecttov ss ) v dd dc 0.3 6 v inputvoltageonanypin(except tx) v in 0.3 v dd +0.3 v maximumpowerdissipation (withoutheatsink) p max 500 mw maximumjunctiontemperature t j +150 oc storagetemperature t stor 55 +150 oc exceeding the absolute maximum ratings may cause perm anent damage. exposure to absolute- maximum-rated conditions for extended periods may affe ct device reliability. 5. electrical specifications t a = -40 oc to +85 oc, v dd = 5volts, unless otherwise noted. on board resonator is used. general dc parameters parameter symbol test conditions min typ max units operatingsupplyvoltagerange v dd v dd withrespecttov ss 3 5 5.5 v standbycurrentconsumption i stb v dd =5.5v 1 50 m a idlemodecurrentconsumption i dle v dd =5.5vanalogsectionoff 12 15 ma operatingcurrent i op v dd =5.5v 14 19 ma transmitcurrent i tr 50ohmsload 80 120 ma
mlx12115 13.56mhz rfid transceiver 3901012115 page 4 data sheet rev. 001 may-2008 transmitter specifications parameter test conditions min typ max units peakvoltageappliedondrainofoutput transistor 32 v outputtransistorpowerdissipation 500 mw outputtransistoronresistance i d =50ma 2 5 w outputpowerforfivevoltsoperation seenote1 2 00 mw amplitudemodulationdepthadjustmentrange, in10%mode,withexternalresistorconnected betweenrmodpinandground. seenote1 0 90 % amplitudemodulationdepthin10%modewith nominalexternalresistor(10 w ) seenote1 10 12 16 % minimumdepthfor100%ask seenote1 40 db riseandfalltimefor100%ask seenote1 2.5 4 s riseandfalltimefor10%modulationdepth( nominalexternalresistorused) seenote1 1 1.5 s receiver specifications parameter test conditions min typ max units smallsignalinputimpedance(rx) 100 k w inputrfvoltagerange(rx_inCv ss ) with1k w seriesexternalresistor 1 1.84.9 vdd v receiversensitivity seenote1 40 65 dbm fskiffiltercutoffpoints 130 2001400 1800 khz gain,infskmode(fmoutput) 120 db gain,inaskmode(amoutput) 80 db serial link and digital i/o parameter symbol test conditions min typ max units outputcurrentdrive i ol v ol 0.4volt 1 ma outputvoltagelow v ol i olmax =4ma 0 0.2 0.4 v outputvoltagehigh v oh i ohmax =4ma 4.6 4.8 5 v inputvoltagehigh v ih 0.7*v dd v dd +0.3 v inputvoltagelow v il 0.3 0.3*v dd v sckfrequency f ck 1.5 mhz
mlx12115 13.56mhz rfid transceiver 3901012115 page 5 data sheet rev. 001 may-2008 crystal oscillator parameter symbol test conditions min typ max units frequencyrange f xtal isocompliantapplications 13.56 mhz startuptime t start 2 5 ms xtalseriesresistance r xtal 50 100 w external clock signal specifications (seenote2) parameter test conditions min typ max units minsinewaveamplitude,accoupled inputonpinxtal2 1 v dd v pp minsinewaveamplitude,dccoupled inputonpinxtal2 inputhastobecenteredaround vdd/2 1 v dd v pp xbuf output specifications parameter test conditions min typ max units xbuflowlevel(col) 1kloadresistor 0 0.2 0.4 v xbufhighlevel(coh) 1kloadresistor 4.6 4.8 5.0 v riseandfalltimes(10%90%) 1kloadresistor//12p f 3 ns notes 1. parameter measured using adapted output matching n etwork. 2. the external clock symmetry is of paramount importa nce. it has a direct influence on the transmitter output power. when using a sine wave as exte rnal clock input, it must not show visible distortion. in case a square wave is used, its duty cycle h as to be equal to 50%.
mlx12115 13.56mhz rfid transceiver 3901012115 page 6 data sheet rev. 001 may-2008 6. block diagram 7. pin definitions and descriptions the device is packaged in a 20 pin lead free ssop packa ge. pin number name description 1 vdd_tx transmitter power supply 2 tx_out output transistor drain connection 3 r_mod external resistor to set 10% modulation dep th mode 4 vss_tx transmitter section ground 5 xtal1 pin 1 of xtal resonator 6 xtal2 pin 2 of xtal resonator and external system clock input 7 vss_dig digital section ground 8 xtal_clk buffered output of xtal oscillator 9 nu not used (grounded for normal operation) 10 nu not used (grounded for normal operation) 11 dout data output for serial link 12 vdd_dig digital section power supply 13 din data input for serial link 14 m_err manchester protocol error flag 15 sclock serial link clock 16 nc not connected (leave open for normal operatio n) 17 vdd_rx receiver section power supply 18 nc not connected (leave open for normal operatio n) 19 vss_rx receiver section ground 1 vdd_tx 2 tx_out 3 r_mod 4 vss_tx 5 xtal1 6 xtal2 7 vss_dig 8 xtal_clk 9 nu 10 nu vss_rx 19 rx_in 20 vdd_rx 17 nc 18 nc 16 sclock 15 m_err 14 din 13 vdd_dig 12 dout 11 20 rx_in receiver input 8. esd precautions electronic semiconductor products are sensitive to elect ro static discharge (esd). always observe electro static discharge control procedure s whenever handling semiconductor products.
mlx12115 13.56mhz rfid transceiver 3901012115 page 7 data sheet rev. 001 may-2008 9. reliability information standard information regarding manufacturability of melexis products with different soldering processes our products are classified and qualified regarding so ldering technology, solderability and moisture sensitivity level according to following test methods: reflow soldering smds (s urface m ount d evices) ipc/jedec j-std-020 moisture/reflow sensitivity classification for nonherme tic solid state surface mount devices (classification reflow profiles according to table 5-2 ) eia/jedec jesd22-a113 preconditioning of nonhermetic surface mount devices p rior to reliability testing (reflow profiles according to table 2) wave soldering smds (s urface m ount d evices) and thds (t hrough h ole d evices) en60749-20 resistance of plastic- encapsulated smds to combined effect of moisture and soldering heat eia/jedec jesd22-b106 and en60749-15 resistance to soldering temperature for through-hol e mounted devices iron soldering thds (t hrough h ole d evices) en60749-15 resistance to soldering temperature for through-hol e mounted devices solderability smds (s urface m ount d evices) and thds (t hrough h ole d evices) eia/jedec jesd22-b102 and en60749-21 solderability for all soldering technologies deviating from above me ntioned standard conditions (regarding peak temperature, temperature gradient, temperature prof ile etc) additional classification and qualification t ests have to be agreed upon with melexis. the application of wave soldering for smds is allowed only after consulting melexis regarding assurance of adhesive strength between device and board. melexis is contributing to global environmental conse rvation by promoting lead free solutions. for more information on qualifications of rohs compliant products (rohs = european directive on the re striction of the use of certain hazardous substances) please visit the quality page on our website: http://www.melexis.com/quality.aspx
mlx12115 13.56mhz rfid transceiver 3901012115 page 8 data sheet rev. 001 may-2008 10. package information
mlx12115 13.56mhz rfid transceiver 3901012115 page 9 data sheet rev. 001 may-2008 11. disclaimer 1) the information included in this documentation is su bject to melexis intellectual and other property rights. reproduction of information is permissible only if the information will not be altered and is accompanied by all associated conditions, limitations a nd notices. 2) any use of the documentation without the prior wr itten consent of melexis other than the one set forth in clause 1 is an unfair and deceptive business practice . melexis is not responsible or liable for such altered documentation. 3) the information furnished by melexis in this docum entation is provided as is. except as expressly warranted in any other applicable license agreement, melexis disclaims all warranties either express, implied, statutory or otherwise including but not lim ited to the merchantability, fitness for a particular purpose, title and non-infringement with regard to t he content of this documentation. 4) notwithstanding the fact that melexis endeavors to t ake care of the concept and content of this documentation, it may include technical or factual in accuracies or typographical errors. melexis disclaims any responsibility in connection herewith. 5) melexis reserves the right to change the documenta tion, the specifications and prices at any time and without notice. therefore, prior to designing this pr oduct into a system, it is necessary to check with melexis for current information. 6) melexis shall not be liable to recipient or any third party for any damages, including but not limit ed to personal injury, property damage, loss of profits, l oss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the information in this document ation. 7) the product described in this documentation is intend ed for use in normal commercial applications. applications requiring operation beyond ranges specif ied in this documentation, unusual environmental requirements, or high reliability appl ications, such as military, medical life-support or life-sustaining equipment are specifically not recommen ded without additional processing by melexis for each application. 8) any supply of products by melexis will be governed b y the melexis terms of sale, published on www.melexis.com . ? melexis nv. all rights reserved. for the latest version of this document, go to our web site at: www.melexis.com or for additional information contact melexis direct: europe, africa: americas: asia: phone: +32 1367 0495 phone: +1 603 223 2362 phone: +32 1367 0495 e-mail: sales_europe@melexis.com e-mail: sales_usa@melexis.com e-mail: sales_asia@melexis.com iso/ts 16949 and iso14001 certified
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