features low profile space ideal for automated placement glass passivated chip junctions low forward voltage drop low leakage current high forward surge capability high temperature soldering 260 /10 seconds at terminals component in accordance to rohs 2002/95/1 and weee 2002/96/ec mechanical date case: jedec sod-123fl molded plastic body over glass passivated chip terminals: solder plated, solderable per j-std-002b and jesd22-b102d polarity: laser band denotes cathode end maximum ratings & thermal characteristics & electrical characteristics (ta = 25 c unless otherwise noted) symboldfr1adfr1bdfr1ddfr1gDFR1Jdfr1kdfr1munit v rrm 50 100 200 400 600 800 1000 v v rms 35 70 140 280 420 560 700 v v dc 50 100 200 400 600 800 1000 v i f(av) a i fsm a v f v i r a t rr 250 ns c j p f t j , t stg operating junction and storage temperature range C55 to +150 maximum reverse recovery time at i f = 0.5 a , i r = 1.0 a , i rr = 0.25 a 150 500 typical junction capacitance at 4.0 v ,1mhz 15 maximum instantaneous forwad voltage at 1.0a 1.3 maximum dc reverse current t a = 25 at rated dc blocking voltage t a = 100 5.0 50 maximum average forward rectified current 1 peak forward surge current 8.3 ms single half sine-wave superimposed on rated load 25 maximum repetitive peak reverse voltage maximum rms voltage maximum dc blocking voltage dfr1a-dfr1m surface mount fast recovery rectifiers http://www.luguang.cn mail:lge@luguang.cn 1. 0 0. 2 2. 8 0. 1 1. 9 0. 1 c at h ode b a nd t op v i ew 3. 7 0. 2 0. 6 0. 25 1. 4 0 . 15 0. 10- 0. 30 sod-123fl dimensions in millimeters
characteristic curves (t a =25 unless otherwise noted) dfr1a-dfr1m surface mount fast recovery rectifiers http://www.luguang.cn mail:lge@luguang.cn
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