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  1 data sheet ! note: 1. this datasheet is downloaded from the website of murata manufacturing co., ltd. therefore, it?s speci? cations are subject to change or our products in it may be discontinued without advance notice. please check with our sales representatives or product engineers before ordering. 2. this datasheet has only typical speci? cations because there is no space for detailed speci? cations. therefore, please approve our product speci? cations or transact the approval sheet for product speci? cations before ordering. http://www.murata.com/ 1 noise suppression products/emi suppression filters > emifil r (capacitor type) > single circuit type for large current 2012.9.6 o this data sheet is applied for chip emifil r used for general electronics equipment for your design. emifil r (capacitor type) single circuit type for large current nfm18ps series (0603 size) c dimensions 1.60.1 0.40.1 0.60.1 0.8 0.80.1 (2) (1) (3) (2) 0.15 +0.2 C0.1 0.15 +0.2 C0.1 +0.2 C0.1 0.2 min. (in mm) : electrode c insertion loss characteristics (main items) frequency (mhz) 0.1 1 10 100 1000 6000 100 60 80 40 20 0 (50 - 50 ) insertion loss (db) nfm18ps474r0j3 nfm18ps105r0j3 c equivalent circuit input (output) (1) output (input) (3) (2) gnd no polarity. c packaging code packaging minimum quantity d 180mm paper tape 4000 b bulk(bag) 500 c rated value ( p : packaging code) part number capacitance rated current rated voltage insulation resistance (min.) operating temperature range nfm18ps474r0j3 p 0.47f 20% 2a 6.3vdc 1000m ohm -55 to +125c nfm18ps105r0j3 p 1.0f 20% 2a 6.3vdc 500m ohm -55 to +105c number of circuit: 1 c ! caution/notice ! caution (rating) do not use products beyond the rated current and rated voltage as this may create excessive heat and deteriorate the insulation resistance. notice solderability of tin plating termination chip might be deteriorated when low temperature soldering pro? le where peak solder temperature is below the tin melting point is used. please con? rm the solderability of tin plating termination chip before use.


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