1/5 STPS1L60/a november 2002 - ed: 4a power schottky rectifier ? axial and surface mount power schottky rectifier suited for switch mode power supplies and high frequency dc to dc converters. packaged in do-41 and sma, this device is intended for use in low voltage, high frequency inverters and small battery chargers. description n negligible switching losses n low forward voltage drop features and benefits symbol parameter value unit v rrm repetitive peak reverse voltage 60 v i f(rms) rms forward current 10 a i f(av) average forward current t l = 130c d = 0.5 sma 1a t l = 120c d = 0.5 do-41 i fsm surge non repetitive forward current tp = 10 ms sinusoidal 40 a t stg storage temperature range - 65 to + 150 c t j maximum junction temperature * 150 c dv/dt critical rate of rise of reverse voltage 10000 v/ m s absolute ratings (limiting values) i f(av) 1a v rrm 60 v tj (max) 150c v f (max) 0.56 v main product characteristics do-41 STPS1L60 *: dptot dtj rth j a < - 1 () thermal runaway condition for a diode on its own heatsink sma STPS1L60a
STPS1L60/a 2/5 symbol parameter value unit r th(j-a) junction to ambient lead length = 10 mm do-41 100 c/w sma 120 r th(j-l) junction to leads lead length = 10 mm do-41 45 sma 30 thermal resistances symbol parameter tests conditions min. typ. max. unit i r * reverse leakage current t j = 25c v r = 60v 50 m a t j = 100c 1.5 5 ma v f * forward voltage drop t j = 25c i f =1a 0.57 v t j = 100c 0.56 t j = 125c 0.5 0.54 t j = 25c i f =2a 0.75 t j = 100c 0.68 t j = 125c 0.6 0.66 pulse test : * tp = 380 m s, d <2% to evaluate the maximum conduction losses use the following equation: p=0.44xi f(av) +0.12xi f 2 (rms) static electrical characteristics p (w) f(av) d = 1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0.0 0.2 0.4 0.6 0.8 d = 0.05 d = 0.5 d = 0.1 d = 0.2 t d =tp/t tp i (a) f(av) fig. 1: average forward power dissipation versus average forward current. i (a) f(av) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 25 50 75 100 125 150 t (c) amb r=r th(j-a) th(j-i) r =100c/w th(j-a) do-41 sma r =120c/w th(j-a) t d =tp/t tp fig. 2: average forward current versus ambient temperature ( d = 0.5). i (a) m 0 1 2 3 4 5 6 7 8 1.e-03 1.e-02 1.e-01 1.e+00 i m t d =0.5 t(s) t =100c a t =25c a t =50c a fig. 3-1: non repetitive surge peak forward current versus overload duration (maximum values) (do-41). 0 1 2 3 4 5 6 7 8 1.e-03 1.e-02 1.e-01 1.e+00 i (a) m i m t d =0.5 t(s) t =100c a t =25c a t =50c a fig. 3-2: non repetitive surge peak forward current versus overload duration (maximum values) (sma).
STPS1L60/a 3/5 z/r th(j-a) th(j-a) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 d = 0.5 d = 0.2 d = 0.1 single pulse t (s) p t d =tp/t tp fig. 4-1: relative variation of thermal impedance junction to ambient versus pulse duration (do-41). z/r th(j-a) th(j-a) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 d = 0.5 d = 0.2 d = 0.1 single pulse t (s) p t d =tp/t tp fig. 4-2: relative variation of thermal impedance junction to ambient versus pulse duration (sma). i (ma) r 0 5 10 15 20 25 30 35 40 45 50 55 60 1e-4 1e-3 1e-2 1e-1 1e+0 1e+1 v (v) r t =125c j t =100c j t =25c j fig. 5: reverse leakage current versus reverse voltage applied (typical values). c(pf) 1 10 100 10 20 50 100 200 v (v) r f=1mhz t =25c j fig. 6: junction capacitance versus reverse voltage applied (typical values). i (a) fm 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 v (v) fm t =100c j t =25c j fig. 7-1: forward voltage drop versus forward current (low level, maximum values) (do-41). i (a) fm 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 1 2 5 10 v (v) fm t =25c j t =100c j fig. 7-2: forward voltage drop versus forward current (high level, maximum values) (sma).
STPS1L60/a 4/5 package mechanical data sma (jedec do-214ac) e c l e1 d a1 a2 b 2.40 1.65 1.45 1.45 foot print dimensions (in millimeters) ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.70 0.075 0.106 a2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.41 0.006 0.016 e 4.80 5.60 0.189 0.220 e1 3.95 4.60 0.156 0.181 d 2.25 2.95 0.089 0.116 r (c/w) th(j-) 012345 0 20 40 60 80 100 120 140 s(cu)(cm2) fig. 8: thermal resistance junction to ambient versus copper surface under each lead (epoxy printed circuit board fr4, cu: 35m) (sma). 0 20 40 60 80 100 120 5 10152025 r (c/w) th l (mm) leads r th(j-a) r th(j-i) fig. 9: thermal resistance versus lead length (do-41).
STPS1L60/a 5/5 information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap- proval of stmicroelectronics. the st logo is a registered trademark of stmicroelectronics ? 2002 stmicroelectronics - printed in italy - all rights reserved. stmicroelectronics group of companies australia - brazil - canada - china - finland - france - germany hong kong - india - israel - italy - japan - malaysia - malta - morocco - singapore spain - sweden - switzerland - united kingdom - united states. http://www.st.com ordering type marking package weight base qty delivery mode STPS1L60 partnumber cathode ring do-41 0.34g 2000 ammopack STPS1L60rl partnumber cathode ring do-41 0.34g 5000 tape & reel STPS1L60a gb6 sma 0.068 g 5000 tape & reel n epoxy meets ul94,v0 package mechanical data do-41 plastic ca b o / o / d o / d c ref. dimensions millimeters inches min. max. min. max. a 4.07 5.20 0.160 0.205 b 2.04 2.71 0.080 0.107 c 28 1.102
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