maf00023dem mn103sb9 series type mn103sb9n MN103SFB9R internal rom type mask rom flash rom (byte) 512k 1024k ram (byte) 32k package (lead-free) tqfp128-p-1414a minimum instruction execution time 16.7 ns (at 2.7 v to 3.6 v, 60 mhz) ? interrupts reset. irq 9 . nmi. timer 28. i 2 c 3. sif 10 . dma 12 . wdt. a/d. time base timer 2. system error ? timer counter 8-bit timer 10 reload-down count. cascade connection possible (usable as a 16-bit to 32-bit timer) 16-bit timer 6 up-down count. input capture. pwm output. compare/capture register 2 channnels time base timer 1 watchdog timer 1 ? serial interface uart/synchronous/multi-master i 2 c interface selective 3 uart/synchronous interface selective 2 ? dma controller number of channels: 4 channels unit of transfer: 8/16/32 bits maximum transfer cycles: 65535 starting factor: external interrupt. timer. serial transmission/reception. a/d conversion ?nish. i 2 c transmission/reception. external transmission request. software transfer method: 2-bus cycle transfer adressing modes: fixed. increment. decrement transfer mode: word transfer. burst transfer. intermittent transfer ? extended calculation multiply and accumulate arithmetic. multiplication. saturated arithmetic ? i/o pins i/o 104 : common use ? a/d converter 10-bit 12 channels ? rom correction 8 channels ? electrical charactreistics (a/d converter characteristics) parameter symbol condition limit unit min typ max resolution 10 bits non-linear error avdd = 3.3 v. vss = 0 v 4 lsb differential non-linearity error 4 lsb
maf00023dem mn103sb9n, MN103SFB9R ? pin assignment tqfp128-p-1414a pd 6 p00, nmir q p01, irq8 p02, sbi3 p03, sbo3 p04, sbt3 p05, sbi2 p06, sbo2, sda2 p07, sbt2, scl2 ocd_scl, p3 6 ocd_sda, p3 7 p30, wdovf , cksel1 p31, cksel 0 p10, an0, sbi0 p1 1, an1, sbo0, sda0 p12, an2, sbt0, scl0 vs s p13, an 3 vddi p14, an4, sbi1 p15, an5, sbo1, sda1 p16, an6, sbt1, scl1 p17, an 7 p20, an8, sbi4 p21, an9, sbo4 p22, an10, sbt4 p23, an 11 p24, da 0 p25, da 1 p26, adtr g av dd p3 2 nrst vs s p6 6 vddi p6 5 p6 4 p6 3 p6 2 p6 1 p6 0 p57, irq7 p56, irq6 p55, irq5 p54, irq4 p5 3 p5 2 p5 1 p5 0 vdd3 p4 7 p4 6 p4 5 p4 4 p4 3 p4 2 p4 1 p4 0 memmod mo d tmod p3 5 p3 4 p9 6 p9 5 p9 4 p9 3 p9 2 p9 1 p9 0 p8 7 p8 6 p8 5 vss p8 4 p8 3 p8 2 p8 1 p8 0 p7 1 p7 2 p7 3 p7 4 vddi p70, sysclk vss osco osci lon vout , vddi vdd 3 xo xi, p7 5 p3 3 p6 7 p9 7 pa 0 pa 1 pa 2 pa 3 pa 4 pa 5 pa 6, dreq 0 pa 7, dreq 1 vdd 3 pb0, irq 0 pb1, irq 1 pb2, irq 2 pb3, irq 3 pb4, tm10ioa, irq 4 pb5, tm10iob, irq 5 pb6, tm1 1ioa, irq 6 pb7, tm1 1iob, irq 7 pc0, dreq 0 pc1, dreq 1 pc2, tm12ioa pc3, tm12iob pd 0, sb i1 , tm 14 io b, tm 7i o pd 1, sb o1 , tm 15 ioa, tm 8i o, sd a1 pd 2, sb t1 , tm 15 io b, tm 9i o, sc l1 pd 3, sbi0 , tm 13 ioa, tm4i o pd 4, sb o0 , tm 13 io b, tm 5i o, sda0 pd 5, sb t0 , tm 14 ioa, tm 6i o, sc l0 vss vddi vdd 3 vdd 3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 97 98 99 100 101 102 103 104 105 106 107 108 109 11 0 111 11 2 11 3 11 4 11 5 11 6 11 7 11 8 11 9 120 121 122 123 124 125 126 127 128
request for your special attention and precautions in using the technical information and semiconductors described in this book (1) if any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) the technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. no license is granted in and to any intellectual property right or other right owned by panasonic corporation or any other company. therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) the products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod- ucts may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (4) the products and product specifications described in this book are subject to change without notice for modification and/or im- provement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (esd, eos, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) this book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20080805
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