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p data shee t thin-film chip resistors tf10 series, 1% tc25 10 ? to 1 m ? sizes 1210, 1206, 0805, 0603 and 0402 product specification ? jul 10, 2003 v.1
phycomp product specification thin-film chip resistors sizes 1210, 1206, 0 805, 0603 and 0402 tfx10 series, 1% tc25 10 ? to 1 m ? 2003 jul 10 rev.1 2 www.yageo.com features ? high precision ? high long-tem stability ? low temperature coefficient. applications ? converters ? printer equipment ? motherboards ? telecom ? consumer. quick reference data value description tf510 tf010 tf110 tf210 tf310 size code 1210 1206 0805 0603 0402 resistance range 10 ? to 1 m ? 10 ? to 1 m ? 10 ? to 1 m ? 10 ? to 332 k ? 10 ? to 100 k ? resistance tolerance and series 1%; e24 and e96 series temperature coefficient 25 10 ? 6 /k maximum dissipation at t amb = 70 c 0.25 w 0.125 w 0.125 w 0.1 w 0.0625 w maximum permissible voltage (dc or rms) 200 v 200 v 150 v 75 v 50 v climatic category (iec 60068) 55/125/56 basic specification iec 60115-8 and mil-std-202f description the resistors are constructed on a high grade ceramic body (aluminium oxide). internal metal electrodes are added at each end and connected by a resistive paste, which is applied to the top surface of the substrate. the composition of the paste is adjusted to give the approx imate resistance required and the value is trimmed to within tolerance by laser cutting of this resistive layer. the resistive layer is covered with a protective coating and printed with the resistance value. finally, the two external end terminations are added. to guarantee optimum solderability the outer layer consists of a lead-tin alloy.
phycomp product specification thin-film chip resistors sizes 1210, 1206, 0 805, 0603 and 0402 tfx10 series, 1% tc25 10 ? to 1 m ? 2003 jul 10 rev.1 3 www.yageo.com ordering information table 1 ordering code indicating resistor type and packing type size code resistance value tol. (%) paper tape on reel 12nc ordering code tf510 1210 10 ? to 1 m ? 1 5000 2390 612 7xxxx tf010 1206 10 ? to 1 m ? 1 5000 2390 611 7xxxx tf110 0805 10 ? to 1 m ? 1 5000 2390 601 7xxxx tf210 0603 10 ? to 332 k ? 1 5000 2390 604 7xxxx tf310 0402 10 ? to 100 k ? 1 10000 2390 607 7xxxx ordering code (12nc) ? the resistors have a 12-digit ordering code starting with 2390; see table 1. ? the subsequent 4 digits indicate the resistor type and packing. ? the remaining 4 digits indicate the resistance value: ? the first 3 digits indicate the resistance value. ? the last digit indicates the resistance decade in accordance with table 2. table 2 last digit of 12nc resistance decade last digit 10 ? to 97.6 ? 9 100 ? to 976 ? 1 1 k ? to 9.76 k ? 2 10 k ? to 97.6 k ? 3 100 k ? to 976 k ? 4 1 m ? 5 o rdering example the ordering code of a tf010 resistor, value 1000 ? with 1% tolerance, supplied on paper tape of 5000 units per reel is: 2390 611 71002.
phycomp product specification thin-film chip resistors sizes 1210, 1206, 0 805, 0603 and 0402 tfx10 series, 1% tc25 10 ? to 1 m ? 2003 jul 10 rev.1 4 www.yageo.com functional description product characterization standard values of nominal resistance are taken from the e24 and e96 series for resistors with a tolerance of 1%. the values of the e24 and e96 series are in accordance with ?iec publication 60063?. limiting values type limiting voltage (1) (v) limiting power (w) tf510 200 0.25 tf010 200 0.125 tf110 150 0.125 tf210 75 0.1 tf310 50 0.0625 note 1. the maximum voltage that may be continuously applied to the resistor element, see ?iec publication 60115-8? . d erating the rated power that the resistor can dissipate depends on the operating temperature; see fig.1. mlb206 70 100 55 50 t amb ( c) o (%p ) rated 0 0 50 100 125 p max fig.1 maximum dissipation (p max ) in percentage of rated power as a function of the ambient temperature (t amb ).
phycomp product specification thin-film chip resistors sizes 1210, 1206, 0 805, 0603 and 0402 tfx10 series, 1% tc25 10 ? to 1 m ? 2003 jul 10 rev.1 5 www.yageo.com t b t t t inner electrode end termination protective coat ccb633 1001 marking w l protective coat resistor layer ceramic substrate mechanical data mass per 100 units type mass (g) tf510 1.67 tf010 1 tf110 0.55 tf210 0.25 tf310 0.052 marking type e24 e96 tf510 4 digits 4 digits tf010 4 digits 4 digits tf110 4 digits 4 digits tf210 3 digits 3 digits eia-96 tf310 no marking 4-d igit m arking for values up to 97.6 ? the r is used as a decimal point. for values of 1 k ? or greater the first 3 digits apply to the resistance value and the fourth indicates the number of zeros to follow. example marking resistance 10r0 10 ? 10r2 10.2 ? 1001 1 k ? o utlines table 3 chip resistor type and relev ant physical dimensions; see fig.2 type l (mm) w (mm) t (mm) t t (mm) t b (mm) tf510 (1210) 3.1 0.1 2.6 0.1 0.55 0.1 0.50 0.2 0.5 0.2 tf010 (1206) 3.1 0.1 1.6 0.1 0.55 0.1 0.45 0.2 0.4 0.2 tf110 (0805) 2.0 0.1 1.25 0.1 0.50 0.1 0.35 0.2 0.35 0.2 tf210 (0603) 1.6 0.1 0.8 0.1 0.45 0.1 0.25 0.15 0.25 0.15 tf310 (0402) 1.0 0.1 0.50 0.05 0.30 0.05 0.20 0.1 0.25 0.1 fig.2 outlines. for dimensions see table 3.
phycomp product specification thin-film chip resistors sizes 1210, 1206, 0 805, 0603 and 0402 tfx10 series, 1% tc25 10 ? to 1 m ? 2003 jul 10 rev.1 6 www.yageo.com 3- digit marking the first 2 digits apply to the resistance value and the third indicates the number of zeros to follow. example marking resistance 120 12 ? 123 12 k ? 124 120 k ? 3- digit eia-96 marking the first 2 digits apply to the resistance value and the third character indicates the multiplier as shown in tables 4 and 5. example marking resistance 10x 12.4 ? 10c 12.4 k ? 10d 124 k ? marking of pa cking material the packing material is also marked and includes resistance value, tolerance, catalogue number, quantity, production period, batch number and source code. table 4 first two digits of the resistance code code value code value code value code value 01 100 25 178 49 316 73 562 02 102 26 182 50 324 74 576 03 105 27 187 51 332 75 590 04 107 28 191 52 340 76 604 05 110 29 196 53 348 77 619 06 113 30 200 54 357 78 634 07 115 31 205 55 365 79 649 08 118 32 210 56 374 80 665 09 121 33 215 57 383 81 681 10 124 34 221 58 392 82 698 11 127 35 226 59 402 83 715 12 130 36 232 60 412 84 732 13 133 37 237 61 422 85 750 14 137 38 243 62 432 86 768 15 140 39 249 63 442 87 787 16 143 40 255 63 453 88 806 17 147 41 261 65 464 89 825 18 150 42 267 66 475 90 845 19 154 43 274 67 487 91 866 20 158 44 280 68 499 92 887 21 162 45 287 69 511 93 909 22 165 46 294 70 523 94 931 23 169 47 301 71 536 95 953 24 174 48 309 72 549 96 976 table 5 multiplier codes code y x a b c d e f multiplier 10 ? 2 10 ? 1 1 10 10 2 10 3 10 4 10 5
phycomp product specification thin-film chip resistors sizes 1210, 1206, 0 805, 0603 and 0402 tfx10 series, 1% tc25 10 ? to 1 m ? 2003 jul 10 rev.1 7 www.yageo.com test and requirements essentially all tests are carried out in accordance with the schedule of ?iec publication 60115-8?, category 55/125/56 (rated temperature range ? 55 to + 125 c; damp heat, long term, 56 days). the testing also covers the requirements specified by eia and mil-std-202f. the tests are carried out in accordance with iec publication 60068 , ?recommended basic climatic and mechanical robustness testing procedure for electronic components? and under standard atmospheric conditions in accordance with ?iec 60068-1? , subclause 5.3. unless otherwise specified the following values apply: temperature: 15 c to 35 c relative humidity: 25% to 75% air pressure: 86 kpa to 106 kpa (860 mbar to 1060 mbar). table 6 test procedures and requirements iec 60115-8 clause iec 60068-2 test method mil-std test procedure requirements 4.4.1 visual examination no holes; clean surface; no damage 4.4.2 dimensions (outline) gauge see table 3 applied voltage ( + 0/ ? 10%): 10 ? r < 100 ? : 0.3 v 100 ? r < 1 k ? : 1 v 1 k ? r < 10 k ? : 3 v 10 k ? r < 100 k ? : 10 v 100 k ? r < 1 m ? : 25 v 4.5 resistance 1 m ? : 50 v r ? r nom : max. 1% 4.18 20 (tb) 202f method 210c resistance to soldering heat unmounted chips; 10 1 s; 260 5 c no visible damage ? r/r max.: (0.5% + 0.05 ? ) 4.17 20 (ta) 202f method 208g solderability unmounted chips completely immersed for 5 0.5 s in a solder bath at 230 5 c good tinning ( 95% covered); no damage 4.7 202f method 301 voltage proof on insulation maximum voltage (rms) during 1 minute, metal block method no breakdown or flashover 4.13 mil-r 55342d para. 4.7.5 short time overload room temperature; v = 2.5 v rated ; 5 s (voltage not more than 2 v max ); specimen stabilized at room temperature for 30 minutes ? r/r max.: (0.5% + 0.05 ? ) in table 6 the tests and requirements are listed with reference to the relevant clauses of ?iec publications 60115-8, 60068 and mil-std? ; a short description of the test procedure is also given. in some instances deviations from the iec recommendations were necessary for our method of specifying. all soldering tests are performed with mildly activated flux.
phycomp product specification thin-film chip resistors sizes 1210, 1206, 0 805, 0603 and 0402 tfx10 series, 1% tc25 10 ? to 1 m ? 2003 jul 10 rev.1 8 www.yageo.com iec 60115-8 clause iec 60068-2 test method mil-std test procedure requirements 4.33 bending resistors mounted on a 90 mm glass epoxy resin pcb (fr4); bending: 2 mm for 1210 2 mm for 1206 3 mm for 0805 3 mm for 0603 2 mm for 0402 no visible damage ? r/r max.: (0.25% + 0.05 ? ) mil-r 55342d para. 4.7.4 low temperature operation ? 65 + 0/ ? 5 c for 1 hour; loaded with v rated for 45 + 5/ ? 0 minutes on, and 15 + 5/ ? 0 minutes off; specimen stabilized at room temperature for 24 hours after test no visible damage ? r/r max.: (0.5% + 0.05 ? ) 4.19 14 (na) 202f method 107 thermal shock 2 minutes at lct and 2 minutes at uct; 5 cycles no visible damage ? r/r max.: (0.5% + 0.05 ? ) 4.25.1 202f method 108a endurance 1000 + 48/ ? 0 hours; 70 2 c; loaded with p n or v max ; 1.5 hours on, 0.5 hours off; specimen stabilized at room temperature for 1 hour min. after test ? r/r max.: (0.5% + 0.05 ? ) 4.8.4.2 202f method 304 temperature coefficient at 25/lct/25 c and 25/uct/25 c 25 10 ? 6 /k 4.6.1.1 202f method 302 insulation resistance after 1 minute, metal block method 1210: 400 v (dc) 1206: 400 v (dc) 0805: 300 v (dc) 0603: 150 v (dc) 0402: 100 v (dc) r ins min.: 10 4 m ? eia 575 3.13 leaching unmounted chips; 60 1 s; 260 5 c good tinning; no leaching eia/is 703 4.6 202f method 106 moisture resistance 65 2 c; 95 + 3/ ? 5% rh; loaded with 0.01 p n or v max for 42 damp heat cycles. (1 cycle consists of 7 steps; see fig.3) ? r/r max.: (0.5% + 0.05 ? )
phycomp product specification thin-film chip resistors sizes 1210, 1206, 0 805, 0603 and 0402 tfx10 series, 1% tc25 10 ? to 1 m ? 2003 jul 10 rev.1 9 www.yageo.com 75 initial drying 24 hours 90 ? 98% rh 80 ? 98% rh temperature tolerance 2 c (3.6 f) unless otherwise specified initial measurements as specified in 2.2 0 step1 step3 step2 prior to first cycle only step4 one cycle 24 hours; repeat as specified in 2.5 voltage applied as specified in 2.4 circulation of conditioning air shall be at a minimum cubic rate per minute equivalent to 10 times the volume of the chamber step6 step7 hbk073 step5 51015 end of final cycle; measurements as specified in 2.7 optional sub-cycle if specified (2.3); sub-cycle performed during any 5 of the first 9 cycles; humidity uncontrolled during sub-cycle 20 time [h] temperature [ c] 25 50 25 0 90 ? 98% rh 90 ? 98% rh + 10 c ( + 18 f) ? 2 c ( ? 3.6 f) 80 ? 98% rh rate of change of temperature is unspecified, however, specimens shall not be subjected to radiant heating from chamber conditioning processes fig.3 moisture resistanc e test requirements.
phycomp product specification thin-film chip resistors sizes 1210, 1206, 0 805, 0603 and 0402 tfx10 series, 1% tc25 10 ? to 1 m ? 2003 jul 10 rev.1 10 www.yageo.com mounting due to their rectangular shape and small dimensional tolerances, surface-mounted resistors are suitable for handling by automatic placement systems. footprint dimensions mbg628 e b a f c dg preferred direction during wave soldering solder land / solder paste pattern solder resist pattern occupied area tracks e available area for tracks underneath the chip fig.4 recommended footprint dimensions. for dimensions see table 7. table 7 reflow soldering; for dimensions see also fig.4 footprint dimensions (mm) type size code a b c d e f g processing remarks placement accuracy (mm) tfx310 0402 1.5 0.5 0. 5 0.6 0.1 1.9 1.0 0.15 tfx210 0603 2.1 0.5 0. 8 0.9 0.0 2.5 1.7 0.25 tfx110 0805 2.6 0.9 0.85 1.4 0.5 3.0 2.1 0.25 tfx010 1206 3.8 2.0 0. 9 1.8 1.4 4.2 2.5 0.25 tfx510 1210 3.8 2.0 0. 9 2.7 1.4 4.2 3.4 ir soldering 0.25 table 8 wave soldering; for dimensions see also fig.4 footprint dimensions (mm) type size code a b c d e f g proposed number and dimensions of dummy tracks (mm) placement accuracy (mm) tfx210 0603 2.7 0.9 0.9 0.8 0.15 3.2 1.9 1 (0.15 0.8) 0.25 tfx110 0805 3.3 1.3 1.0 1.3 0.34 3.9 2.4 1 (0.3 1.3) 0.25 tfx010 1206 4.5 2.5 1.0 1.7 1.25 3.9 2.4 3 (0.25 1.7) 0.25 tfx510 1210 5.3 2.3 1.5 2.6 1.25 6.3 4.2 3 (0.25 2.6) 0.25 chip placement can be on ceramic substrates and printed-circuit boards (pcbs). electrical connection to the circuit is by soldering. the finishing of the end terminations guarantees a reliable contact.
phycomp product specification thin-film chip resistors sizes 1210, 1206, 0 805, 0603 and 0402 tfx10 series, 1% tc25 10 ? to 1 m ? 2003 jul 10 rev.1 11 www.yageo.com soldering conditions the robust construction of chip resistors allows them to be completely immersed in a solder bath of 260 c for one minute. therefore, it is possible to mount surface- mount resistors on one side of a pcb and other components on the reverse side (mixed pcbs). surface-mount resistors are tested for solderability at 235 c during 2 seconds. the test condition for no leaching is 260 c for 60 seconds. typical examples of soldering processes that prov ide reliable joints without any damage, are given in figs 5 and 6. 0 50 100 150 200 250 300 250 200 150 100 50 0 10 s 260 c 130 c ( c) t (s) mla859 245 c 215 c 180 c 10 s 40 s 2 k/s t fig.5 infrared soldering. typical values (solid line). process limits (dotted lines).
phycomp product specification thin-film chip resistors sizes 1210, 1206, 0 805, 0603 and 0402 tfx10 series, 1% tc25 10 ? to 1 m ? 2003 jul 10 rev.1 12 www.yageo.com 0 50 100 150 200 250 300 250 200 150 100 50 0 10 s 235 c to 260 c second wave 5 k/s 2 k/s first wave 200 k/s 100 c to 130 c forced cooling 2 k/s ( c) t (s) t mla861 fig.6 double wave soldering. typical values (solid line). process limits (dotted lines). the resistors may be soldered twice in accordance with this method if desired.
phycomp product specification thin-film chip resistors sizes 1210, 1206, 0 805, 0603 and 0402 tfx10 series, 1% tc25 10 ? to 1 m ? 2003 jul 10 rev.1 13 www.yageo.com packing tape and reel specifications all tape and reel specifications are in accordance with ?iec 60286-3? . basic dimensions are given in figs 7, 8 and 9 and tables 9, and 10. peel-off force peel-off forces of both paper and blister tapes are in accordance with ?iec 60286-3? that is, at a peel-off speed of 300 10 mm/minute, 0.1 n to 1.0 n for 8 mm tape. the peel-off angle should be between 165 and 180 . paper tape specification mbg251 e f w p 2 p 0 p 1 d 0 b 0 a 0 t cover tape fig.7 paper tape. cumulative tolerance over 10 holes: 0.2 mm. bottom fixing tape thickness: 50 10 m. top fixing tape thickness : 50 10 m. for dimensions see table 9. table 9 dimensions of paper tape for relevant chip size; see fig.7 type and size code tf310 (0402) tf210 (0603) tf110 (0805) tf010 (1206) tf510 (1210) symbol size tol. size tol. size tol. size tol. size tol. unit a 0 0.65 0.1 1.10 0.1 1.65 0.1 1.90 0.1 2.80 0.1 mm b 0 1.15 0.1 1.90 0.1 2.40 0.1 3.50 0.1 3.50 0.1 mm w 8.0 0.2 8.0 0.2 8.0 0.2 8.0 0.2 8.0 0.2 mm e 1.75 0.1 1.75 0.1 1.75 0.1 1.75 0.1 1.75 0.1 mm f 3.50 0.05 3.50 0.05 3.50 0.05 3.50 0.05 3.50 0.05 mm d 0 1.5 + 0.1/ ? 0 1.5 + 0.1/ ? 0 1.50 + 0.1/ ? 0 1.5 + 0.1/ ? 0 1.5 + 0.1/ ? 0 mm p 0 4.0 0.1 4.0 0.1 4.0 0.1 4.0 0.1 4.0 0.1 mm p 1 2.0 0.05 4.0 0.05 4.0 0.05 4.0 0.05 4.0 0.05 mm p 2 2.0 0.05 2.0 0.05 2.0 0.05 2.0 0.05 2.0 0.05 mm t 0.53 0.1 0.7 0.1 0.85 0.1 0.85 0.1 0.85 0.1 mm
phycomp product specification thin-film chip resistors sizes 1210, 1206, 0 805, 0603 and 0402 tfx10 series, 1% tc25 10 ? to 1 m ? 2003 jul 10 rev.1 14 www.yageo.com tape leader/trailer specification ccb325 empty compartments with cover tape (min. 240 mm) cover tape only leader 400 mm trailer (max. 260 mm) trailer end leader end fig.8 leader/trailer tape. taping requirements resistance side facing up. component is free and not sticking to top and/or bottom tape. component should be easy to remove from the carrier tape and the chip cavity should have no mechanical damage.
phycomp product specification thin-film chip resistors sizes 1210, 1206, 0 805, 0603 and 0402 tfx10 series, 1% tc25 10 ? to 1 m ? 2003 jul 10 rev.1 15 www.yageo.com reel specification n ca w 1 w 2 hbk039 fig.9 reel. dimensions in mm. for reel dimensions see table 10. table 10 reel dimensions; see fig.9 type size code units per reel tape width (mm) a (mm) n (mm) c (mm) w 1 (mm) w 2 max. (mm) tf310 0402 10000 tf210 0603 5000 tf110 0508 5000 tf010 1206 5000 tf510 1210 5000 8 180 + 0/ ? 3 60 + 1/ ? 0 13.0 0.2 9.0 0.3 11.4 1
phycomp product specification thin-film chip resistors sizes 1210, 1206, 0 805, 0603 and 0402 tfx10 series, 1% tc25 10 ? to 1 m ? 2003 jul 10 rev.1 16 www.yageo.com revision history revision date change notification description rev.0 2001 sep 10 ebr-3240- 01177 - first issue of this specification - expansion of the thin-film low-tc product range rev.1 2003 jul 10 ? - updated company logo - marking code revised

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