hlmp-cyxx precision optical performance 5mm round warm white led lamps data sheet package dimensions features ? well defned spatial radiation pattern ? high luminous white emission ? viewing angle: 15, 23, 30 and 50 ? standof or non-standof leads description these high intensity white led lamps are based on ingan material technology. a blue led die is coated by phosphor to produce white. the typical resulting color is described by the coordi - nates x= 0.41, y = 0.39 using the cie 1931 chromaticity diagram. these t-1? lamps are untinted, non-difused, and incorporate precise optics which produce well- defned spatial radiation patterns at specifc viewing cone angle. 1.14 0.20 (0.045 0.008) 5.80 0.20 (0.228 0.008) 5.00 0.20 (0.197 0.008) 31.60 (1.244) min . 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead 2.35 (0.093) max. cathode flat dimension h: 15: 12.24 0.25mm (0.482 0.01 inches) 23: 11.95 0.25mm (0.492 0.01 inches) 30: 12.00 0.25mm (0.472 0.01 inches) 1.14 0.20 (0.045 0.008) 5.80 0.20 (0.228 0.008) 5.00 0.20 (0.197 0.008) 31.60 (1.244) min . 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead cathode flat 1.50 0.15 (0.059 0.006) dimension h package dimension a package dimension b caution: ingan devices are class 1c hbm esd sensitive per jedec standard. please observe appropriate during handling and processing. refer to application note an-1142 for additional details.
1.14 0.20 (0.045 0.008) 5.80 0.20 (0.228 0.008) 5.00 0.20 (0.197 0.008) 31.60 (1.244) min . 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead 2.35 (0.093) max. cathode flat 1.14 0.20 (0.045 0.008) 5.80 0.20 (0.228 0.008) 5.00 0.20 (0.197 0.008 ) 31.60 (1.244) min . 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008 ) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead cathode flat 1.50 0.15 (0.059 0.006) dimension h dimension h: 50: 10.91 0.25mm (0.4715 0.01 inches) note: 1. all dimensions are in millimeters/ inches. 2. epoxy meniscus may extend about 1mm (0.040) down the leads. 3. if heat sinking application is required, the terminal for heat sink is anode. package dimension c hlmp-cy46/47 package drawing package dimension d device selection guide part number typical viewing angle (?) luminous intensity (mcd) at 20ma standof package dimension min. max. hlmp-cy -wz0dd 5 5500 6000 no a hlmp-cy -wz0dd 5 5500 6000 yes b hlmp-cy 6-vy0dd 3 400 000 no a hlmp-cy 7-vy0dd 3 400 000 yes b hlmp-cy36-ux0dd 30 300 9300 no a hlmp-cy37-ux0dd 30 300 9300 yes b hlmp-cy46-tw0dd 50 500 5500 no c hlmp-cy47-tw0dd 50 500 5500 yes d tolerance for each intensity limit is 15%.
3 part numbering system absolute maximum rating t a = 25c parameter white unit dc forward current 30 ma peak forward current 00 [] ma power dissipation 6 mw reverse voltage 5 (i r = 0 a) v led junction temperature 0 c operating temperature range -40 to +85 c storage temperature range -40 to + 00 c notes: 1. derate linearly as shown in figure 2 2. duty factor 10%, frequency 1khz. 3 for long term performance with minimal light output degradation, drive current below 15ma is recommended. optical/ electrical performance at 25c parameter symbol min typ max units test condition forward voltage v f .8 3. 3.8 v i f = 0 ma reverse voltage v r 5.0 v i r = 0 a thermal resistance rf j-pin 40 ?c/w led junction to anode lead chromaticity coordinate x y 0.4 0.39 i f = 0 ma luminous efciency [3] h e 35 lm/w luminous flux/electrical power at if = 0ma notes: 1. the reverse voltage of the product is equivalent to the forward voltage of the protective chip at ir = 10 a 2. the chromaticity coordinates are derived from the cie 1931 chromaticity diagram and represent the perceived color of the device. 3. h e = f v /i f x v f where f v is the emitted luminous fux, i f is electrical forward current and v f is the forward voltage. hlmp - c y xx - x x x xx packaging option dd: ammopacks color bin selection 0: open distribution maximum intensity bin 0: no maximum intensity limit minimum intensity bin refer to device selection guide viewing angle color: y: warm white package c: 5mm round lamps 11/12: 15 package 26/27: 23 package 36/37: 30 package 46/47: 50 package
4 figure 1. relative intensity vs. wavelength figure 2. forward current vs ambient temperature figure 3. relative intensity vs forward current figure 4. chromaticity shift vs forward current 0.0 0.2 0.4 0.6 0.8 1.0 380 480 580 680 780 wavelength - nm relative intensity 0 5 10 15 20 25 30 35 0 2 0 4 0 6 0 8 0 100 t a - ambient temperature - c if max. - maximum forward current - ma figure 5. forward current vs forward voltage -0.004 -0.003 -0.002 -0.001 0 0.001 0.002 0.003 -0.006 -0.004 -0.002 0 0.002 0.004 x-coordinate y-coordinate 20ma 30ma 5ma 10ma 0 5 10 15 20 25 30 35 0 1 2 3 4 forward voltage - v forward current - ma 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 0 5 10 15 20 25 30 35 dc forward current - ma relative luminous intensity (normalized at 20 ma)
5 radiation pattern figure 6. radiation pattern for hlmp-cy11/12 figure 7. radiation pattern for hlmp-cy26/27 figure 8. radiation pattern for hlmp-cy36/37 figure 9. radiation pattern for hlmp-cy46/47 0 0.2 0.4 0.6 0.8 1 0 3 0 6 0 9 0 120 150 180 angular displacement - degrees normalized intensity 0 0.2 0.4 0.6 0.8 1 0 3 0 6 0 9 0 120 150 180 angular displacement - degrees normalized intensity 0 0.2 0.4 0.6 0.8 1 -90 -60 -30 0 3 0 6 0 9 0 angular displacement - degrees normalized intensity 0 0.2 0.4 0.6 0.8 1 -90 -60 -30 0 3 0 6 0 9 0 angular displacement - degrees normalized intensity
6 intensity bin limit table at 20ma bin intensity (mcd) at 20 ma min max t 500 300 u 300 400 v 400 5500 w 5500 700 x 700 9300 y 9300 000 z 000 6000 tolerance for each bin limit is 15% color bin limits rank chromaticity coordinates limits x 0.360 0.3988 0.38 0.3545 0.360 y 0.3850 0.46 0.3580 0.3408 0.3850 x 0.3988 0.4390 0.49 0.38 0.3988 y 0.46 0.430 0.375 0.3580 0.46 3 x 0.4390 0.4970 0.4588 0.49 0.4390 y 0.430 0.4466 0.3838 0.375 0.430 tolerance for each bin limit is 0.01 avago warm white binning on cie 1931 chromaticity diagram 0.300 0.350 0.400 0.450 0.500 0.300 0.350 0.400 0.450 0.500 0.550 x y black body bin 1 bin 2 bin 3
7 precautions: lead forming: ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering on pc board. ? for better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. ? if manual lead cutting is necessary, cut the leads after the soldering process. the solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into led package. this is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. soldering and handling: ? care must be taken during pcb assembly and soldering process to prevent damage to the led component. ? led component may be efectively hand soldered to pcb. however, it is only recommended under unavoidable circumstances such as rework. the closest manual soldering distance of the soldering heat source (soldering irons tip) to the body is 1.59mm. soldering the led using soldering iron tip closer than 1.59mm might damage the led. note: 1. pcb with diferent size and design (component density) will have diferent heat mass (heat capacity). this might cause a change in temperature experienced by the board if same wave soldering setting is used. so, it is recommended to re-calibrate the soldering profle again before loading a new type of pcb. 2. avago technologies high brightness led are using high efciency led die with single wire bond as shown below. customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250c and the solder contact time does not exceeding 3sec. over-stressing the led during soldering process might cause premature failure to the led due to delamination. avago technologies led confguration 1.59mm ? esd precaution must be properly applied on the soldering station and personnel to prevent esd damage to the led component that is esd sensitive. do refer to avago application note an 1142 for details. the soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. ? recommended soldering condition: wave soldering [1, 2] manual solder dipping pre-heat temperature 05 c max. - preheat time 60 sec max - peak temperature 50 c max. 60 c max. dwell time 3 sec max. 5 sec max note: 1) above conditions refers to measurement with thermocouple mounted at the bottom of pcb. 2) it is recommended to use only bottom preheaters in order to reduce thermal stress experienced by led. ? wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. customer is advised to perform daily check on the soldering profle to ensure that it is always conforming to recommended soldering conditions. note: electrical connection between bottom surface of led die and the lead frame is achieved through conductive paste. ? any alignment fxture that is being applied during wave soldering should be loosely ftted and should not apply weight or force on led. non metal material is recommended as it will absorb less heat during wave soldering process. ? at elevated temperature, led is more susceptible to mechanical stress. therefore, pcb must allowed to cool down to room temperature prior to handling, which includes removal of alignment fxture or pallet. ? if pcb board contains both through hole (th) led and other surface mount components, it is recommended that surface mount components be soldered on the top side of the pcb. if surface mount need to be on the bottom side, these components should be soldered using refow soldering prior to insertion the th led. ? recommended pc board plated through holes (pth) size for led component leads. led component lead size diagonal plated through hole diameter 0.45 x 0.45 mm (0.08x 0.08 inch) 0.636 mm (0.05 inch) 0.98 to .08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.00x 0.00 inch) 0.707 mm (0.08 inch) .05 to .5 mm (0.04 to 0.045 inch) ? over-sizing the pth can lead to twisted led after clinching. on the other hand under sizing the pth can cause difculty inserting the th led. ingan device anode
8 note: the ammo-packs drawing is applicable for packaging option Cdd & -zz and regardless standof or non-standof ammo packs drawing example of wave soldering temperature profle for th led 0 10 20 30 40 50 60 70 80 90 100 250 200 150 100 50 time (minutes) preheat turbulent wave laminar wave hot air knife recommended solder: sn63 (leaded solder alloy) sac305 (lead free solder alloy) flux: rosin flux solder bath temperature: 245c 5c (maximum peak temperature = 250c) dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) note: allow for board to be sufficiently cooled to room temperature before exerting mechanical force. a a 12.701.00 0.500.0394 20.501.00 0.8070.039 18.000.50 0.70870.0197 9.1250.625 0.35930.0246 12.700.30 0.500.0118 0.700.20 0.02760.0079 6.351.30 0.250.0512 ?\c7;4.000.20typ. 0.15750.008 cathode view a-a refer to application note an5334 for more information about soldering and handling of high brightness th led
9 note: for ingan device, the ammo pack packaging box contain esd logo packaging box for ammo packs packaging label (i) avago mother label: (available on packaging box of ammo pack and shipping box) ( 1 p ) i t e m : p a r t n u m b e r ( 1 t ) l o t : l o t n u m b e r l p n ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e ( p ) c u s t o m e r i t e m : ( v ) v e n d o r i d m a d e i n : c o u n t r y o f o r i g i n ( q ) q t y : q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n r e v : d e p t i d : s t a n d a r d l a b e l l s 0 0 0 2 r o h s c o m p l i a n t e 1 m a x t e m p 2 5 0 c
acronyms and defnition: bin: (i) color bin only or vf bin only (applicable for part number with color bins but without vf bin or part number with vf bins and no color bin) or (ii) color bin incorporated with vf bin (applicable for part number that have both color bin and vf bin) (ii) avago baby label (only available on bulk packaging) example: (i) color bin only or vf bin only bin: 2 (represent color bin 2 only) bin: vb (represent vf bin vb only) (ii) color bin incorporate with vf bin bin: 2vb vb: vf bin vb 2: color bin 2 only disclaimer avagos products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. p a r t # : p a r t n u m b e r l o t # : l o t n u m b e r m f g d a t e : m a n u f a c t u r i n g d a t e c / o : c o u n t r y o f o r i g i n c u s t o m e r p / n : s u p p l i e r c o d e : q u a n t i t y : p a c k i n g q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n d a t e c o d e : d a t e c o d e r o h s c o m p l i e n t e 1 m a x t e m p 2 5 0 c for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies, limited in the united states and other countries. data subject to change. copyright ? 007 avago technologies limited. all rights reserved. av0 -0 en - october , 007
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