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| semipack ? 2 rectifier diode modules skkd 212 features typical applications* ! " # $ skkd % & ' ( % & & ( ) # & ( ' + , - . / 0 % % ) # % + 1 2 1 / 3 2 4 . 5 6 + 4 7 8 0 2 , . . 2 1 . . ' 9 9 $ 1 2 1 2 1 2 : . . 2 ; . . ' 9 9 $ 1 2 1 2 ; 2 < . . 2 4 . . ' 9 9 $ 1 2 1 2 4 symbol conditions values units ) # % 3 2 4 . 5 6 + 4 7 / 2 . . 0 8 1 2 1 / 2 ; 7 0 ) # ' ( 6 + 1 7 8 5 2 . ; ; . . 6 + 2 1 7 8 5 2 . 7 7 . . = 6 + 1 7 8 5 4 > , 3 3 3 2 . 1 2 : 4 . . = 6 + 2 1 7 8 5 4 > , 3 3 3 2 . 2 7 2 1 7 . = % # 6 + 1 7 8 5 ) # + 7 . . 3 2 > - % % / 6 ? 0 6 + 2 , 7 8 3 . > : 7 % 6 6 + 2 , 7 8 3 2 > . 7 @ ) & $ 6 + 2 , 7 8 5 % & $ + % & & ( 3 < & / 0 . > 2 4 . > . < 9 a & / 0 . > 2 . > . 7 9 a 6 - . 3 3 3 b 2 , 7 8 6 - . 3 3 3 b 2 , 7 8 % 3 3 7 . " 5 3 3 3 5 2 2 3 , ; . . , . . . % c ( d 7 e 2 7 f ( 7 e 2 7 f 7 g < > 4 2 = 3 2 ; 7 ' 9 9 $ 1 , skkd 212 ... thyristor bridge,scr,bridge 1 18-06-2008 maj ? by semikron fig.11l power dissipation per diode vs.forward current fig.11r power dissipation per diode vs.ambient fig.12l power dissipation of two modules vs.direct fig.12r power dissipation of two modules vs.case fig.13l power dissipation of three modules vs.direct fig.13r power dissipation of three modules vs.case rectifier,diode,thyristor,module 2 18-06-2008 maj ? by semikron fig.14 transient thermal impedance vs.time fig.15 forward characteristics fig.16 surge overload current vs.time skkd 212 ... thyristor bridge,scr,bridge 3 18-06-2008 maj ? by semikron dimensions in mm 1 , / ' 9 9 $ 0 * the specifications of our components may not be considered as an assurance of component characteristics. components have to be tested for the respective application. adjustments may be necessary. the use of semikron products in life support appliances and systems is subject to prior specification and written approval by semikron. we therefore strongly recommend prior consultation of our personal. rectifier,diode,thyristor,module 4 18-06-2008 maj ? by semikron |
Price & Availability of SKKD212
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