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1. general description nxp?s ucode g2il series transponder ics offer leading-edge read range and support industry-first features such as a tag tamper alarm, data transfer, digital switch, and advanced privacy-protection modes. very high chip sensitivity ( ? 18 dbm) enables longer read ranges with simple, single-port antenna designs. when connected to a power supply, the read as well as the write range can be boosted to a sensitivity of ? 27 dbm. in fashion and retail the ucode g2il series improve read rates and provide for th eft deterrence. for consumer electronics the ucode g2il series is suited for device config uration, activation, production control, and pcb tagging. in authentication applications the transponders can be used to protect brands and guard against counterfeiting. th ey can also be used to tag containers, electronic vehicles, airline baggage, and more. in addition to the epc specifications the g2il offers an integrated product status flag (psf) feature and read protec tion of the memory content. on top of the g2il features the g2il+ offers an integrated tag tamper alarm, digital switch, external supply mode, read range reduction and data transfer mode. 2. features and benefits 2.1 key features ? uhf rfid gen2 tag chip according epcgl obal v1.2.0 with 128 bit epc memory ? memory read protection ? integrated product status flag (psf) ? tag tamper alarm ? digital switch ? data transfer mode ? real read range reduction (privacy mode) ? external supply mode 2.1.1 memory ? 128-bit of epc memory ? 64-bit tag identifier (tid) including 32 -bit factory locked unique serial number ? 32-bit kill password to permanently disable the tag ? 32-bit access password to allow a transition into the secured state ? data retention: 20 years sl3s1203_1213 ucode g2il and g2il+ rev. 3.6 ? 3 august 2011 178836 product data sheet company public
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 2 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ ? broad international operating frequency: from 840 mhz to 960 mhz ? long read/write ranges due to extremely low power design ? reliable operation of multiple ta gs due to advanced anti-collision ? read protection ? write lock ? wide specified temperature range: ? 40 ? c up to +85 ? c 2.2 key benefits 2.2.1 end user benefit ? prevention of unauthorized memory access through read protection ? indication of tag tampering attempt by use of the tag tamper alarm feature ? electronic device configuration and / or activa tion by the use of the digital switch / data transfer mode ? theft deterrence supported by the psf feature (psf alarm or epc code) ? small label sizes, long read ranges due to high chip sensitivity ? product identification through unalterable ex tended tid range, including a 32-bit serial number ? reliable operation in dense reader and noisy environments through high interference suppression 2.2.2 antenna design benefits ? high sensitivity enables small and cost efficient antenna designs ? low q-value eases broad band antenna design for global usage 2.2.3 label manufacturer benefit ? consistent performance on different materials due to low q-factor ? ease of assembly and high assembly yiel ds through large chip input capacitance ? fast first write of t he epc memory for fast label initialization 2.3 custom commands ? psf alarm built-in psf (product status flag), enables the uhf rfid tag to be used as eas tag (electronic article surve illance) tag without the nee d for a back-end data base. ? read protect protects all memory content including crc16 from unauthorized reading. ? changeconfig configures the additional features of the chip like external supply mode, tamper alarm, digital switch, read range reduction or data transfer. the ucode g2il is equipped with a numb er of additional features and custom commands. nevertheless, the chip is designed in a way standard epcglobal read/write/access commands c an be used to operate th e features. no custom commands are needed to take advantage of all the features in case of unlocked epc memory.
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 3 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ 3. applications 3.1 markets ? fashion (apparel and footwear) ? retail ? electronics ? fast moving consumer goods ? asset management ? electronic vehicle identification 3.2 applications ? supply chain management ? item level tagging ? pallet and case tracking ? container identification ? product authentication ? pcb tagging ? cost efficient, low level seals ? wireless firmware download ? wireless product activation 4. ordering information [1] also available in 25 wafer shipping box. [2] fcs2 polymer strap, jedec outline standard copper [3] fcs2 polymer strap, jedec outline standard aluminum table 1. ordering information type number package name ic type description version sl3s1203fuf wafer g2il bumped die on sawn 8? 75 ? m wafer not applicable SL3S1213FUF wafer g2il+ bumped die on sawn 8? 75 ? m wafer not applicable sl3s1203fud/bg [1] wafer g2il bumped die on sawn 8? 120 ? m wafer, 7 ? m polyimide spacer not applicable sl3s1213fud/bg wafer g2il+ bumped die on sawn 8? 120 ? m wafer, 7 ? m polyimide spacer not applicable sl3s1203ftb0 xson6 g2il plastic extremely thin small outline package; no leads; 6 terminals; body 1 ? 1.45 ? 0.5 mm sot886f1 sl3s1213ftb0 xson6 g2il+ plastic extrem ely thin small outline package; no leads; 6 terminals; body 1 ? 1.45 ? 0.5 mm sot886f1 sl3s1203ac0 fcs2 [2] g2il plastic flip chip strap package copper; 2 leads, 9 mm wide tape sot1040-1 sl3s1203ac2 fcs2 [3] g2il plastic flip chip strap package aluminium; 2 leads; 9 mm wide tape sot1040-1
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 4 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ 5. marking 6. block diagram the sl3s12x3 ic consists of three major blocks: - analog interface - digital control - eeprom the analog part provides stable supply voltage and demodulates data received from the reader for being processed by the digital pa rt. further, the modulation transistor of the analog part transmits data back to the reader. the digital section includes the state mach ines, processes the protocol and handles communication with the eeprom, which contains the epc and the user data. table 2. marking codes type number marking code comment version sl3s1203ftb0 un ucode g2il sot886 sl3s1213ftb0 uq ucode g2il+ sot886 fig 1. block diagram of g2il ic 001aam226 mod demod vreg vdd vdd data in data out r/w analog rf interface pa d pa d rect digital control antenna anticollision read/write control access control eeprom interface control rf interface control i/o control i/o control eeprom memory sequencer charge pump pa d out pa d
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 5 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ 7. pinning information 7.1 pin description fig 2. pinning bare die fig 3. pin configuration for sot886 fig 4. pinning - sot1040-1 001aam529 vdd out rfn rfp nxp trademark sl3s12x3ftb0 n.c. 001aan103 rfp rfn n.c. vdd out transparent top view 2 3 1 5 4 6 001aao110 3.00 mm la lb 3.00 mm 4.00 mm 8.00 mm 9.00 0.3 mm 0.50 mm 0.50 mm table 3. pin description bare die symbol description out output pin rfn grounded antenna connector vdd external supply rfp ungrounded antenna connector
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 6 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ table 4. pin description sot886 pin symbol description 1 rfp ungrounded antenna connector 2 n.c. not connected 3 rfn grounded antenna connector 4 out output pin 5 n.c. not connected 6 vdd external supply table 5. pin description sot1040-1 pin symbol description la la antenna connection 1 lb lb antenna connection 2
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 7 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ 8. wafer layout 8.1 wafer layout (1) x-scribe line width: 15 ? m (2) y-scribe line width: 15 ? m (3) chip step, x-length: 485 ? m (4) chip step, y-length: 435 ? m (5) bump to bump distance x (out - rfn): 383 ? m (6) bump to bump distance y (rfn - rfp): 333 ? m (7) distance bump to metal sealring x: 40,3 ? m (outer edge - top metal) (8) distance bump to metal sealring y: 40,3 ? m bump size x x y: 60 ? m x 60 ? m remark: out and vdd are used with g2il+ only fig 5. g2il wafer layout 001aak871 not to scale! (1) (7) (2) (8) (5) (6) (4) (3) y x vdd out rfn rfp
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 8 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ 9. mechanical specification the ucode g2il/g2il+ wafers are available in 75 ? m and 120 ? m thickness. the 75 ?? m thick wafer allows ultra thin label design but require a proper tuning of the glue dispenser during production. because of the more robust structure of the 120 ?? m wafer, the wafer is ideal for harsh applications. the 120 ? m thick wafer is also enhanced with 7 ? m polyimide spacer allowing additional prot ection of the active circuit. 9.1 wafer specification see ref. 20 ? data sheet - delivery type description ? general specification for 8? wafer on uv-tape with electronic fail die marking, bu-id document number: 1093** ? . 9.1.1 wafer table 6. specifications wafer designation each wafer is scribed with batch number and wafer number diameter 200 mm (8?) thickness sl3s12x3fuf 75 ? m ? 15 ? m sl3s12x3fud 120 ? m ? 15 ? m number of pads 4 pad location non diagonal/ placed in chip corners distance pad to pad rfn-rfp 333.0 ? m distance pad to pad out-rfn 383.0 ? m process cmos 0.14 ? m batch size 25 wafers potential good dies per wafer 139.351 wafer backside material si treatment ground and stress release roughness r a max. 0.5 ? m, r t max. 5 ? m chip dimensions die size including scribe 0.485 mm ? 0.435 mm = 0.211 mm 2 scribe line width: x-dimension = 15 ? m y-dimension = 15 ? m passivation on front type sandwich structure material psg/nitride thickness 500/600 mm total thickness of passivation polyimide spacer 7 ? m ? 1 ? m (sl3s12x3fud only) au bump bump material > 99.9 % pure au
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 9 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ [1] because of the 7 ? m spacer, the bump will measure 18 ? m relative height protruding the spacer. 9.1.2 fail die identification no inkdots are applied to the wafer. electronic wafer mapping (secs ii format) covers the electrical test results and additionally the results of mechanical/visual inspection. see ref. 20 ? data sheet - delivery type description ? general specification for 8? wafer on uv-tape with electronic fail die marking, bu-id document number: 1093** ? 9.1.3 map file distribution see ref. 20 ? data sheet - delivery type description ? general specification for 8? wafer on uv-tape with electronic fail die marking, bu-id document number: 1093** ? 9.2 sot1040 specification bump hardness 35 ? 80 hv 0.005 bump shear strength > 70 mpa bump height sl3s12x3fuf 18 ? m sl3s12x3fud 25 ? m [1] bump height uniformity within a die ? 2 ? m ? within a wafer ? 3 ? m ? wafer to wafer ? 4 ? m bump flatness ? 1.5 ? m bump size ? rfp, rfn 60 ? 60 ? m ? out, vdd 60 ? 60 ? m bump size variation ? 5 ? m table 6. specifications table 7. mechanical properties sot1040aa1 package name outline code lead frame format package size antenna bond pad size sot1040 sot1040aa1 single row length: 9 mm 3,0 ? 3,0 mm product pitch: 4 mm width: 4 mm metallization: 12 ? m cu substrate: 38 ? m pet thickness: max. 250 ? m
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 10 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ 10. functional description 10.1 air interface standards the ucode g2il fully supports all parts of the "specification for rfid air interface epcglobal, epc radio-frequency identity protocols, class-1 generation-2 uhf rfid, protocol for communications at 860 mhz to 960 mhz, version 1.2.0". 10.2 power transfer the interrogator provides an rf field that powers the tag, equipped with a ucode g2il. the antenna transforms the impedance of free space to the chip input impedance in order to get the maximum possible power for the g2il on the tag. the g2il+ can also be supplied externally. the rf field, which is oscillating on the opera ting frequency provided by the interrogator, is rectified to provide a smoo thed dc voltage to the analog and digital modules of the ic. the antenna that is attached to the chip may use a dc connection between the two antenna pads. therefore the g2il also enables loop antenna design. possible examples of supported antenna structures can be fo und in the reference antenna design guide. 10.3 data transfer 10.3.1 reader to tag link an interrogator transmits in formation to the ucode g2il by modulating an uhf rf signal. the g2il receives both information and operating energy from this rf signal. tags are passive, meaning that they receive all of their operating energy from the interrogator's rf waveform. in order to further improve the read range the ucode g2il+ can be externally supplied as well so the energy to operate the chip does not need to be transmitted by the reader. an interrogator is using a fixed modulation and data rate for the duration of at least one inventory round. it co mmunicates to the g2il by modulating an rf carrier using dsb-ask with pie encoding. for further details refer to section 18 , ref. 1 . interrogator-to-tag (r=>t) communications. table 8. mechanical properties sot1040ab2 package name outline code lead frame format package size antenna bond pad size sot1040 sot1040ab2 single row length: 9 mm 3,0 ? 3,0 mm product pitch: 4 mm width: 4 mm metallization: 20 ? m al substrate: 38 ? m pet thickness: max. 250 ? m
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 11 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ 10.3.2 tag to reader link an interrogator receives information from a g2il by transmitting an unmodulated rf carrier and listening for a backscattered repl y. the g2il backscatters by switching the reflection coefficient of its an tenna between two states in a ccordance with the data being sent. for further details refer to section 18 , ref. 1 , chapter 6.3.1.3. the ucode g2il communicate s information by backscatter-modulating the amplitude and/or phase of the rf carrier. interrogator s shall be capable of demodulating either demodulation type. the encoding format, selected in response to interrogator commands, is either fm0 baseband or miller-mod ulated subcarrier. 10.4 g2il and g2il+ differences the ucode g2il is tailored for application where mainly epc or tid number space is needed. the g2il+ in addition provides functi onality such as tag tamper alarm, external supply operation to further boost read/write range (external supply mode), a privacy mode reducing the read range or i/o functionality (data transfer to externally connected devices) required. the following table provides an overview of g2il, g2il+ special features. 10.5 supported commands the g2il supports all mandatory epcglobal v1.2.0 commands. in addition the g2il supports the following optional commands: ? access ? block write (32 bit), after a req_rn command (see ref. 22 ) the g2il features the following custom commands described more in detail later: ? resetreadprotect (backward compatible to g2x) ? readprotect (backward compatible to g2x) ? changeeas (backward compatible to g2x) ? eas_alarm (backward compatible to g2x) ? changeconfig (new with g2il) table 9. overview of g2il and g2il+ features features g2il g2il+ read protection (bankwise) yes yes psf (built-in product status flag ) yes yes backscatter strength reduction yes yes real read range reduction yes yes digital switch / digital input - yes external supply mode - yes data transfer - yes tag tamper alarm - yes
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 12 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ 10.6 g2il, g2il+ memory the g2il, g2il+ memory is implemented according epcglobal class1gen2 and organized in three sections: the logical address of all memory banks begin at zero (00h). in addition to the three memory banks one co nfiguration word to handle the g2il specific features is available at epc bank 01 address 200h. the configuration word is described in detail in section 10.7.1 ? changeconfig ? . memory pages (16 bit words) pre-programme d to zero will not execute an erase cycle before writing data to it. this approach acce lerates initialization of the chip and enables faster programming of the memory. table 10. g2il memory sections name size bank reserved memory (32 bit access and 32 bit kill password) 64 bit 00b epc (excluding 16 bit crc-16 and 16 bit pc) 128 bit 01b g2il configuration word 16 bit 01b tid (including permalocked unique 32 bit serial number) 64 bit 10b
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 13 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ 10.6.1 g2il, g2il+ overall memory map [1] g2il: hex e200 6806 0000 0000 0000 0000 (0000 0000) g2il+: hex e200 6807 0000 0000 0000 0000 (0000 0000) [2] indicates the existence of a configuration word at the end of the epc number [3] see figure 6 [4] see also table 15 for further details. table 11. g2il, g2il+ overall memory map bank address memory address type content initial remark bank 00 00h to 1fh reserved kill password all 00h unlocked memory 20h to 3fh reserved access password all 00h unlocked memory bank 01 epc 00h to 0fh epc crc-16: refer to ref. 16 memory mapped calculated crc 10h to 14h epc backscatter le ngth 00110b unlocked memory 15h epc reserved for future use 0b unlocked memory 16h epc reserved for future use 0b hardwired to 0 17h to 1fh epc numbering system indicator 00h unlocked memory 20h to 9fh epc epc [1] unlocked memory bank 01 config word 200h epc tamper alarm flag 0b [4] indicator bit 201h epc external supply flag or input signal 0b [4] indicator bit 202h epc rfu 0b [4] locked memory 203h epc rfu 0b [4] locked memory 204h epc invert digital output: 0b [4] temporary bit 205h epc transparent mode on/off 0b [4] temporary bit 206h epc transparent mode data/raw 0b [4] temporary bit 207h epc rfu 0b [4] locked memory 208h epc rfu 0b [4] locked memory 209h epc max. backscatter strength 1b [4] unlocked memory 20ah epc digital output 0b [4] unlocked memory 20bh epc read range reduction on/off 0b [4] unlocked memory 20ch epc rfu 0b [4] locked memory 20dh epc read protect epc bank 0b [4] unlocked memory 20eh epc read protect tid 0b [4] unlocked memory 20fh epc psf alarm flag 0b [4] unlocked memory bank 10 tid 00h to 07h tid allocation class identifier 1110 0010b locked memory 08h to 13h tid tag mask designer identifier 0000 0000 0110b locked memory 14h tid config word inventor 1b [2] locked memory 14h to 1fh tid tag model number tmnr [3] locked memory 20h to 3fh tid serial number snr locked memory
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 14 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ 10.6.2 g2il tid memory details fig 6. g2il tid memory structure 001aam227 ucode g2il+ e2006807 e2h 006h 1 0000b 0000111b ucode g2il e2006806 e2h 006h 1 0000b 0000110b first 32 bit of tid memory class id mask designer id config word indicator sub version nr. model number version (silicon) nr. class identifier ms byte ms bit ls bit ls byte tid ms bit ls bit mask-designer identifier model number serial number 000 0 7bits 11 11 31 07h 13h 1fh 3fh 00h addresses 3fh 00h addresses 08h 14h 20h e2h (ean.ucc) 006h (nxp) 806h (ucode g2il) 00000001h to ffffffffh sub version number version number 000b 0000110b (ucode g2il) 60 03 bits 0 1fh 14h 18h addresses 19h
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 15 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ 10.7 custom commands the ucode g2il, g2il+ is equipped with a numb er of additional f eatures and custom commands. nevertheless, the chip is designed in a way standard epcglob al read/write/access commands can be used to operate the features. the memory map stated in the previous sectio n describes the configuration word used to control the additional features located at address 200h of the epc memory. for this reason the standard read/write command s of an uhf epcglobal compliant reader can be used to select the flags or activate/deactivate features. the features can only be activated/deac tivated (written) using standard epc write command as long the epc is not locked. in ca se the epc is locked either the bank needs to be unlocked to apply changes or the changeconfig custom command is used to change the settings. the ucode g2il is also equipped with th e complete ucode g2 x command set for backward compatibility reasons. neverthele ss, the one changeco nfig command of the g2il can be used instead of the entire g2x command set. bit 14h of the tid indicates the existence of a configuration word. this flag will enable selecting config-word enhanced trans ponders in mixed tag populations. 10.7.1 changeconfig although g2il is tailored for supply chain management, item level tagging and product authentication the g2il+ version enables ac tive interaction with products. among the password protected features ar e the capability of download firmware to electronics, activate/deactivate electronics which can also be used as theft deterrence, a dedicated privacy mode by reducing the read range, integrated psf (product status flag) or tag ta m p e r a l a r m . the g2il changeconfig custom command allows handling the special nxp semiconductors features described in the fo llowing paragraph. please also see the memory map in section 10.6 ? g2il, g2il+ memory ? and ? section 10.7.2 ? g2il, g2il+ special features control mechanism ? . if the epc memory is not write locked the standard epc read/write command can be used to change the settings. g2il, g2il+ special features 1 ucode g2il and g2il+ common special features are: ? bank wise read protection (separate for epc and tid) epc bank and the serial number part of t he tid can be read protected independently. when protected readi ng of the particular memory will return '0'. t he flags of the configuration word can be selected using the standard select 2 command. only read protected parts will then participat e an inventory round. the g2x readprotect command will set both epc a nd tid read protect flags. 1. the features can only be manipulated ( enabled/disabled) with unlocked epc bank, otherwise the changeconfig command can be used. 2. select has to be applied onto the configuration word with pointer address 200h. selecting bits within the configuration word using a pointer address not equal to 200h is not possible.
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 16 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ ? integrated psf (product status flag) the psf is a general purpose flag that c an be used as an eas (electronic article surveillance) flag, quality checked flag or similar. the g2il offers two ways of detecting an activated psf. in cases extremely fast detection is needed the eas_alarm co mmand can be used. the ucode g2il will reply a 64-bit alarm code like describ ed in section eas_ala rm upon sending the command. as a second option the epc select 2 command selecting the psf flag of the configuration word can be used. in the following inventory round only psf enabled chips will repl y their epc number. ? backscatter strength reduction the ucode g2il features two levels of backscatter strengths. per default maximum backscatter is enabled in order to enable maximum read rates. when clearing the flag the strength can be reduced if needed. ? real read range reduction 4r some applications require the reduction of the read range to close proximity for privacy reasons. setting the 4r flag will significantly reduce the chip sensitivity to +12 dbm. the +12 dbm have to be available at chip start up (slow increase of field strength is not applicable). for additional pr ivacy, the read protection can be activated in the same configuration step. the related flag of the configuration word can be selected using the standard select 2 command so only chips with reduced read range will be part of an inventory. remark: the attenuation will result in only a few centimeter of read range at 36 dbm eirp! ucode g2il+ specific special features are: 1 ? tag tamper alarm (g2il+ only) the ucode g2il+ tamper alarm will flag the status of the vdd to out pad connection which can be designed as an predetermined breaking point (see figure 7 ). the status of the pad connection (open/closed) can be read in the configuration register and/or selected using the epc select 2 . this feature will enable designing a wireless rfid safety seal. when breaking the connection by peeling off the label or manipulating a lock an alarm can be triggered. fig 7. schematic of connecting vdd and out pad with a predetermined breaking point to turn a standard rfid label into a wireless safety seal 001aam228 out vdd gnd rfp
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 17 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ ? digital switch (g2il+ only) the ucode g2il+ out pin can be used as di gital switch. the state of the output pad can be switched to vdd or gnd depending on the digital out bit of the configuration word register. the state of the output is persistent in the memory even after kill or switching off the supply. this feature will allow activating/deactivating externally connected peripherals or can be used as theft deterrence of electronics. the state of the out pin can also be chang ed temporary by toggling the 'invert digital output' bit. ? data transfer mode (g2il+ only) in applications where not switching the ou tput like described in "digital switch" but external device communication is needed the g2il+ data transfer mode can be used by setting the according bit of the configur ation word register. when activated the air interface communication will be directly transf erred to the out pad of the chip. two modes of data transfer are available and can be switched using the transparent mode data/raw bit. the default transparent mode data will remove the frame sync of the communication and toggle the output with ev ery raising edge in the rf field. this will allow implementing a manchester type of data transmission. the transparent mo de raw will switch the demodula ted air interface communication to the out pad. ? external supply indicator - digital input (g2il+ only) the vdd pad of the ucode g2il+ can be used as a single bit digital input pin. the state of the pad is directly associated with the external supply indicator bit of the configuration register. simple one bit return signaling (chip to reader) can be implemented by polling this configuration word register flag. rf reset is necessary for proper polling. ? external supply mode (g2il+ only) the ucode g2il+ can be supplied externally by connecting 1.85 v (iout = 0a) supply. when externally supplied less energy from the rf field is needed to operate the chip. this will not just enable further im proved sensitivity and read ranges (up to ? 27 dbm) but also enable a write range that is equal to the read range. the figure schematically shows the supply connected to the ucode g2il+. remark: when permanently externally supplied th ere will not be a powe r-on-reset. this will result in the fo llowing limitations: ? when externally supplied session flag s0 will keep it?s state during rf-off phase. ? when externally supplied session flag s2, s3 , sl will have infinite persistence time and will behave similar to s0. ? session flag s1 will behav e regular like in pure passive operation.
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 18 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ the bits to be toggled in the configur ation register need to be set to '1'. e.g. sending 0000 0000 0001 0001 xor rn16 will activate the 4r and psf. sending the very same command a second time will disable the features again. the reply of the changec onfig will return the cu rrent register setting. fig 8. schematic of external power supply table 12. changeconfig custom command command rfu data rn crc-16 no. of bits 16 8 16 16 16 description 11100000 00000111 00000000 toggle bits xor rn 16 handle - table 13. changeconfig custom command reply header status bits rn crc-16 no. of bits 1 16 16 16 description 0 config-word handle - table 14. changeconfig command-response table starting state condition response next state ready all - ready arbitrate, reply, acknowledged all - arbitrate open valid handle status word needs to change backscatter unchanged config-wordconfig-word immediately open valid handle status word does not need to change backscatter config-word immediately open secured valid handle status word needs to change backscatter modified config-word, when done secured valid handle status word does not need to change backscatter config-word immediately secured killed all - killed 001aam229 out vdd vsupply gnd rfp
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 19 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ the features can only be activated/deacti vated using standard epc write if the epc bank is unlocked. the permanent and temporary bits of the configuration word can be toggled without the need for an access password in case the access password is set to zero. in case the epc bank is locked the lock needs to be removed before applying changes or the changeconfig command has to be used. 10.7.2 g2il, g2il+ special features control mechanism special features of the g2il are managed using a configuration word (config-word) located at address 200h in the epc memory bank. the entire config-word is selectable (using the standard epc select 2 command) and can be read using standard epc read command and modified using the standard epc write or changeconfig custom command in ca se the epc memory is locked for writing. changeconfig can be executed fr om the open and secured state. the chip will take all ?toggle bits? for ?0? if the chip is in the open state or the access password is zero; therefore it will not alter an y status bits, but report the current status only. the command will be ignored with an invalid crc-16 or an inva lid handle. the chip will then remain in the current state. the crc-16 is calculat ed from the first command-code bit to the last handle bit. a changeconfig command without frame-sync and proceeding re q_rn will be ignored. the command will also be ignored if any of the rfu bits are toggled. in order to change the configuration, to ac tivate/deactivate a feature a ?1? has the be written to the corresponding register flag to toggle the status. e.g. sending 0x0002 to the register will activate the read protection of the tid. sending the same command a second time will again clear the read protection of the tid. inva lid toggling on indicator or rfu bits are ignored. executing the command with zero as payload or in the open state will return the current register settings. the chip will reply to a successful changeconfig with an extended preamble regardless of the trext value of the query command. after sending a changeconfig an interrogator shall transmit cw for less than t reply or 20 ms, where t reply is the time between the interrogator's changeconfig command and the chip?s backscattered reply. an interrogator may observe three possible responses after sending a changeconfig, depending on the success or failure of the operation ? changeconfigchangeconfig succeeded: the chip will ba ckscatter the reply shown above comprising a header (a 0-bit), the current status word setting, the handle, and a crc-16 calculated over the 0-bit, the status word and the handle. if the interrogator observes this reply within 20 ms then the changeconfig completed successfully. ? the chip encounters an error: the chip will backscatter an error code during the cw period rather than the reply shown below (see epcglobal spec for error-code definitions and for the reply format). ? changeconfig does not succeed: if the inte rrogator does not observe a reply within 20 ms then the changestaus did not comp lete successfully. th e interrogator may issue a req_rn command (contain ing the handle) to verify th at the chip is still in the interrogator's field, and may reissue the changeconfig command. the g2il configuration word is located at address 200h of the epc memory and is structured as following:
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 20 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ the configuration word contains three different type of bits: ? indicator bits cannot be changed by command: tag tamper alarm indicator external supply indicator (digital input) ? temporary bits are reset at power up: invert output transparent mode on/off data mode data/raw ? permanent bits : permanently stored bits in the memory max. backscatter strength digital output read range reduction read protect epc read protect tid psf alarm 10.7.3 readprotect 3 the g2il readprotect custom command enables reliable read protection of the entire g2il memory. executing readprotect from the secured state will set the protectepc and protecttid bits of the configur ation word to '1'. with the readprotect-bit set the g2il will continue to work unaffected but veil its protected content. the read protection can be removed by executing reset readprotect. the readprotect-bits will than be cleared. devices whose access password is zero will ignore the command. a frame-sync must be pre-pended the command. after sending the readprotect command an interrogator shall transmit cw for the lesser of t reply or 20 ms, where t reply is the time between the interrogator's readprotect command and the backscattered reply. an in terrogator may observe three possible responses after sending a readprotect, depe nding on the success or failure of the operation: table 15. address 200h to 207h indicator bits temporary bits tamper indicator external supply indicator rfu rfu invert output transparent mode on/off data mode data/raw rfu 01 234567 table 16. address 208h to 20fh permanent bits rfu max. backscatter strength digital output privacy mode rfu protect epc protect tid psf alarm bit 8 9 10 11 12 13 14 15 3. note: the changeconfig command can be used instead of ?readprotect?, ?resetreadprotect?, ?changeeas?.
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 21 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ ? readprotect succeeds: after completing the readprotect the g2il shall backscatter the reply shown in ta b l e 1 8 comprising a header (a 0-bit), the tag's handle, and a crc-16 calculated over the 0-bit and handle. immediately after this reply the g2il will render itself to this readprotect mode. if the interrogator observes this reply within 20 ms then the readprotect completed successfully. ? the g2il encounters an error: the g2il will backscatter an error code during the cw period rather than the reply shown in the epcglobal spec (see annex i for error-code definitions and for the reply format). ? readprotect does not succeed: if the inte rrogator does not observe a reply within 20 ms then the readprotect did not complete successfully. the interrogator may issue a req_rn command (contain ing the handle) to verify that the g2il is still in the interrogation zone, and may re-initiate the readprotect command. the g2il reply to the read protect command will use the extended preamble shown in epcglobal spec (figure 6.11 or figure 6.15), as appropriate (i.e. a tag shall reply as if trext=1) regardless of the trext value in the query that initiated the round. 10.7.4 reset readprotect 3 reset readprotect allows an interrogator to clear the protectepc and protecttid bits of the configuration word. this will re-enable reading of the related g2il memory content. for details on the command response please refer to table 20 ? reset readprotect command ? . table 17. readprotect command command rn crc-16 # of bits 16 16 16 description 11100000 00000001 handle - table 18. g2il reply to a successful readprotect procedure header rn crc-16 # of bits 1 16 16 description 0 handle - table 19. readprotect command-response table starting state condition response next state ready all ? ready arbitrate, reply, acknowledged all ? arbitrate open all - open secured valid handle & invalid access password ? arbitrate valid handle & valid non zero access password backscatter handle, when done secured invalid handle ? secured killed all ? killed
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 22 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ after sending a reset readprotect an interrogator shall transmit cw for the lesser of t reply or 20 ms, where t reply is the time between the interrogator's reset readprotect command and the g2il backscattered reply. a req_rn command pr ior to the reset readprotect is necessary to successfully execute the co mmand. a frame-sync must be pre-pended the command. an interrogator may observe three possible responses after sending a reset readprotect, depending on the success or failure of the operation: ? reset readprotect succeeds: after comple ting the reset readprotect a g2il will backscatter the reply shown in ta b l e 2 1 comprising a header (a 0-bit), the handle, and a crc-16 calculated over the 0-bit and handle. if the interrogator observes this reply within 20 ms then the reset read protect completed successfully. ? the g2il encounters an error: the g2il will backscatter an error code during the cw period rather than the reply shown in ta b l e 2 1 (see epcglobal spec for error-code definitions and for the reply format). ? reset readprotect does not succeed: if the interrogator does not observe a reply within 20 ms then the reset readprotect did not complete successfully. the interrogator may issue a req_rn command (cont aining the handle) to verify that the g2il is still in the interrogation zone, and may reissue the reset readprotect command. the g2il reply to the re set readprotect command will us e the extended preamble shown in epcglobal spec (figure 6.11 or fi gure 6.15), as appropr iate (i.e. a g2il will reply as if trext=1 regardless of the trext value in the query that initiated the round. the reset readprotect command is structured as following: ? 16 bit command ? password: 32 bit access-passwor d xor with 2 times current rn16 remark: to generate the 32 bit password the 16 bit rn16 is duplicated and used two times to generate the 32 bit (e.g. a rn 16 of 1234 will resu lt in 1234 1234). ? 16 bit handle ? crc-16 calculate over the first command-code bit to the last handle bit table 20. reset readprotect command command password rn crc-16 # of bits 16 32 16 16 description 11100000 00000010 (access password) ? 2*rn16 handle - table 21. g2il reply to a successful reset readprotect command header rn crc-16 # of bits 1 16 16 description 0 handle -
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 23 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ 10.7.5 changeeas 3 ucode g2il equipped rfid tags will also feature a stand-alone operating eas alarm mechanism for fast and offline electronic article surveillance. the psf bit of the configuration word directly relates to the eas alarm feature. with an psf bit set to '1' the tag will reply to an eas_alarm command by backscattering a 64 bit alarm code without the need of a select or query. the eas is a built-in solution so no connection to a backend database is required. in case the eas_alarm command is not implemented in the reader a standard epc selcet to the configuration word and query can be used. when using standard select/query the epc will be returned during inventory. changeeas can be executed from the secure d state only. the command will be ignored if the access password is zero, the comman d will also be ignored with an invalid crc-16 or an invalid handle, the g2il will than rema in in the current st ate. the crc-16 is calculated from the first command-code bit to the last handle bit. a frame-sync must be pre-pended the command. the g2il reply to a succe ssful changeeas will use the extended preamble, as appropriate (i.e. a tag shall reply as if tr ext=1) regardless of the trext value in the query that initiated the round. after sending a changeeas an interrogator sh all transmit cw for less than t reply or 20 ms, where t reply is the time betwe en the interrogato r's changeeas command and the g2il backscattered reply. an interrogator may observe th ree possible responses after sending a changeeas, depend ing on the success or fa ilure of the operation ? changeeas succeeds: after completing the changeeas a g2il will backscatter the reply shown in ta b l e 2 4 comprising a header (a 0-bit), the handle, and a crc-16 calculated over the 0-bit and handle. if th e interrogator observes this reply within 20 ms then the changeeas completed successfully. ? the g2il encounters an error: the g2il will backscatter an error code during the cw period rather than the reply shown in ta b l e 2 4 (see epcglobal spec for error-code definitions and for the reply format). table 22. reset readprotect command-response table starting state condition response next state ready all ? ready arbitrate, reply, acknowledged all ? arbitrate open valid handle & valid access password backscatter handle, when done open valid handle & invalid access password ? arbitrate invalid handle ? open secured valid handle & valid access password backscatter handle, when done secured valid handle & invalid access password ? arbitrate invalid handle ? secured killed all ? killed
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 24 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ ? changeeas does not succeed: if the inte rrogator does not observe a reply within 20 ms then the changeeas did not complete successfully. the interrogator may issue a req_rn command (contain ing the handle) to verify that the g2il is still in the interrogator's fi eld, and may reissue the changeeas command. upon receiving a valid changeeas co mmand a g2il will pe rform the commanded set/reset operation of the psf bit of the configuration word. if psf bit is set, the eas_alar m command will be available after the next power up and reply the 64 bit eas code u pon execution. otherwise the eas_alarm command will be ignored. 10.7.6 eas_alarm upon receiving an eas_ala rm custom command the ucode g2il will immediately backscatter an eas-alarmcode in case the psf bit of the configuration word is set. the alarm code is returned without any delay caused by select, query and without the need for a backend database. the eas feature of the g2il is available after enabling it by sending a changeeas command described in section 10.7.5 ? changeeas 3 ? or after setting the psf bit of the configuration word to ?1?. with the eas- alarm enabled the g2il will reply to an eas_alarm command by backscatte ring a fixed 64 bit alarm code. a g2il will reply to an eas_alarm command from the ready state only. as an alternative to the fast eas_alarm command a standard select 2 (upon the configuration word) and query can be used. if the psf bit is reset to '0 ' by sending a chang eeas command in the password protected secure state or clearing the psf bit the g2il will not reply to an eas_alarm command. table 23. changeeas command command changeeas rn crc-16 # of bits 16 1 16 16 description 11100000 00000011 1 ... set psf bit 0 ... reset psf bit handle table 24. g2il reply to a successful changeeas command header rn crc-16 # of bits 1 16 16 description 0 handle - table 25. changeeas command-response table starting state condition response next state ready all ? ready arbitrate, reply, acknowledged all ? arbitrate open all ? open secured valid handle backscatter handle, when done secured invalid handle ? secured killed all ? killed
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 25 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ the eas_alarm command is structured as following: ? 16 bit command ? 16 bit inverted command ? dr (trcal divide ratio) sets the t=>r link frequency as described in epcglobal spec. 6.3.1.2.8 and table 6.9. ? m (cycles per symbol) sets the t=>r data rate and modulation format as shown in epcglobal spec. table 6.10. ? trext chooses whether the t=>r preamble is pre-pended with a pilot tone as described in epcglobal spec. 6.3.1.3. a preamble must be pre-pe nded the eas_alarm command ac cording epcglobal spec, 6.3.1.2.8. upon receiving an eas_alarm command the tag loads the crc5 register with 01001b and backscatters the 64 bit al arm code accordingly. the re ader is now able to calculate the crc5 over the backscattered 64 bits re ceived to verify the received code. table 26. eas_alarm command command inv_command dr m trext crc-16 # of bits 16 16 1 2 1 16 description 11100000 00000100 0001 1111 11111011 0: dr = 8 1: dr = 64/3 00: m = 1 01: m = 2 10: m = 4 11: m = 8 0: no pilot tone 1: use pilot tone - table 27. g2il reply to a successful eas_alarm command header eas code # of bits 1 64 description 0 crc5 (msb) table 28. eas_alarm command-response table starting state condition response next state ready psf bit is set psf bit is cleard backscatter alarm code -- ready arbitrate, reply, acknowledged all ? arbitrate open all ? open secured all ? secured killed all ? killed
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 26 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ 11. limiting values [1] stresses above those listed under absolute maxi mum ratings may cause permanent damage to the device. this is a stress rating only and functional operation of the device at these or any conditions other than those described in the operating conditions and electrical characterist ics section of this specification is not implied. [2] this product includes circuitry spec ifically designed for the protection of its internal devices from the damaging effects of excessive static charge. nonetheless, it is suggest ed that conventional precautions be taken to avoid applying greater than the rated maxima. [3] for esd measurement, the die chip has been mounted into a cdip20 package. [4] see also section 15.1 ? storage conditions ? [5] see also section 15.2 ? assembly conditions ? 12. characteristics 12.1 ucode g2il, g2il+ bare die characteristics table 29. limiting values [1] [2] in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to rfn symbol parameter conditions min max unit bare die and sot886 limitations t stg storage temperature ? 55 +125 ?c t amb ambient temperature ? 40 +85 ?c v esd electrostatic discharge voltage human body model [3] - ?? 2kv pad limitations v i input voltage absolute limits, vdd-out pad ? 0.5 +2.5 v i o output current absolute limits input/output current, vdd-out pad ? 0.5 +0.5 ma p i input power maximum power dissipation, rfp pad -100mw sot1040ab2 t oper operating temperature [3] [5] -40 +70 ?c t stg storage temperature [4] +15 +30 ?c v esd electrostatic discharge voltage human body model - ? 2kv antenna bonding [5] label converting [5] table 30. g2il, g2il+ rf interf ace characteristics (rfn, rfp) symbol parameter conditions min typ max unit f i input frequency 840 - 960 mhz normal mode - no external supply, read range reduction off p i(min) minimum input power read sensitivity [1] [2] [7] - ? 18 - dbm
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 27 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ [1] power to process a query command. [2] measured with a 50 ? source impedance. [3] at minimum operating power. [4] it has to be assured the reader (system) is capable of prov iding enough field strength to give +12 dbm at the chip otherwise communication with the chip will not be possible. [5] enables tag designs to be within etsi limits for return link data rates of e.g. 320 khz/m4. [6] will result in up to 10 db higher tag backscatter power at high field strength. [7] results in approx. ? 18.5 dbm tag sensitivity on a 2 dbi gain antenna. p i(min) minimum input power write sensitivity, (write range/read range - ratio) -30-% c i input capacitance parallel [3] -0.77-pf q quality factor 915 mhz [3] -9.7-- z impedance 866 mhz [3] - 25 -j237 - ? 915 mhz [3] - 23 -j224 - ? 953 mhz [3] - 21 -j216 - ? external supply mode - vdd pad supplied, read range reduction off p i(min) minimum input power ext. supplied read [1] [2] - ? 27 - dbm ext. supplied write [2] - ? 27 - dbm z impedance externally supplied, 915 mhz [3] -7 -j230- ? read range reduction on - no external supply p i(min) minimum input power 4r on read [1] [2] [4] -+12-dbm 4r on write [2] [4] -+12-dbm z impedance 4r on, 915 mhz [3] -18 -j2- ? modulation resistance r resistance modulation resistance, max. backscatter = off [5] -170- ? modulation resistance, max. backscatter = on [6] -55- ? table 30. g2il, g2il+ rf interf ace characteristics (rfn, rfp) symbol parameter conditions min typ max unit table 31. vdd pin characteristics symbol parameter conditions min typ max unit minimum supply voltag e/current - without a ssisted eeprom write [1] [3] [4] v dd supply voltage minimum voltage - - 1.8 v i dd supply current minimum current, i out-^- = 0 ? a -- 7 ? a i out = 100 ? a--1 1 0 ? a minimum supply voltag e/current - as sisted eeprom read and write [2] [3] [4] v dd supply voltage minimum voltage, i out = 0 ? a - 1.8 1.85 v i out = 100 ? a--1 . 9 5 v
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 28 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ [1] activates digital output (out pin) , increases read range (external supplied). [2] activates digital output (out pin), incr eases read and write range (external supplied). [3] operating the chip outside the specifi ed voltage range may lead to undefined behaviour. [4] either the voltage or the current needs to be above given values to guarantee specified functionality. [5] no proper operation is guaranteed if both, voltage and current, limits are exceeded. [1] is the sum of the allowed capacitance of the vdd and out pin referenced to rfn. [2] is the maximum allowed rf input voltage coupling to the vdd/out pin to guarantee undisturbed chip functionality. [3] resistance between vdd and out pin in checked during power up only. [4] resistance range to achieve tamper alarm flag = 1. [5] resistance range to achieve tamper alarm flag = 0: for further reading we recommend app lication note ?faq ucode g2il+? ( ref. 22 ) describing the output characteristics more in detail. an example schematic is available in application note ?ucode g2il+ demoboard manual? ( ref. 23 ). the documents are available at nxp document control or at the website www.nxp.com. i dd supply current minimum current, i out = 0 ? a -- 125 ? a i out = 100 ? a--2 6 5 ? a maximum supply voltage/current [3] [5] v dd supply voltage absolute maximum voltage 2.2 - - v i i(max) maximum input current absolute maximum current 280 - - ? a table 31. vdd pin characteristics symbol parameter conditions min typ max unit table 32. g2il, g2il+ vdd an d out pin characteristics symbol parameter conditions min typ max unit out pin characteristics v ol low-level output voltage isink = 1 ma - - 100 mv v oh high-level output voltage vdd = 1.8 v; isource = ? 100 a 1.5 - - v vdd/out pin characteristics c l load capacitance vdd - out pin max. [1] -- 5pf v o output voltage maximum rf peak voltage on vdd-out pins [2] -- 500mv vdd/out pin tamper alarm characteristics [3] r l(max) maximum load resistance resistance range high [4] -- <2 m ? r l(min) minimum load resistance resistance range low [5] >20 - - m ? table 33. g2il, g2il+ memory characteristics symbol parameter conditions min typ max unit eeprom characteristics t ret retention time t amb ?? 55 ? c20--year n endu(w) write endurance 1000 10000 [1] - cycle
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 29 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ [1] t amb ?? 25 ? c 12.2 ucode g2il, g2il+ sot886 characteristics [1] power to process a query command. [2] measured with a 50 ? source impedance. [3] at minimum operating power. remark: for dc and memory characteristics refer to ta b l e 3 1 , ta b l e 3 2 and ta b l e 3 3 . 12.3 fcs2 cu (sot1040aa1), fcs2 ai (sot1040ab2) characteristics [1] power to process a query command. [2] measured with a 50 ? source impedance. [3] measured with network analyzer at 915 mhz; values at 0.5 dbm after peak max of on-set of die, measured in the center of the pads. table 34. g2il, g2il+ rf interface characteristics (rfn, rfp) symbol parameter conditions min typ max unit normal mode - no external supp ly, read range reduction off p i(min) minimum input power read sensitivity [1] [2] - ? 17.6 - db m z impedance 915 mhz [3] -21 ? j199 - ? table 35. interface characteristics [1] [2] [3] symbol parameter conditions min typ max unit interface characteristics fcs2 cu (cu strap sot 1040aa1) c i input capacitance - 1 - pf z impedance fcs2 cu impedance (915 mhz) - 14 ?? j171 - ? interface characteristics fcs2 ai (ai strap sot 1040ab2) c i input capacitance - 1,1 - pf z fcs2 ai impedance (915 mhz) - 14 ?? j151 - ?
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 30 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ 13. package information fig 9. package fcs2, sot1040aa1, 12 ? m cu metallization 001aao111 0.5 mm bad mark 2.5 mm 3.0 mm 3.0 mm 4.0 mm 8.0 mm 0.012 mm (1) 0.038 mm (2) max. 0.250 mm (3) 9.0 0.3 mm 0.5 mm 1.5 0.5 mm 80.0 0.3 mm 4.0 0.3 mm detail x x note 1. metallization thickness 12 m (copper) 2. substrate thickness 38 m (pet) 3. package thickness max. 250 m
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 31 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ fig 10. package fcs2, sot1040ab2, 20 ? m al metallization 001aao112 0.5 mm bad mark 2.5 mm 3.0 mm 3.0 mm 4.0 mm 8.0 mm 0.020 mm (1) 0.038 mm (2) max. 0.250 mm (3) 9.0 0.3 mm 0.5 mm 1.5 0.5 mm 80.0 0.3 mm 4.0 0.3 mm detail x x note 1. metallization thickness 20 m (aluminium) 2. substrate thickness 38 m (pet) 3. package thickness max. 250 m
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 32 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ fig 11. splicing drawing sot1040-1 001aao113 a a 16 0.3 mm (1) 1.5 0.5 mm 8.5 0.5 mm (1) 0.075 0.01 mm (2) 20 0.3 mm cutting line cutting line bad mark 2.50 mm 9.0 0.3 mm bottom view top view a - a view max. 0.250 mm max. 0.3 mm max. 0.340 mm note 1. splicing area, adhesive tape must be placed within defined splicing area 2. splicing tape thickness
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 33 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ 14. package outline fig 12. package outline sot886 terminal 1 index area references outline version european projection issue date iec jedec jeita sot886 mo-252 sot886 04-07-15 04-07-22 dimensions (mm are the original dimensions) xson6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm d e e 1 e a 1 b l l 1 e 1 0 1 2 mm scale notes 1. including plating thickness. 2. can be visible in some manufacturing processes. unit mm 0.25 0.17 1.5 1.4 0.35 0.27 a 1 max b e 1.05 0.95 d ee 1 l 0.40 0.32 l 1 0.50.6 a (1) max 0.5 0.04 1 6 2 5 3 4 6 (2) 4 (2) a
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 34 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ fig 13. package outline sot1040-1 references outline version european projection issue date iec jedec jeita sot1040-1 - - - - - - - - - sot1040-1 07-10-12 07-10-18 unit a max mm 0.25 9.3 8.7 d dimensions (mm are the original dimensions) fcs2: plastic flip chip strap package; 2 leads; 9 mm wide tape for unspecified dimensions see fcs2-drawing given in the subpackage code. x d 0 5 10 mm scale detail x a
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 35 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ 15. handling information the handling information applies for flip chip sot1040. 15.1 storage conditions the following storage conditions are applicable if the fcs2 products are kept in their original packing: ? storage temperature: +15 ?? c to +30 ? c ? relative humidity: max. 60 % ? duration of storage: max. 0.5 years deviating requirements have to be arranged with nxp semiconductors. 15.2 assembly conditions 15.2.1 general assembly recommendations nxp recommends to use dedicated strap asse mbly equipment to prevent damage of the fcs2 strap or the die itself. in case of any doubts, the customer is co nstrained to contact nxp semiconductors for further clarification. 15.2.2 antenna bonding mounting the fcs2 product onto the antenna can be done in multiple ways: ? crimping ? conductive gluing ? soldering (possible, but not recommended by nxp semiconductors) 15.2.3 label converting generally, an optimization of the entire lamination process by label manufacturer is recommended in order to minimize the stress onto the module and guarantee high assembly yield. roller diameter must not be smaller than 45 mm. 16. packing information 16.1 wafer see ref. 20 ? data sheet - delivery type description ? general specification for 8? wafer on uv-tape with electronic fail die marking, bu-id document number: 1093** ? 16.2 sot886 part orientation t1. for details please refer to http://www.standardics.nxp.com/packaging/packing/pdf/sot886.t1.t4.pdf
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 36 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ 16.3 flip chip strap (fcs2, sot1040) the strap is shipped on a 13 inch by 9 mm reel. for details please refer to ref. 21 ? data sheet - flip chip strap - fcs2, general packing specification, bu-id document number: 1738** ? . 17. abbreviations table 36. abbreviations acronym description crc cyclic redundancy check cw continuous wave dsb-ask double side band-amplitude shift keying dc direct current eas electronic article surveillance eeprom electrically erasable pr ogrammable re ad only memory epc electronic product code (containing header, domain manager, object class and serial number) fcs flip chip strap fm0 bi phase space modulation g2 generation 2 ic integrated circuit pie pulse interval encoding rrrr real read range reduction psf product status flag rf radio frequency uhf ultra high frequency secs semi equipment communication standard tid tag identifier
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 37 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ 18. references [1] epcglobal: epc radio-frequency identity protocols class-1 generation-2 uhf rfid protocol for communications at 860 mhz ? 960 mhz, version 1.1.0 (december 17, 2005) [2] epcglobal: epc tag data standards [3] epcglobal (2004): fmcg rfid phys ical requirements document (draft) [4] epcglobal (2004): class-1 generation-2 uhf rfid implementation reference (draft) [5] european telecommunications standards institute (etsi), en 302 208: electromagnetic compatibility and radio spectrum matter s (erm) ? radio-frequency identification equipment operating in the band 865 mhz to 868 mhz with power levels up to 2 w, part 1 ? technical characteristics and test methods [6] european telecommunications standards institute (etsi), en 302 208: electromagnetic compatibility and radio spectrum matter s (erm) ? radio-frequency identification equipment operating in the band 865 mhz to 868 mhz with power levels up to 2 w, part 2 ? harmonized en under article 3.2 of the r&tte directive [7] [cept1]: cept rec 70-03 annex 1 [8] [etsi1]: etsi en 330 220-1, 2 [9] [etsi3]: etsi en 302 208-1, 2 v<1.1. 1> (2004-09-electrom agnetic compatibility and radio spectrum matters (erm) radio frequency identification equipment operating in the band 865 - mhz to 868 mhz with power levels up to 2 w part 1: technical characteristics and test methods. [10] [fcc1]: fcc 47 part 15 section 247 [11] iso/iec directives, part 2: rules for th e structure and drafting of international standards [12] iso/iec 3309: information technology ? telecommunications and information exchange between systems ? high-level data link control (hdlc) procedures ? frame structure [13] iso/iec 15961: information technology, automatic identification and data capture ? radio frequency identification (rfid) for item management ? data protocol: application interface [14] iso/iec 15962: information technology, automatic identification and data capture techniques ? radio frequency identification (rfid) for item management ? data protocol: data encoding rules and logical memory functions [15] iso/iec 15963: information technology ? radio frequency identification for item management ? unique identification for rf tags [16] iso/iec 18000-1: information technology ? radio frequency identification for item management ? part 1: reference architecture and definition of parameters to be standardized [17] iso/iec 18000-6: information technology automatic identification and data capture techniques ? radio frequency identification for item management air interface ? part 6: parameters for air interface communications at 860?960 mhz [18] iso/iec 19762: information technology aidc techniques ? harmonized vocabulary ? part 3: radio-frequency identification (rfid)
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 38 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ [19] u.s. code of federa l regulations (cfr), title 47, chapter i, part 15: radio-frequency devices, u.s. federal communications commission. [20] data sheet - delivery type description ? general specification for 8? wafer on uv-tape with electronic fail die ma rking, bu-id document number: 1093** 4 [21] data sheet - flip chip strap - fcs2, ge neral packing specificat ion, bu-id document number: 1738** [22] application note - faq ucode g2il+, bu-id document number: 1925** [23] application note - uco de g2il+ demoboard manual, bu-id document number: 1915** 4. ** ... document version number
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 39 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ 19. revision history table 37. revision history document id release date data sheet status change notice supersedes sl3s1203_1213 v.3.6 20110803 product data sheet - sl3s1203_1213 v.3.5 modifications: ? real read range reduction feature added to g2il sl3s1203_1213 v.3.5 20110531 product data sheet - sl3s1203_1213 v.3.4 modifications: ? superfluous text removed from ta b l e 6 sl3s1203_1213 v.3.4 20110511 product data sheet - sl3s1203_1213 v.3.3 modifications: ? security status changed into company public ? delivery form of fcs2 strap added ? section 13 ? package information ? , section 15 ? handling information ? and section 16 ? packing information ? added sl3s1203_1213 v.3.3 20110131 product data sheet - sl3s1203_1213 v.3.2 modifications: ? section 4 ?ordering information?: new types sl3s1203fud and sl3s1213fud added ? section 9 ?mechanical specification?: updated according to the new types ? replaced wording of ?changestatus? with ?changeconfig? sl3s1203_1213 v.3.2 20101109 product data sheet - sl3s1203_1213 v.3.1 modifications: ? version sot886f1 added ? section 5 ?marking?, section 13 ?package outline? and section 14 ?packing information? added sl3s1203_1213 v.3.1 20100922 product data sheet - sl3s1203_1213 v.3.0 modifications: ? general modifications sl3s1203_1213 v.3.0 20100621 product data sheet - 178810 modifications: ? general update 178810 20100304 objective data sheet - -
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 40 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ 20. legal information 20.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 20.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 20.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 41 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully in demnifies nxp semi conductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive appl ications beyond nxp semiconductors? standard warranty and nxp semicond uctors? product specifications. bare die ? all die are tested on compliance with their related technical specifications as stated in this data sheet up to the point of wafer sawing and are handled in accordance with the nxp semiconductors storage and transportation conditions. if there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. there are no post-packing tests performed on individual die or wafers. nxp semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. accordingly, nxp semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. it is the responsibility of the customer to test and qualify their application in which the die is used. all die sales are conditioned upon and subject to the customer entering into a written die sale agreement with nxp semiconductors through its legal department. 20.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. ucode ? is a trademark of nxp b.v. 21. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
sl3s1203_1213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 3 august 2011 178836 42 of 43 nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ 22. tables table 1. ordering information . . . . . . . . . . . . . . . . . . . . . .3 table 2. marking codes . . . . . . . . . . . . . . . . . . . . . . . . . .4 table 3. pin description bare die . . . . . . . . . . . . . . . . . . .5 table 4. pin description sot886 . . . . . . . . . . . . . . . . . . .6 table 5. pin description sot1040-1 . . . . . . . . . . . . . . . .6 table 6. specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .8 table 7. mechanical properties sot1040aa1 . . . . . . . . .9 table 8. mechanical properties sot1040ab2 . . . . . . . .10 table 9. overview of g2il and g2il+ features . . . . . . . 11 table 10. g2il memory sections . . . . . . . . . . . . . . . . . . .12 table 11. g2il, g2il+ overall memo ry map. . . . . . . . . . .13 table 12. changeconfig custom command . . . . . . . . . . .18 table 13. changeconfig custom command reply. . . . . . .18 table 14. changeconfig command-response table . . . . .18 table 15. address 200h to 207h . . . . . . . . . . . . . . . . . . .20 table 16. address 208h to 20fh . . . . . . . . . . . . . . . . . . .20 table 17. readprotect command . . . . . . . . . . . . . . . . . . .21 table 18. g2il reply to a successful readprotect procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 table 19. readprotect command-response table . . . . . .21 table 20. reset readprotect comma nd . . . . . . . . . . . . .22 table 21. g2il reply to a successful reset readprotect command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 table 22. reset readprotect command-response table 23 table 23. changeeas command . . . . . . . . . . . . . . . . . . 24 table 24. g2il reply to a successful changeeas command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 table 25. changeeas command-response table . . . . . . 24 table 26. eas_alarm command . . . . . . . . . . . . . . . . . . . 25 table 27. g2il reply to a successful eas_alarm command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 table 28. eas_alarm command-response table . . . . . . 25 table 29. limiting values [1][2] . . . . . . . . . . . . . . . . . . . . . . 26 table 30. g2il, g2il+ rf interface characteristics (rfn, rfp) . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 table 31. vdd pin characteristics . . . . . . . . . . . . . . . . . . 27 table 32. g2il, g2il+ vdd and out pin characteristics 28 table 33. g2il, g2il+ memory characteristics . . . . . . . . 28 table 34. g2il, g2il+ rf interface characteristics (rfn, rfp) . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 table 35. interface characteristics [1][2][3] . . . . . . . . . . . . . 29 table 36. abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 36 table 37. revision history . . . . . . . . . . . . . . . . . . . . . . . . 39 23. figures fig 1. block diagram of g2il ic . . . . . . . . . . . . . . . . . . .4 fig 2. pinning bare die . . . . . . . . . . . . . . . . . . . . . . . . . . .5 fig 3. pin configuration for sot886 . . . . . . . . . . . . . . . .5 fig 4. pinning - sot1040-1 . . . . . . . . . . . . . . . . . . . . . . .5 fig 5. g2il wafer layout . . . . . . . . . . . . . . . . . . . . . . . . . .7 fig 6. g2il tid memory structure . . . . . . . . . . . . . . . . .14 fig 7. schematic of connec ting vdd and out pad with a predetermined breaking point to turn a standard rfid label into a wireless safety seal . . . . . . . . .16 fig 8. schematic of external power supply . . . . . . . . . .18 fig 9. package fcs2, sot1040aa1, 12 mm cu metallization . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 fig 10. package fcs2, sot1040ab2, 20 mm al metallization . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 fig 11. splicing drawing sot1040-1 . . . . . . . . . . . . . . . .32 fig 12. package outline sot886 . . . . . . . . . . . . . . . . . . .33 fig 13. package outline sot1040-1 . . . . . . . . . . . . . . . .34
nxp semiconductors sl3s1203_1213 ucode g2il and g2il+ ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 3 august 2011 178836 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 24. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 2.1 key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.1.1 memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.2 key benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2.1 end user benefit . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2.2 antenna design benefits . . . . . . . . . . . . . . . . . . 2 2.2.3 label manufacturer benefit . . . . . . . . . . . . . . . . 2 2.3 custom commands. . . . . . . . . . . . . . . . . . . . . . 2 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3.1 markets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3.2 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 ordering information . . . . . . . . . . . . . . . . . . . . . 3 5 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 pinning information . . . . . . . . . . . . . . . . . . . . . . 5 7.1 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 wafer layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 8.1 wafer layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 9 mechanical specification . . . . . . . . . . . . . . . . . 8 9.1 wafer specification . . . . . . . . . . . . . . . . . . . . . . 8 9.1.1 wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 9.1.2 fail die identification . . . . . . . . . . . . . . . . . . . . 9 9.1.3 map file distribution. . . . . . . . . . . . . . . . . . . . . . 9 9.2 sot1040 specification . . . . . . . . . . . . . . . . . . . 9 10 functional description . . . . . . . . . . . . . . . . . . 10 10.1 air interface standards . . . . . . . . . . . . . . . . . . 10 10.2 power transfer . . . . . . . . . . . . . . . . . . . . . . . . 10 10.3 data transfer . . . . . . . . . . . . . . . . . . . . . . . . . . 10 10.3.1 reader to tag link . . . . . . . . . . . . . . . . . . . . . 10 10.3.2 tag to reader link . . . . . . . . . . . . . . . . . . . . . . 11 10.4 g2il and g2il+ differences . . . . . . . . . . . . . . 11 10.5 supported commands . . . . . . . . . . . . . . . . . . 11 10.6 g2il, g2il+ memory . . . . . . . . . . . . . . . . . . . 12 10.6.1 g2il, g2il+ overall memo ry map. . . . . . . . . . 13 10.6.2 g2il tid memory details . . . . . . . . . . . . . . . . 14 10.7 custom commands. . . . . . . . . . . . . . . . . . . . . 15 10.7.1 changeconfig. . . . . . . . . . . . . . . . . . . . . . . . . 15 g2il, g2il+ special features . . . . . . . . . . . . . .15 10.7.2 g2il, g2il+ special features control mechanism . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 10.7.3 readprotect . . . . . . . . . . . . . . . . . . . . . . . . . . 20 10.7.4 reset readprotect 3 . . . . . . . . . . . . . . . . . . . . 21 10.7.5 changeeas 3 . . . . . . . . . . . . . . . . . . . . . . . . . 23 10.7.6 eas_alarm . . . . . . . . . . . . . . . . . . . . . . . . . . 24 11 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 26 12 characteristics . . . . . . . . . . . . . . . . . . . . . . . . 26 12.1 ucode g2il, g2il+ bare die characteristics 26 12.2 ucode g2il, g2il+ so t886 characteristics 29 12.3 fcs2 cu (sot 1040aa1), fcs2 ai (sot1040ab2) characteristics . . . . . . . . . . . 29 13 package information. . . . . . . . . . . . . . . . . . . . 30 14 package outline. . . . . . . . . . . . . . . . . . . . . . . . 33 15 handling information . . . . . . . . . . . . . . . . . . . 35 15.1 storage conditions . . . . . . . . . . . . . . . . . . . . . 35 15.2 assembly conditio ns . . . . . . . . . . . . . . . . . . . 35 15.2.1 general assembly reco mmendations . . . . . . 35 15.2.2 antenna bonding . . . . . . . . . . . . . . . . . . . . . . 35 15.2.3 label converting. . . . . . . . . . . . . . . . . . . . . . . 35 16 packing information . . . . . . . . . . . . . . . . . . . . 35 16.1 wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 16.2 sot886 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 16.3 flip chip strap (fcs2, sot1040) . . . . . . . . . 36 17 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 36 18 references. . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 19 revision history . . . . . . . . . . . . . . . . . . . . . . . 39 20 legal information . . . . . . . . . . . . . . . . . . . . . . 40 20.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 40 20.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 20.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 40 20.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 41 21 contact information . . . . . . . . . . . . . . . . . . . . 41 22 tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 23 figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 24 contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

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