? switch control voltage: v cont (h) = 2.5 to 5.3 v (3.0 v typ.) v cont (l) = ? 0.2 to +0.2 v (0 v typ.) ? low insertion loss: l ins1 = 0.30 db typ. @ f = 0.5 to 1.0 ghz, v cont = 3.0 v/0 v l ins2 = 0.40 db typ. @ f = 2.0 ghz, v cont = 3.0 v/0 v l ins3 = 0.90 db max. @ f = 2.0 to 2.5 ghz, v cont = 3.0 v/0 v ? high isolation: isl1 = 27 db typ. @ f = 0.5 to 2.0 ghz, v cont = 3.0 v/0 v isl2 = 18 db min. @ f = 2.0 to 2.5 ghz, v cont = 3.0 v/0 v ? power handling: p in (1 db) = +26.5 dbm typ. @ f = 1.0 ghz, v cont = 3.0 v/0 v ? high-density surface mounting: 6-pin super minimold package (2.0 1.25 0.9 mm) features nec's ? w l, s-band spdt switch description upg168tb nec's upg168tb is a gaas mmic l, s-band spdt (single pole double throw) switch for mobile phone and l, s-band applications. this device can operate from 0.5 to 2.5 ghz, with low insertion loss and high isolation. this device is housed in a 6-pin super minimold package, suitable for high-density surface mount assembly. applications ? l-band digital cellular or cordless telephones ? pcs, w-lan, wll and bluetooth tm ? short range wireless california eastern laboratories ordering information part number package marking supplying form UPG168TB-E4 6-pin super minimold g2t ? embossed tape 8 mm wide ? pin 1, 2, 3 face the perforation side of the tape ? qty 3 kpcs/reel remark to order evaluation samples, contact your nearby sales of t ce. part number for sample order: upg168tb caution observe precautions when handling because these devices are sensitive to electrostatic discharge.
upg168tb absolute maximum ratings (t a = 25c, unless otherwise speci t ed) recommended operating range (t a = 25c, unless otherwise speci t ed) pin no. pin name 1 output2 2 gnd 3 output1 4v cont1 5 input 6v cont2 truth table vcont1 vcont2 input ? output1 input ? output2 low high on off high low off on pin connection diagram 3 2 1 4 5 6 (top view) g2t 3 2 1 4 5 6 (top view) 4 5 6 3 2 1 (bottom view) parameter symbol ratings unit switch control voltage v cont ? 6.0 to +6.0 note1 v input power p in +28 dbm power dissipation p d 150 note2 mw operating ambient temperature t a ? 45 to +85 c storage temperature t stg ? 55 to +150 c n ote 1. mounted on double-sided copper-clad 50 50 1.6 mm epoxy glass pwb, t a = +85 c 2. v cont1 ? v cont2 6.0 v parameter symbol min. typ. max. unit switch control voltage (h) v cont (h) 2.5 3.0 5.3 v switch control voltage (l) v cont (l) ? 0.2 0 0.2 v
electrical characteristics (t a = +25 c, v cont = 3.0 v/0 v, dc blocking capacitors = 51 pf, unless otherwise speci t ed) parameter symbol test conditions min. typ. max. unit insertion loss 1 l ins1 f = 0.5 to 1.0 ghz ? 0.30 0.55 db insertion loss 2 l ins2 f = 2.0 ghz ? 0.40 0.65 db insertion loss 3 l ins3 f = 2.0 to 2.5 ghz ?? 0.90 db isolation 1 isl1 f = 0.5 to 2.0 ghz 22 27 ? db isolation 2 isl2 f = 2.0 to 2.5 ghz 18 ?? db input return loss 1 rl in1 f = 0.5 to 2.0 ghz 13 19 ? db input return loss 2 rl in2 f = 2.0 to 2.5 ghz 11 ?? db output return loss 1 rl out1 f = 0.5 to 2.0 ghz 13 19 ? db output return loss 2 rl out2 f = 2.0 to 2.5 ghz 11 ?? db 1 db gain compression input power note p in (1 db) f = 1.0 ghz +22.0 +26.5 ? dbm switch control speed t sw ? 50 200 ns switch control current i cont ? 0.5 10 a note p in (1 db) is the measured input power level when the insertion loss increases 1 db more than that of linear range. standard characteristics for reference (t a = +25 c, v cont = 3.0 v/0 v, dc blocking capacitors = 51 pf, unless otherwise speci t ed) parameter symbol test conditions min. typ. max. unit 0.1 db gain compression input power note p in (0.1 db) f = 1.0 ghz ? +23.0 ? dbm note p in (0.1 db) is the measured input power level when the insertion loss increases 0.1 db more than that of linear range. upg168tb
upg168tb evaluation circuit (v cont = 3.0 v/0 v, dc blocking capacitors = 51 pf) output2 output1 v cont2 input v cont1 51 pf 51 pf 1 000 pf 1 000 pf 51 pf 654 123 the application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
upg168tb illustration of the test circuit assembled on evaluation board v c 2 v c 1 in out 1 out 2 6pin smm spdt sw c3 c4 c2 c1 c5 c1 c1 c1 c2 c2 g2y v dd v cont input output1 output2 using the nec evaluation board symbol values c1, c2, c3 51 pf c4, c5 1 000 pf
upg168tb p ackage dimensions 6-pin super minimold (unit: mm) 0.90.1 0.7 0 to 0.1 0.15 +0.1 ?0.05 0.2 +0.1 ?0.05 2.00.2 1.3 0.65 0.65 1.250.1 2.10.1 0.1 min.
upg168tb recommended soldering conditions this product should be soldered and mounted under the following recommended conditions. for soldering methods and conditions other than those recommended below, contact your nearby sales of t ce. soldering method soldering conditions condition symbol infrared re ? ow peak temperature (package surface temperature) : 260 c or below t ime at peak temperature : 10 seconds or less t ime at temperature of 220 c or higher : 60 seconds or less preheating time at 120 to 180 c : 120 30 seconds maximum number of re ? ow processes : 3 times maximum chlorine content of rosin ? ux (% mass) : 0.2%(wt.) or below ir260 vps peak temperature (package surface temperature) : 215 c or below t ime at temperature of 200 c or higher : 25 to 40 seconds preheating time at 120 to 150 c : 30 to 60 seconds maximum number of re ? ow processes : 3 times maximum chlorine content of rosin ? ux (% mass) : 0.2%(wt.) or below vp215 w ave soldering peak temperature (molten solder temperature) : 260 c or below t ime at peak temperature : 10 seconds or less preheating temperature (package surface temperature) : 120 c or below maximum number of ? ow processes : 1 time maximum chlorine content of rosin ? ux (% mass) : 0.2%(wt.) or below ws260 partial heating peak temperature (pin temperature) : 350 c or below soldering time (per side of device) : 3 seconds or less maximum chlorine content of rosin ? ux (% mass) : 0.2%(wt.) or below hs350 life support applications these nec products are not intended for use in life support devices, appliances, or systems where the malfunction of these prod ucts can reasonably be expected to result in personal injury. the customers of cel using or selling these products for use in such applications do so at their own risk and agree to fully indemnify cel for all damages resulting from such improper use or sale. 03/08/2004 caution do not use different soldering methods together (except for partial heating).
|
