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agilent hsmx-c110/c170/c190/c191/c150 high performance chipled data sheet features ? high brightness alingap material ? small size ? industry standard footprint ? diffused optics ? top emitting or right angle emitting ? available in 3 colors (red, orange, amber) ? compatible with ir soldering ? available in 8 mm tape on 7" diameter reel ? reel sealed in zip locked moisture barrier bags applications ? lcd backlighting ? push button backlighting ? front panel indicator ? symbol indicator ? microdisplays ? small message panel signage these chipleds come either in two top emitting packages (hsmx-c170/c190/c191/c150) or in a side emitting package (hsmx-c110). the right angle chipleds are suitable for applications such as lcd back- lighting. the top emitting chipleds with wide viewing angle are suitable for light piping and direct backlighting of keypads and panels. in order to facilitate pick and place opera- tion, these chipleds are shipped in tape and reel, with 4000 units per reel for hsmx-c170/c190/ c191 and 3000 units per reel for hsmx-c110/c150. these packages are compatible with ir soldering process. description these chip-type leds utilize alu- minum indium gallium phosphide (alingap) material technology. the alingap material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents. the available colors in this surface mount series are 592 nm amber, 605 nm orange, 626 nm red for as alingap and 631 nm red for ts alingap. all packages are binned by both color and intensity, except for red color. hsma-c110/c170/c190/c191/c150 hsml-c110/c170/c190/c191/c150 hsmc-c110/c170/c190/c191/c150 hsmz-c110/c170/c190
2 package dimensions 3.2 (0.126? 0.5 (0.020) 0.9 (0.035) polarity cathode mark 1.5 (0.059) led die clear epoxy pc board soldering terminal 1.0 (0.039) 1.0 (0.039) 2.6 (0.102? 1.6 (0.063? cathode line hsmx-c110 3.2 (0.126? 3.2 (0.126? 2.0 (0.079? 0.3 (0.012) 0.4 ?0.15 (0.016 ?0.006) 0.3 (0.012) polarity cathode mark 0.8 (0.031) 0.4 ?0.15 (0.016 ?0.006) 1.4 (0.055) 0.62 (0.024) led die diffused epoxy pc board soldering terminal 1.25 (0.049) hsmx-c170 cathode line notes: 1. all dimensions in millimeters (inches). 2. tolerance is ?0.1 mm (?0.004 in.) unless otherwise specified. hsmx-c190 1.6 (0.063? 0.3 (0.012) 0.3 ?0.15 (0.012 ?0.006) 0.3 (0.012) polarity cathode mark 0.8 (0.031) 0.3 ?0.15 (0.012 ?0.006) 1.0 (0.039) 0.4 (0.016) led die diffused epoxy pc board soldering terminal 0.8 (0.031) cathode line 0.7 (0.028) min. hsmx-c191 1.6 (0.063? 0.3 (0.012) 0.3 ?0.15 (0.012 ?0.006) 0.3 (0.012) polarity cathode mark 0.6 (0.023) 0.3 ?0.15 (0.012 ?0.006) 1.0 (0.039) 0.4 (0.016) led die diffused epoxy pc board soldering terminal 0.8 (0.031) cathode line 0.7 (0.028) min.
3 package dimensions, continued notes: 1. dimensions in mm. 2. tolerance 0.1 mm unless otherwise noted. device selection guide footprint as alingap as alingap as alingap ts alingap package (mm) [1,2] amber orange red red description 1.6 x 0.8 x 0.8 hsma-c190 hsml-c190 hsmc-c190 hsmz-c190 untinted, diffused 2.0 x 1.25 x 0.8 HSMA-C170 hsml-c170 hsmc-c170 hsmz-c170 untinted, diffused 3.2 x 1.0 x 1.5 hsma-c110 hsml-c110 hsmc-c110 hsmz-c110 untinted, nondiffused 1.6 x 0.8 x 0.6 hsma-c191 hsml-c191 hsmc-c191 untinted, diffused 3.2 x 1.6 x 1.1 hsma-c150 hsml-c150 hsmc-c150 untinted, diffused absolute maximum ratings t a = 25 c hsma-c110/170/190/191/150 hsml-c110/170/190/191/150 parameter hsmc-c110/170/190/191/150 hsmz-c110/170/190 units dc forward current [1,2] 30 30 ma power dissipation 75 81 mw reverse voltage (i r = 100 m a) 5 5 v led junction temperature 95 95 c operating temperature range C30 to +85 C30 to +85 c storage temperature range C40 to +85 C40 to +85 c soldering temperature see ir soldering profile (figure 7) notes: 1. derate linearly as shown in figure 4. 2. drive currents above 5 ma are recommended for best long term performance. hsmx-c150 3.2 (0.126? 0.5 (0.020) 0.50 ?0.2 (0.020 ?0.008) 0.6 (0.024) polarity cathode mark 1.1 (0.043) 0.50 ?0.2 (0.020 ?0.008) 2.0 (0.079) 0.8 (0.031) led die diffused epoxy pc board soldering terminal 1.6 (0.063) cathode line notes: 1. all dimensions in millimeters (inches). 2. tolerance is ?0.1 mm (?0.004 in.) unless otherwise specified.
4 optical characteristics t a = 25 c luminous color, viewing luminous intensity peak dominant angle efficacy i v (mcd) wavelength wavelength 2 q 1/2 h v part @ 20 ma [1] l peak (nm) l d [2] (nm) degrees [3] (lm/w) number color min. typ. typ. typ. typ. typ. hsma-c110 as amber 25 95 595 592 130 480 HSMA-C170/190/191/150 as amber 25 90 595 592 170 480 hsml-c110 as orange 25 95 609 605 130 370 hsml-c170/190/191/150 as orange 25 90 609 605 170 370 hsmc-c110 as red 25 95 637 626 130 155 hsmc-c170/190/191/150 as red 25 90 637 626 170 155 hsmz-c110 ts red 40 170 643 631 130 122 hsmz-c170/190 ts red 40 165 643 631 170 122 notes: 1. the luminous intensity, i v , is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. the dominant wavelength, l d , is derived from the cie chromaticity diagram and represents the perceived color of the device. 3. q 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. electrical characteristics t a = 25 c forward voltage reverse breakdown capacitance c thermal v f (volts) v r (volts) (pf), v f = 0, resistance @ i f = 20 ma @ i r = 100 m a f = 1 mhz r q j-pin = ( c/w) parameter number typ. max. min. typ. typ. hsma-c110 1.9 2.4 5 45 600 hsml-c110 1.9 2.4 5 45 600 hsmc-c110 1.9 2.4 5 45 600 hsmz-c110 2.2 2.6 5 35 600 HSMA-C170/190/191/150 1.9 2.4 5 45 300 hsml-c170/190/191/150 1.9 2.4 5 45 300 hsmc-c170/190/191/150 1.9 2.4 5 45 300 hsmz-c170/190 2.2 2.6 5 35 300
5 note: 1. bin categories are established for classification of products. products may not be available in all categories. please contact your agilent rep- resentative for information on currently available bins. note: 1. bin categories are established for classification of products. products may not be available in all categories. please contact your agilent representative for information on currently available bins. orange color bins [1] dom. wavelength (nm) bin id min. max. a 597.0 600.0 b 600.0 603.0 c 603.0 606.0 d 606.0 609.0 e 609.0 612.0 f 612.0 615.0 tolerance: 1 nm. yellow/amber color bins [1] dom. wavelength (nm) bin id min. max. a 582.0 584.5 b 584.5 587.0 c 587.0 589.5 d 589.5 592.0 e 592.0 594.5 f 594.5 597.0 tolerance: 0.5 nm. light intensity (iv) bin limits [1] intensity (mcd) intensity (mcd) bin id min. max. bin id min. max. a 0.11 0.18 n 28.50 45.00 b 0.18 0.29 p 45.00 71.50 c 0.29 0.45 q 71.50 112.50 d 0.45 0.72 r 112.50 180.00 e 0.72 1.10 s 180.00 285.00 f 1.10 1.80 t 285.00 450.00 g 1.80 2.80 u 450.00 715.00 h 2.80 4.50 v 715.00 1125.00 j 4.50 7.20 w 1125.00 1800.00 k 7.20 11.20 x 1800.00 2850.00 l 11.20 18.00 y 2850.00 4500.00 m 18.00 28.50 tolerance: 15%. color bin limits [1]
6 figure 3. luminous intensity vs. forward current. figure 2. forward current vs. forward voltage. 100 10 1 0.1 1.5 1.7 1.9 2.1 2.5 v f ?forward voltage ?v i f ?forward current ?ma ts alingap 2.3 as alingap 0 5 15 30 i f ?forward current ?ma 0 0.4 1.0 1.4 luminous intensity (normalized at 20 ma) 20 0.6 0.2 0.8 10 25 1.2 0 35 0 20 60 80 100 5 i f max. ?maximum forward current ?ma t a ?ambient temperature ?? 40 15 25 30 10 20 r q j-a = 800?/w r q j-a = 600?/w r q j-a = 500?/w figure 4. maximum forward current vs. ambient temperature. figure 1. relative intensity vs. wavelength. wavelength ?nm ts alingap red as alingap amber relative intensity 1.0 0.5 0 500 550 600 650 700 750 as alingap orange as alingap red
7 figure 5. relative intensity vs. angle for hsmx-c110. relative intensity 1.00 0 angle 0.80 0.60 0.50 0.70 0.20 0.10 0.30 0.40 0.90 -70 -50 -30 0 2030507090 -90 -20 -80 -60 -40 -10 10 40 60 80 relative intensity 1.00 0 angle 0.80 0.60 0.50 0.70 0.20 0.10 0.30 0.40 0.90 -70 -50 -30 0 2030507090 -90 -20 -80 -60 -40 -10 10 40 60 80 figure 6. relative intensity vs. angle for hsmx-c170, c190, c191, and c150. relative intensity 1.00 0 angle 0.80 0.60 0.50 0.70 0.20 0.10 0.30 0.40 0.90 -70 -50 -30 0 2030507090 -90 -20 -80 -60 -40 -10 10 40 60 80
8 230? max. 10 sec. max. 4?/sec. max. over 2 min. time temperature 4?/sec. max. 140-160? ??/sec. max. 1.2 (0.047) 1.2 (0.047) 0.9 (0.035) 1.2 (0.047) 0.8 (0.031) 0.8 (0.031) 0.7 (0.028) 0.8 (0.031) figure 7. recommended reflow soldering profile. figure 8. recommended soldering pattern for hsmx-c110. figure 9. recommended soldering pattern for hsmx-c170. figure 10. recommended soldering pattern for hsmx-c190 and c191. note: all dimensions in millimeters (inches). 5.0 (0.200) 1.0 (0.039) 1.5 (0.059) 1.5 (0.059) 2.0 (0.079) 0.9 (0.035) 0.2 (0.008) 0.9 (0.035) centering board figure 11. recommended soldering pattern for hsmx-c150. 1.5 (0.059) 1.5 (0.059) 1.5 (0.059) 2.0 (0.079)
9 figure 12. reeling orientation. cathode side printed label user feed direction 10.50 ?1.0 (0.413 ?0.039) 59.60 ?1.00 (2.346 ?0.039) 20.20 min. ( 0.795 min.) 6 ps 178.40 ?1.00 (7.024 ?0.039) 3.0 ?0.5 (0.118 ?0.020) 4.0 ?0.5 (0.157 ?0.020) 5.0 ?0.5 (0.197 ?0.020) 13.1 ?0.5 ( 0.516 ?0.020) 8.0 ?1.0 (0.315 ?0.039) figure 13. reel dimensions. note: all dimensions in millimeters (inches).
figure 14. tape dimensions. figure 15. tape leader and trailer dimensions. convective ir reflow soldering for more information on ir reflow soldering, refer to application note 1060, surface mounting smt led indicator components. storage condition: 5 to 30?c @ 60% rh max. baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week baking recommended condition: 60 +/C 5?c for 20 hours. 8.00 ?0.30 (0.315 ?0.012) user feed direction dim. a (see table 1) 3.50 ?0.05 (0.138 ?0.002) 1.75 (0.069) dim. c (see table 1) 0.20 ?0.05 (0.008 ?0.002) carrier tape cover tape dim. b (see table 1) 4.00 (0.157) 2.00 ?0.05 (0.079 ?0.002) 4.00 (0.157) 1.50 (0.059) table 1 dimensions in millimeters (inches) cathode dim. a ?0.10 (?0.004) dim. b ?0.10 (?0.004) part number dim. c ?0.10 (?0.004) hsmx-c170 series 2.40 (0.094) 1.60 (0.063) 1.20 (0.047) hsmx-c190 series 1.80 (0.071) 0.95 (0.037) 0.87 (0.034) hsmx-c110 series 3.40 (0.134) 1.70 (0.067) 1.20 (0.047) hsmx-c191 series 1.80 (0.071) 0.95 (0.037) 0.75 (0.030) hsmx-c150 series 3.75 (0.148) 2.10 (0.083) 1.30 (0.051) hsmx-c110 position in carrier tape dim. b (see table 1) dim. a (see table 1) r 1.0 ?0.05 (0.039 ?0.002) end start there shall be a minimum of 160 mm (6.3 inch) of empty component pockets sealed with cover tape. mounted with components there shall be a minimum of 160 mm (6.3 inch) of empty component pockets sealed with cover tape. minimum of 230 mm (9.05 inch) may consist of carrier and/or cover tape. notes: 1. all dimensions in millimeters (inches). 2. tolerance is ?0.1 mm (?0.004 in.) unless otherwise specified. 10
www.agilent.com/semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (408) 654-8675 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (+65) 271 2451 india, australia, new zealand: (+65) 271 2394 japan: (+81 3) 3335-8152(domestic/interna- tional), or 0120-61-1280(domestic only) korea: (+65) 271 2194 malaysia, singapore: (+65) 271 2054 taiwan: (+65) 271 2654 data subject to change. copyright ? 2002 agilent technologies, inc. obsoletes 5988-4259en march 11, 2002 5988-5891en

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