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specification part no. : MT5470C-OR 5.24.6 mm oval led lamp observe precaution for handling electro static sensitive devices attention 3 northway lane north latham, new york 12110 tollfree:1.800.984.5337 phone:1.518.956.2980 fax:1.518.785.4725 http://www .marktechopto.com
ver.: 01 date: 2010/10/22 page: 1 /5 description this a mber lamp is made with algainp/gaas chip and white diffused epoxy resin. ak 1.5 typ. 2.540.1 4.6 5.2 7.8 24.0 min. 0.5 max. notes: 1. all dimensions are in mm. 2. tolerance is ?0.25mm unless otherwise noted. description led chip part no. material emitting color lens color MT5470C-OR a lgainp/gaas amber white diffused MT5470C-OR 5 .24.6mm oval led lamp
ver.: 01 date: 2010/10/22 page: 2 /5 absolute maximum ratings at ta=25
parameter symbol rating unit power dissipation p d 125 mw reverse voltage v r 5 v d.c. forward current if 50 ma reverse (leakage) current ir 100 ?a peak current(1/10duty cycle,0.1ms pulse width.) if(peak) 200 ma operating temperature range topr. -40 to +95
storage temperature range tstg. -40 to +100
soldering temperature(1.6mm from body) tsol. dip soldering : 260 for
5 sec. hand soldering : 350 for 3 sec.
electrical and optical characteristics: parameter symbol condition min. typ. max. unit luminous intensity i v if=20ma 1520 3000 mcd forward voltage vf if=20ma 2.1 2.5 v peak wavelength p if=20ma 610 nm dominant wavelength d if=20ma 600 605 609 nm reverse (leakage) current ir vr=5v 100 a vertical 21/2 if=20ma 30 viewingangle horizontal 21/2 if=20ma 60 deg spectrum line halfwidth ? if=20ma 17 nm notes: the datas tested by is tester. 2. customer?s special requirements are also welcome. MT5470C-OR 5 .24.6mm oval led lamp
MT5470C-OR 5.24.6mm oval led lamp ver.: 01 date: 2010/10/22 page: 3 /5 typical electrical / optica l characteristics curves : applied voltage (v) forward current vs.applied voltage forward current if(ma) 10 20 40 30 50 1.2 1.6 2.0 2.4 2.8 3.2 forward current (ma) forward current vs. luminous intensity temperature ( )
forward current vs. ambient temperature 0 20 40 60 10080 forward current if(ma) 20 40 80 60 100 3 kqjo
8 r j-a=450
/w radiation diagram 10 0.2 0.8 0.7 0.3 0.5 0.1 0.9 1.0 0 80 70 90 0.4 0.6 40 60 50 30 20 horizontal vertical 0.0 10.0 20.0 30.0 1000 2000 relative luminous intensity 3000 4000 5000
MT5470C-OR 5 .24.6mm oval led lamp ver.: 01 date: 2010/10/22 page: 4 /5 specifications for bin grading: iv(mcd) bin min. max. u 1520 2130 v 2130 3000 w 3000 4180 x 4180 5860 specifications for vf group: vf(v) group min. max. v1 1.6 1.8 v2 1.8 2.0 v3 2.0 2.2 v4 2.2 2.4 v5 2.4 2.6 *majority vf bins are highlighted in yellow. specifications for wavelength group: ?d(nm) @20ma group min . max. x2 600 603 x3 603 606 x4 606 609
MT5470C-OR 5.24.6mm oval led lamp ver.: 01 date: 2010/10/22 page: 5 /5 precautions: take note of the following in use of led 1. temperature in use since the light generated inside the led needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. consequently, the heat resistant ability of the resin used for led is usually low; therefore, please be careful on the following during use. avoid applying external force, stress, and excessi ve vibration to the resins and terminals at high temperature. the glass transition temperature of epoxy resin used for the led is approximately 120-130
. at a temperature exceeding this limit, the co efficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. if external force or stress is applied at that time, it may cause a wire rupture. 2. soldering please be careful on the following at soldering. after soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temp erature), (1) soldering measurements: distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) dip soldering : pre-heat: 90
max. (backside of pcb), within 60 seconds. solder bath: 260 ? 5
(solder temperature), within 5 seconds. (3) hand soldering: 350
max. (temperature of soldering iron tip), within 3 seconds. 3. insertion pitch of the led leads and pitch of mounting holes need to be same. 4. others since the heat resistant ability of the led re sin is low, smd components are used on the same pcb, please mount the led after adhesive baking process for smd components. in case adhesive baking is done after led lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the led and follow the conditions below. baking temperature: 120
max. baking time: within 60 seconds. if soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the led to normal temperature.

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