? semiconductor components industries, llc, 2005 september, 2005 ? rev. 1 1 publication order number: mbrm110l/d mbrm110l surface mount schottky power rectifier powermite ? power surface mount package the schottky powermite ? employs the schottky barrier principle with a barrier metal and epitaxial construction that produces optimal forward voltage drop?reverse cu rrent tradeoff. the advanced packaging techniques provide for a highly efficient micro miniature, space saving surface mount rectifier. with its unique heatsink design, the powermite ? has the same thermal performance as the sma while being 50% smaller in footprint area, and delivering one of the lowest height profiles, < 1.1 mm in the industry. because of its small size, it is ideal for use in portable and battery powered products such as cellular and cordless phones, chargers, notebook computers, printers, pdas and pcmcia cards. typical applications are ac?dc and dc?dc converters, reverse battery protection, and ?oring? of multiple supply voltages and any other application where performance and size are critical. features ? ultra low v f ? 1st in marketplace with a 10 v r schottky rectifier ? low profile ? maximum height of 1.1 mm ? small footprint ? footprint area of 8.45 mm 2 ? low thermal resistance with direct thermal path of die on exposed cathode heat sink ? esd protection: human body model >4000 v (class 3) machine model >400 v (class c) ? pb?free packages are available mechanical characteristics: ? powermite ? is jedec registered as d0?216aa ? case: molded epoxy ? epoxy meets ul 94 v?0 @ 0.125 in ? weight: 62 mg (approximately) ? lead and mounting surface temperature for soldering purposes: 260 c maximum for 10 seconds schottky barrier rectifier 1.0 amperes, 10 volts device package shipping ? ordering information mbrm110lt1 powermite 3000/tape & ree l mbrm110lt3 powermite 12000/tape & ree l MBRM110LT1G powermite (pb?free) 3000/tape & ree l mbrm110lt3g powermite (pb?free) 12000/tape & ree l ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specification s brochure, brd8011/d. powermite case 457 plastic cathode anode marking diagram m 1l1 m = date code 1l1 = device code = pb?free package http://onsemi.com
mbrm110l http://onsemi.com 2 maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 10 v average rectified forward current (t l = 115 c, r jl = 35 c/w) i o 1.0 a non?repetitive peak surge current (non?repetitive peak surge current, halfwave, single phase, 60 hz) i fsm 50 a storage temperature t stg ?55 to 125 c operating junction temperature t j ?55 to 125 c voltage rate of change (rated v r , t j = 25 c) dv/dt 10,000 v/ s maximum ratings are those values beyond which device damage can occur. maximum ratings applied to the device are individual str ess limit values (not normal operating conditions) and are not valid simultaneously. if these limits are exceeded, device functional operation i s not implied, damage may occur and reliability may be affected. thermal characteristics rating symbol value unit thermal resistance, junction?to?lead (anode) (note 1) thermal resistance, junction?to?tab (cathode) (note 1) thermal resistance, junction?to?ambient (note 1) r tjl r tjtab r tja 35 23 277 c/w 1. mounted with minimum recommended pad size, pc board fr4, see figures 8 and 9. electrical characteristics maximum instantaneous forward voltage (note 2) v f t j = 25 c t j = 100 c v (i f = 0.1 a) (i f = 1.0 a) (i f = 2.0 a) 0.280 0.365 0.415 0.175 0.275 0.325 maximum instantaneous reverse current (note 2) i r t j = 25 c t j = 100 c ma (v r = 5.0 v) (v r = 10 v) 0.2 0.5 30 60 2. pulse test: pulse width 250 s, duty cycle 2%. figure 1. typical forward voltage figure 2. maximum forward voltage v f , instantaneous forward voltage (volts) 10 1 i f , instantaneous forward current (amps) 0.1 0.3 0.1 0.2 0.4 0.6 0.5 0.7 100 c t j = 125 c 75 c 25 c ?55 c v f , instantaneous forward voltage (volts) 10 1 i f , instantaneous forward current (amp s) 0.1 0.3 0.1 0.2 0.4 0.6 0.5 0. 7 100 c t j = 125 c 75 c 25 c ?55 c
mbrm110l http://onsemi.com 3 figure 3. typical reverse current figure 4. maximum reverse current 0 v r , reverse voltage (volts) 1e?5 1e?6 2 14 36 58 710 9 1e?3 1e?4 1e?1 1e?2 100 c t j = 125 c 75 c 25 c 0 v r , reverse voltage (volts) 1e?5 2 14 36 58 71 0 9 1e?3 1e?4 1e?1 1e?2 100 c t j = 125 c 75 c 25 c i r , instantaneous reverse voltage (volts) i r , instantaneous reverse voltage (volts) 1e+0 figure 5. current derating ? junction to lead 20 0 t l , lead temperature ( c) 1.8 1.2 1.0 0.8 0.2 0 40 , average forward current (amps) i f 1.4 1.6 square wave dc 0.6 0.4 60 80 100 120 140 figure 6. typical capacitance figure 7. forward power dissipation 0 v r , reverse voltage (volts) 300 100 i o , average forward current (amps) 0.6 0 0.1 0.05 0 c, capacitance (pf) 2 13 0.8 0.2 0.4 6 45 0.15 0.2 710 89 150 200 250 500 350 400 450 t j = 25 c f = 1 mhz 1.4 1.6 1.0 1.2 1.8 0.3 0.25 0.35 0.4 0.45 p fo , average power dissipation (watts) square wave dc
mbrm110l http://onsemi.com 4 t, time (s) 1.0 0.1 0.01 0.001 100 0.1 0.00001 1,000 0.0001 0.001 0.01 1.0 10 rtjl(t) = rtjl*r(t) 50% 20% 10% 5.0% 2.0% 1.0% figure 8. thermal response junction to lead 100 0.1 0.00001 t, time (s) 1.0 0.1 0.01 r 0.0001 0.001 0.01 1.0 10 0.001 , transient thermal resistance (normalized) (t) rtjl(t) = rtjl*r(t) 50% 20% 10% 5.0% 2.0% 1.0% r , transient thermal resistance (normalized) (t) figure 9. thermal response junction to ambient
mbrm110l http://onsemi.com 5 package dimensions powermite case 457?04 issue d dim min max min max inches millimeters a 1.75 2.05 0.069 0.081 b 1.75 2.18 0.069 0.086 c 0.85 1.15 0.033 0.045 d 0.40 0.69 0.016 0.027 f 0.70 1.00 0.028 0.039 h ?0.05 +0.10 ?0.002 +0.004 j 0.10 0.25 0.004 0.010 k 3.60 3.90 0.142 0.154 l 0.50 0.80 0.020 0.031 r 1.20 1.50 0.047 0.059 s notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash, protrusions or gate burrs shall not exceed 0.15 (0.006) per side. s b m 0.08 (0.003) c s t ?a? ?b? s j k ?t? h l j c d s b m 0.08 (0.003) c s t f term. 1 term. 2 r 0.50 ref 0.019 ref 2.54 0.100 0.635 0.025 1.27 0.050 2.67 0.105 0.762 0.030 mm inches scale 10:1 soldering footprint* *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2?9?1 kamimeguro, meguro?ku, tokyo, japan 153?0051 phone : 81?3?5773?3850 mbrm110l/d powermite is a registered trademark of and used under a license from microsemi corporation. literature fulfillment : literature distribution center for on semiconductor p.o. box 61312, phoenix, arizona 85082?1312 usa phone : 480?829?7710 or 800?344?3860 toll free usa/canada fax : 480?829?7709 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.
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