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IP4283CZ10
ESD protection for ultra high-speed interfaces
Rev. 01 -- 7 May 2009 Product data sheet
1. Product profile
1.1 General description
The IP4283CZ10 is designed to protect high-speed interfaces such as HDMI, DisplayPort, eSATA and LVDS against ElectroStatic Discharge (ESD). The device includes high-level ESD protection diodes for ultra high-speed signal lines and is available in two package variants: UTLP10 and TSSOP10. All signal lines are protected by a special diode configuration offering ultra-low line capacitance of only 0.6 pF. These diodes provide protection to downstream components from ESD voltages up to 8 kV contact according to IEC 61000-4-2, level 4.
1.2 Features
I Pb-free, RoHS compliant and free of Halogen and Antimony (Dark Green compliant) I System ESD protection for HDMI, DisplayPort, eSATA and LVDS I All signal lines with integrated rail-to-rail clamping diodes for downstream ESD protection of 8 kV according to IEC 61000-4-2, level 4 I Matched 0.5 mm trace spacing I Signal lines with 0.05 pF matching capacitance between signal pairs I Line capacitance of only 0.6 pF for each channel I 4-channel, UTLP10 or TSSOP10 Pb-free package I HDMI 1.3a compliant I DisplayPort compliant I Design-friendly `pass-thru' signal routing
1.3 Applications
The IP4283CZ10 is designed for high-speed receiver and transmitter port protection: I TVs, monitors I DVD recorders and players I Notebooks, main board graphics cards and ports I Set-top boxes and game consoles
NXP Semiconductors
IP4283CZ10
ESD protection for ultra high-speed interfaces
2. Pinning information
Table 1. Pin 1 2 3 4 5 6 7 8 9 10 Pinning Description negative channel 1 ESD protection positive channel 1 ESD protection ground negative channel 2 ESD protection positive channel 2 ESD protection not connected not connected ground not connected not connected
5 6 1 10
Symbol TMDS_CH1- TMDS_CH1+ GND TMDS_CH2- TMDS_CH2+ n.c. n.c. GND n.c. n.c.
Simplified outline
10 6
Graphic symbol
1 2 4 5
2
9
3
8 3, 8
001aai619
4
7 1 5
TSSOP10
Transparent top view
XSON10U
3. Ordering information
Table 2. Ordering information Package Name IP4283CZ10-TB IP4283CZ10-TT XSON10U TSSOP10 Description plastic extremely thin small outline package; no leads; 10 terminals; UTLP based; body 1 x 2.5 x 0.5 mm plastic thin shrink small outline package; 10 leads; body width 3 mm Version SOT1059-1 SOT552-1 Type number
4. Limiting values
Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VI Vesd Parameter input voltage electrostatic discharge voltage all pins to ground; IEC 61000-4-2, level 4; contact discharge Conditions Min GND - 0.5 -8 Max +5.5 +8 Unit V kV
Tstg Tamb
storage temperature ambient temperature
-55 -40
+125 +85
C C
IP4283CZ10_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 7 May 2009
2 of 10
NXP Semiconductors
IP4283CZ10
ESD protection for ultra high-speed interfaces
5. Characteristics
Table 4. Characteristics Tamb = 25 C unless otherwise specified. Symbol VBRzd ILRzd VF Cch(TMDS) Cch(TMDS) Cch(mutual) Rdyn Parameter Zener diode breakdown voltage Zener diode reverse leakage current forward voltage TMDS channel capacitance mutual channel capacitance dynamic resistance f = 1 MHz; Vbias = 2.5 V between signal pin and pin n.c.; f = 1 MHz; Vbias = 2.5 V I = 1 A; Tamb = 25 C positive transient negative transient VCL(ch)trt(pos) positive transient channel clamping voltage
[1] [2] [3] This parameter is guaranteed by design. Human Body Model according to JESD22-A-J114D. According to IEC 61000-4-5/9.
[1] [1] [1]
Conditions I = 1 mA per TMDS channel; V = 3.0 V
Min 6 -
Typ 0.7 0.6
Max Unit 9 1 V A V pF pF pF
TMDS channel capacitance difference f = 1 MHz; Vbias = 2.5 V
0.05 0.07 -
[3]
[2]
2.4 1.3 8
-
V
Vesd = 8 kV HBM; Tamb = 25 C
-
IP4283CZ10_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 7 May 2009
3 of 10
NXP Semiconductors
IP4283CZ10
ESD protection for ultra high-speed interfaces
6. Application information
The IP4283CZ10 is designed mainly to provide high-level ESD protection for high-speed serial data buses such as HDMI, DisplayPort, eSATA and LVDS data lines. It is recommended that when designing the printed-circuit board, careful consideration is given to impedance matching, and signal coupling. A basic application diagram for the ESD protection of an HDMI interface is shown in Figure 1 and Figure 2 for package versions TB and TT respectively.
IP4283CZ10-TB
5 4 8 3 2 1 TMDS_CH2+
TMDS_D2+ TMDS_GND TMDS_CH2- TMDS_D2- GND TMDS_D1+ TMDS_CH1+ TMDS_GND TMDS_CH1- TMDS_D1- TMDS_D0+ 5 4 TMDS_CH2+ TMDS_GND TMDS_CH2- TMDS_D0- GND TMDS_CLK+ TMDS_CH1+ TMDS_GND TMDS_CH1- TMDS_CLK- CEC n.c. DDC_CLK DDC_DAT GND +5 V HOT PLUG DETECTION HDMI CONNECTOR
IP4283CZ10-TB
8
3 2 1
6
5
4
100 nF
IP4221CZ6
1 2 3
001aaj793
Fig 1.
Application diagram of HDMI ESD protection using IP4283CZ10-TB
IP4283CZ10_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 7 May 2009
4 of 10
NXP Semiconductors
IP4283CZ10
ESD protection for ultra high-speed interfaces
IP4283CZ10-TT
TMDS_D2+
TMDS_D2+ TMDS_GND
TMDS_D2- TMDS_D2- TMDS_D1+ TMDS_D1+ TMDS_GND TMDS_D1- TMDS_D1-
IP4283CZ10-TT
TMDS_D0+
TMDS_D0+ TMDS_GND
TMDS_D0- TMDS_D0- TMDS_CLK+ TMDS_CLK+ TMDS_GND TMDS_CLK1- TMDS_CLK- CEC n.c. DDC_CLK DDC_DAT GND +5 V HOT PLUG DETECTION HDMI CONNECTOR
IP4220CZ10
100 nF
001aaj794
Fig 2.
Application diagram of HDMI ESD protection using IP4283CZ10-TT
IP4283CZ10_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 7 May 2009
5 of 10
NXP Semiconductors
IP4283CZ10
ESD protection for ultra high-speed interfaces
7. Package outline
XSON10U: plastic extremely thin small outline package; no leads; 10 terminals; UTLP based; body 1 x 2.5 x 0.5 mm
SOT1059-1
D
B
A
E
A A1
terminal 1 index area detail X
e1 L1
1
e
b
5
v w
M M
CAB C
C y1 C y
L2 e2 L
10 6
X
0
0.5 scale
1 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max 0.5 A1 0.05 0.00 b 0.25 0.15 D 2.6 2.4 E 1.1 0.9 e 0.5 e1 2 e2 0.6 L 0.4 0.2 L1 0.15 0.00 L2 0.45 0.25 v 0.1 w 0.05 y 0.05 y1 0.1
OUTLINE VERSION SOT1059-1
REFERENCES IEC --JEDEC JEITA ---
EUROPEAN PROJECTION
ISSUE DATE 07-12-20 08-01-18
Fig 3.
IP4283CZ10_1
Package outline SOT1059-1 (XSON10U)
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 7 May 2009
6 of 10
NXP Semiconductors
IP4283CZ10
ESD protection for ultra high-speed interfaces
TSSOP10: plastic thin shrink small outline package; 10 leads; body width 3 mm
SOT552-1
D
E
A
X
c y HE vMA
Z
10
6
A2 pin 1 index
A1
(A3)
A
Lp L
1
e bp
5
detail X wM
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.15 c 0.23 0.15 D (1) 3.1 2.9 E (2) 3.1 2.9 e 0.5 HE 5.0 4.8 L 0.95 Lp 0.7 0.4 v 0.1 w 0.1 y 0.1 Z (1) 0.67 0.34 6 0
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT552-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-07-29 03-02-18
Fig 4.
IP4283CZ10_1
Package outline SOT552-1 (TSSOP10)
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 7 May 2009
7 of 10
NXP Semiconductors
IP4283CZ10
ESD protection for ultra high-speed interfaces
8. Abbreviations
Table 5. Acronym DVD eSATA ESD HBM HDMI LVDS RoHS TMDS UTLP Abbreviations Description Digital Versatile Disc external Serial Advanced Technology Attachment ElectroStatic Discharge Human Body Model High-Definition Multimedia Interface Low-Voltage Differential Signaling Restriction of Hazardous Substances Transition Minimized Differential Signaling Ultra-Thin Leadless Package
9. Revision history
Table 6. Revision history Release date 20090507 Data sheet status Product data sheet Change notice Supersedes Document ID IP4283CZ10_1
IP4283CZ10_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 7 May 2009
8 of 10
NXP Semiconductors
IP4283CZ10
ESD protection for ultra high-speed interfaces
10. Legal information
10.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
10.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk.
10.4 Licenses
Purchase of NXP ICs with HDMI technology Use of an NXP IC with HDMI technology in equipment that complies with the HDMI standard requires a license from HDMI Licensing LLC, 1060 E. Arques Avenue Suite 100, Sunnyvale CA 94085, USA, e-mail: admin@hdmi.org.
10.5 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
11. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
IP4283CZ10_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 7 May 2009
9 of 10
NXP Semiconductors
IP4283CZ10
ESD protection for ultra high-speed interfaces
12. Contents
1 1.1 1.2 1.3 2 3 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 10.5 11 12 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Application information. . . . . . . . . . . . . . . . . . . 4 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Contact information. . . . . . . . . . . . . . . . . . . . . . 9 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 7 May 2009 Document identifier: IP4283CZ10_1

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