Part Number Hot Search : 
STD9N10L ADREF02H BZX83C15 VDC1110 Z84C4204 Z84C4406 MTE2050 LY2ZL2
Product Description
Full Text Search
 

To Download TDA18260HN Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 TDA18260HN
Dual cable Silicon Tuner
Rev. 2 -- 14 December 2010 Preliminary data sheet
1. General description
The TDA18260HN is a dual Silicon Tuner IC designed specifically for high definition multi-tuner cable Set Top Boxes (STBs) supporting single streaming and multi-streaming PVR STBs with watch, record, video-on-demand and in-home video distribution capability. Used in conjunction with the TDA10025HN (dual digital channel demodulator), the TDA18260HN covers all worldwide digital cable standards.
* The TDA18260HN ensures a low system cost as:
- Costly components such as low noise amplifiers, Surface Acoustic Wave (SAW) filters and incremental crystal oscillators have been eliminated from the system Bill Of Materials (BOM)
* The TDA18260HN high performance Silicon Tuner meets today's digital cable TV
reception needs with: - Matched performance levels for master and slave tuners - Low power consumption - High linearity - Low noise figure
* The TDA18260HN ensures ease of use with:
- Easy on-board integration - Efficient and effective PCB design - Reduced external components
2. Features and benefits
Supports up to three tuner functions (up to six individual streams) specifically aimed for gateways and STBs: Two low IF outputs Two RF outputs to drive slave tuners Integrated splitter eases and simplifies the design of dual Tuner PVR Integrated wideband gain control Extended frequency coverage up to 1002 MHz Single 3.3 V power supply Low power consumption Multistandard cable receptions Enhanced Band-pass filter to reduce in band third and fifth signal harmonics Enhanced RF filters to increase selectivity and adjacent channels filtering, especially enhanced immunity for MoCA coexistence
NXP Semiconductors
TDA18260HN
Dual cable Silicon Tuner
RF Loop-Through (LT) Fully integrated IF selectivity, eliminates external SAW filters Fully integrated oscillators: No external oscillator components for reduced cost 16 MHz crystal oscillator output buffer for single crystal applications I2C-bus provides: 3.3 V microcontroller compatibility Received Signal Strength Indicator (RSSI) data access Die temperature sensor data access Lead-free (Pb) manufacturing
3. Quick reference data
Table 1. Symbol fRF NFtun n Quick reference data Parameter RF frequency tuner noise figure phase noise Conditions edge maximum gain RF frequency range, worst case 10 kHz 100 kHz VL(tun-RF) CSO CTB P image leakage voltage between tuner and RF composite second-order distortion composite triple beat power dissipation image rejection measured at IF frequency = 4 MHz at RF input; in RF TV band
[1]
Min 51 3
Typ 6.0 85 107 10 64 60 1.6 -
Max 1002
Unit MHz
dB +8 dBc/Hz dBc/Hz dBV
dBc dBc +3 W dB dB
[1]
62
RSSIacc(abs) absolute accuracy of received only one channel at RF input; channel signal strength indicator level from 15 dBmV to +15 dBmV; calibration done at 0 dBmV RSSIacc(rel) relative accuracy of received signal strength indicator only one channel at RF input; channel level from 15 dBmV to +15 dBmV
0.5
-
+0.5
dB
[1]
Channel loading assumptions: 135 channels (NTSC 135 frequency plan) at 75 dBV.
4. Ordering information
Table 2. Ordering information Package Name Description Version SOT619-1 Type number
TDA18260HN/C1 HVQFN48 plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 7 0.85 mm
TDA18260HN_SDS
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Preliminary data sheet
Rev. 2 -- 14 December 2010
2 of 8
NXP Semiconductors
TDA18260HN
Dual cable Silicon Tuner
5. Block diagram
SCL_A M/S 48 39 I2C-BUS INTERFACE
RF filter 1 AGC1 bis RF filter 2 IF mixer SELECTIVITY IF AGC
VIFAGC_A SDA_A 38 37
BUFFER
AGC2
36 35 45
IFO_P_A IFO_N_A CPLO_A VTLO_A
AGC1
RF_IN
6
LEVEL CONTROL
SYNTHESIZER
44
LEVEL CONTROL LT MTO1 MTO2 7 8 5
34 CRYSTAL OSCILATOR 33 31 30
XTO_P XTO_N XTAL_P XTAL_N
17 LEVEL CONTROL SYNTHESIZER 16 26 25
BUFFER RF filter 1 AGC1 bis AGC2 RF filter 2 mixer IF SELECTIVITY IF AGC
VTLO_B CPLO_B IFO_N_B IFO_P_B
I2C-BUS INTERFACE
TDA18260HN
13 AS
22
23
24
001aal953
SDA_B SCL_B VIFAGC_B
Fig 1.
Block diagram
TDA18260HN_SDS
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Preliminary data sheet
Rev. 2 -- 14 December 2010
3 of 8
NXP Semiconductors
TDA18260HN
Dual cable Silicon Tuner
6. Limiting values
Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC VI Tstg Tj VESD Parameter supply voltage input voltage storage temperature junction temperature electrostatic discharge voltage EIA/JESD22-A114 (HBM) EIA/JESD22-C101-C (FCDM)
[1] It withstands class IV of JEDEC standard.
[1]
Conditions VCC < 3.3 V VCC > 3.3 V
Min 0.3 0.3 0.3 40 2.5 1.5
Max +3.6 VCC + 0.3 +3.6 +150 +120 -
Unit V V V C C kV kV
7. Abbreviations
Table 4. Acronym AGC FCDM HBM IC IF MoCA NTSC PCB PVR RF SAW Abbreviations Description Automatic Gain Control Field-Induced Charged-Device Model Human Body Model Integrated Circuit Intermediate Frequency Multimedia over Coax Alliance National Television System Committee Printed Circuit Board Personal Video Recorder Radio Frequency Surface Acoustic Wave
8. Revision history
Table 5. Revision history Release date v.2[1] 20101214 Data sheet status Preliminary data sheet Change notice Supersedes Document ID TDA18260HN_SDS
[1]
SDS Revision 1 is not available.
TDA18260HN_SDS
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Preliminary data sheet
Rev. 2 -- 14 December 2010
4 of 8
NXP Semiconductors
TDA18260HN
Dual cable Silicon Tuner
9. Legal information
9.1 Data sheet status
Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
9.2
Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification -- The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). NXP does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
(c) NXP B.V. 2010. All rights reserved.
9.3
Disclaimers
Limited warranty and liability -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or
TDA18260HN_SDS
All information provided in this document is subject to legal disclaimers.
Preliminary data sheet
Rev. 2 -- 14 December 2010
5 of 8
NXP Semiconductors
TDA18260HN
Dual cable Silicon Tuner
NXP Semiconductors' specifications such use shall be solely at customer's own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors' standard warranty and NXP Semiconductors' product specifications.
Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products -- Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors' warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond
9.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus -- logo is a trademark of NXP B.V. Silicon Tuner -- is a trademark of NXP B.V.
10. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
TDA18260HN_SDS
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Preliminary data sheet
Rev. 2 -- 14 December 2010
6 of 8
NXP Semiconductors
TDA18260HN
Dual cable Silicon Tuner
11. Tables
Table 1. Table 2. Table 3. Quick reference data . . . . . . . . . . . . . . . . . . . . .2 Ordering information . . . . . . . . . . . . . . . . . . . . .2 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . .4 Table 4. Table 5. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 4
12. Figures
Fig 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
TDA18260HN_SDS
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Preliminary data sheet
Rev. 2 -- 14 December 2010
7 of 8
NXP Semiconductors
TDA18260HN
Dual cable Silicon Tuner
13. Contents
1 2 3 4 5 6 7 8 9 9.1 9.2 9.3 9.4 10 11 12 13 General description . . . . . . . . . . . . . . . . . . . . . . Features and benefits . . . . . . . . . . . . . . . . . . . . Quick reference data . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 2 2 3 4 4 4 5 5 5 5 6 6 7 7 8
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 14 December 2010 Document identifier: TDA18260HN_SDS


▲Up To Search▲   

 
Price & Availability of TDA18260HN

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X