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| IC497 Series Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Mating Cycles: Pin Count: Dual Inline Memory Module (DIMM, 144 pins) Part Number (Details) 1,000M W min. at 500V DC 700V AC for 1 minute 30m W max. at 10mA/20mV max. -55C to +170C 10,000 insertions min. 144 contact pins IC-497 - 1 - * - MF Series No. Design No. Positioning Detail (see Section "A") MF = Flanged Unmarked = Not Flanged Materials and Finish Housing: Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Features i Card thickness 1.00mm i 4 different positioning indicators Outline Socket Dimensions Recommended PC Board Layout Top View from Socket 101.00 0.2 30.10 0.05 0.1 AE3.20 + 0 30.50 0.05 0.80x41=32.80 0.2 0.80 0.05 30.10 0.05 0.80x29=23.20 0.1 AE3.20 + 0.1 0 101.00 0.1 30.50 0.05 0.80x41=32.80 0.1 0.80 0.05 (0.40) 4.60 0.1 144-AE0.80 + 0.1 0 0.80x29=23.20 0.2 (4.600.1) (0.40) 17.00 13.00 7.700.05 4.500.05 0.80x29=23.20 0.2 30.50 0.1 0.80x41=32.80 0.2 30.10 0.1 63.50 0 + 0.2 67.80 0 92.00 0.4 110.00 0.4 (91.50) (65.00) R 0.50 + 0.2 0.80 0.05 0.80x29=23.20 0.1 30.50 0.05 (0.40) 0.80x41=32.80 0.1 30.10 0.05 17.70 0.1 6.00 (36.50) 0.3 11.00 + 0 R 1.70 Matching Module Dimensions 2.00 min 4.00 Section "A" R 2.00 (25.40~38.10) 3.50 0.5 4.00 0.1 2.55 Positioning Details Section "A" 1.35 2.10 R - 0.55 20.00 w0.30 x t0.30 0.80 0.80 0.80x29=23.20 27.80 0.05 67.60 0.15 0.80x41=32.80 3.70 1.00 0.1 3.80 max 3.30 1.10 0 - 0.1 0.80 3.70 27.80 0.05 0.80x29=23.20 0.80x41=32.80 3.30 IC-497-1-1-** IC-497-1-2-** 0.80 see Sec. "A" 1.50 0.1 0.80 2.85 Back IC-497-1-3-** IC-497-1-4-** B-2 Test & Burn-In SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER 3.20 Front 5.00 4.00 0.1 |
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