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| LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only OFFICE:7F.,NO.208,SEC.3,JHONGYANG Rd.,Tucheng City Taipei Hsien,Taiwan R.O.C TEL:(02)22677686(REP) FAX:(02)22675286,(02)22695616 TAPE AND BOX TYPE LED LAMPS LI2640/L19/TBS-1 DATA SHEET DOC. NO : REV. DATE : QW0905-LI2640/L19/TBS-1 A : 29 - Nov - 2004 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LI2640/L19/TBS-1 Page 1/5 Package Dimensions G H P2 5.90.3 H2 W2 18.00.5 H1 L W0 W1 W3 D P1 F P T LI2640/L19 2.9 3.1 3.3 4.3 5.90.3 1.5MAX 25.0MIN 1/4 .0.5 TYP 2.54TYP 1.0MIN Note : 1.All dimension are in millimeter tolerance is O 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LI2640/L19/TBS-1 Page 2/5 Absolute Maximum Ratings at Ta=25 J Ratings Parameter Symbol I Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Operating Temperature Storage Temperature Soldering Temperature IF IFP PD Ir Topr Tstg Tsol 30 120 100 10 -40 ~ +85 -40 ~ +100 Max 260J for 5 sec Max (2mm from body) mA mA mW UNIT g A J J Typical Electrical & Optical Characteristics (Ta=25 J ) PART NO MATERIAL Emitted COLOR Peak Spectral Forward voltage wave halfwidth @20mA(V) length f nm f Pnm Luminous intensity @10mA(mcd) Viewing angle 2c 1/2 (deg) Lens Min. Max. Min. Typ. LI2640/L19/TBS-1 GaAsP/GaP Orange Red Diffused 635 45 1.7 2.6 8.0 20 40 Note : 1.The forward voltage data did not including O 0.1V testing tolerance. 2. The luminous intensity data did not including O 15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LI2640/L19/TBS-1 E Dimension Symbol Information SPECIFICATIONS SYMBOL ITEMS OPTION SYMBOL CODE ------- Page 3/5 Minimum mm inch 0.15 0.09 ------- Maximum mm 4.2 3.0 2.0 18.5 36 11 inch 0.17 0.12 0.08 0.73 1.42 0.43 0.51 0.23 0.3 0.06 0.38 0.61 0.16 0.75 Tape Feed Hole Diameter Component Lead Pitch Front-To-Rear Deflection Feed Hole To Bottom Of Component Feed Hole To Overall Component Height Lead Length After Component Height Feed Hole Pitch Lead Location Center Of Component Location Overall Taped Package Thickness Feed Hole Location Adhesive Tape Width Adhesive Tape Position Tape Width D F 3.8 2.3 ------- ------- ------- H H1 H2 L P P1 P2 T TBS-1 ------- 17.5 ------- 0.69 ------- ------------- W0 12.4 4.4 5.1 ------- 0.49 0.17 0.2 ------- 13 5.8 7.7 1.42 9.75 15.5 4.0 19 ------- ------- ------- ------- W0 W1 W2 W3 8.5 14.5 0 17.5 0.33 0.57 0 0.69 ------- ------- ------- REMARK:TBS=Tape And Box Straight Leads E Dimensions Symbol Information Specification Description Symbol minimum mm Overall Length Overall Width Overall Thickness L W H 330 265 50 inch 13.0 10.4 1.97 maxmum E Package Dimensions W mm 340 275 60 inch 13.4 10.8 2.4 L H Quantity/Box 2500PCS LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LI2640/L19/TBS-1 Page4/5 Typical Electro-Optical Characteristics Curve E CHIP Fig.1 Forward current vs. Forward Voltage 1000 Fig.2 Relative Intensity vs. Forward Current 3.0 Forward Current(mA) 100 Relative Intensity Normalize @20mA 1.0 2.5 2.0 1.5 1.0 0.5 0.0 10 1.0 0.1 2.0 3.0 4.0 5.0 1.0 10 100 1000 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 Forward Current(mA) Fig.4 Relative Intensity vs. Temperature 3.0 Relative Intensity@20mA Normalize @25J Forward Voltage@20mA Normalize @25J 1.1 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 Ambient Temperature(J ) Ambient Temperature(J ) Fig.5 Relative Intensity vs. Wavelength Fig.6 Directive Radiation Relative Intensity@20mA 1.0 0.5 0.0 550 600 650 700 750 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LI2640/L19/TBS-1 Page 5/5 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test 1.Ta=105 JO 5J 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 JO 5J 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65JO 5J 2.RH=90 %~95% 3.t=240hrs O 2hrs The purpose of this test is the resistance of the device under tropical for hous. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 JO 5J &-40JO (10min) (10min) 2.total 10 cycles 5J The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 JO 5J 2.Dwell time= 10 O 1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 JO 5J 2.Dwell time=5 O 1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 |
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