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| CMT14N50 POWER FIELD EFFECT TRANSISTOR GENERAL DESCRIPTION This high voltage MOSFET uses an advanced termination scheme to provide enhanced voltage-blocking capability without degrading performance over time. In addition, this advanced MOSFET is designed to withstand high energy in avalanche and commutation modes. The new energy efficient design also offers a drain-to-source diode with a fast recovery time. Designed for high voltage, high speed switching applications in power supplies, converters and PWM motor controls, these devices are particularly well suited for bridge circuits where diode speed and commutating safe operating areas are critical and offer additional and safety margin against unexpected voltage transients. FEATURES Robust High Voltage Termination Avalanche Energy Specified Source-to-Drain Diode Recovery Time Comparable to a Discrete Fast Recovery Diode Diode is Characterized for Use in Bridge Circuits IDSS and VDS(on) Specified at Elevated Temperature PIN CONFIGURATION TO-220F Top View SYMBOL D SOURCE GATE DRAIN G S N-Channel MOSFET 1 2 3 ABSOLUTE MAXIMUM RATINGS Rating Drain to Current Continuous Pulsed Gate-to-Source Voltage Continue Non-repetitive Total Power Dissipation Derate above 25 Operating and Storage Temperature Range Single Pulse Drain-to-Source Avalanche Energy TJ = 25 (VDD = 100V, VGS = 10V, IL = 14A, L = 6mH, RG = 25) Thermal Resistance Junction to Case Junction to Ambient Maximum Lead Temperature for Soldering Purposes, 1/8" from case for 10 seconds JC JA TL 3.6 62.5 260 /W TJ, TSTG EAS Symbol ID IDM VGS VGSM PD Value 14 56 30 40 35 0.28 -55 to 150 588 V V W W/ mJ Unit A 2009/07/17 Rev1.2 Champion Microelectronic Corporation Page 1 CMT14N50 POWER FIELD EFFECT TRANSISTOR ORDERING INFORMATION Part Number CMT14N50GN220F* *Note: G : Suffix for PB Free Product Package TO-220F ELECTRICAL CHARACTERISTICS Unless otherwise specified, TJ = 25. CMT14N50 Typ Characteristic Drain-Source Breakdown Voltage (VGS = 0 V, ID = 250 A) Drain-Source Leakage Current (VDS = 500 V, VGS = 0 V) (VDS = 400 V, VGS = 0 V, TJ = 125) Gate-Source Leakage Current-Forward (Vgsf = 30 V, VDS = 0 V) Gate-Source Leakage Current-Reverse (Vgsr = -30 V, VDS = 0 V) Gate Threshold Voltage (VDS = VGS, ID = 250 A) Static Drain-Source On-Resistance (VGS = 10 V, ID = 7A) * Drain-Source On-Voltage (VGS = 10 V) (ID = 7 A) Forward Transconductance (VDS = 50 V, ID = 8.4A) * Input Capacitance (VDS = 25 V, VGS = 0 V, Output Capacitance f = 1.0 MHz) Reverse Transfer Capacitance Turn-On Delay Time (VDD = 250 V, ID = 7 A, Rise Time RD = 17, Turn-Off Delay Time RG = 6.2) * Fall Time Total Gate Charge (VDS = 400 V, ID = 7 A, Gate-Source Charge VGS = 10 V)* Gate-Drain Charge Internal Drain Inductance (Measured from the drain lead 0.25" from package to center of die) Internal Drain Inductance (Measured from the source lead 0.25" from package to source bond pad) SOURCE-DRAIN DIODE CHARACTERISTICS Forward On-Voltage(1) (IS =7 A, VGS = 0 V, Forward Turn-On Time dIS/dt = 100A/s) Reverse Recovery Time * Pulse Test: Pulse Width 300s, Duty Cycle 2% Symbol V(BR)DSS IDSS Min 500 Max Units V A IGSSF IGSSR VGS(th) RDS(on) VDS(on) gFS Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd LD LS 9.3 2038 307 10 15 36 35 29 2.0 1 3 100 100 4.0 0.34 7.5 nA nA V V mhos pF pF pF ns ns ns ns 64 16 26 5.0 13 nC nC nC nH nH VSD ton trr 1.5 ** 487 731 V ns ns ** Negligible, Dominated by circuit inductance 2009/07/17 Rev1.2 Champion Microelectronic Corporation Page 2 CMT14N50 POWER FIELD EFFECT TRANSISTOR TYPICAL ELECTRICAL CHARACTERISTICS 2009/07/17 Rev1.2 Champion Microelectronic Corporation Page 3 CMT14N50 POWER FIELD EFFECT TRANSISTOR 2009/07/17 Rev1.2 Champion Microelectronic Corporation Page 4 CMT14N50 POWER FIELD EFFECT TRANSISTOR 2009/07/17 Rev1.2 Champion Microelectronic Corporation Page 5 CMT14N50 POWER FIELD EFFECT TRANSISTOR 2009/07/17 Rev1.2 Champion Microelectronic Corporation Page 6 CMT14N50 POWER FIELD EFFECT TRANSISTOR PACKAGE DIMENSION TO-220F 2009/07/17 Rev1.2 Champion Microelectronic Corporation Page 7 CMT14N50 POWER FIELD EFFECT TRANSISTOR IMPORTANT NOTICE Champion Microelectronic Corporation (CMC) reserves the right to make changes to its products or to discontinue any integrated circuit product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information being relied on is current. A few applications using integrated circuit products may involve potential risks of death, personal injury, or severe property or environmental damage. CMC integrated circuit products are not designed, intended, authorized, or warranted to be suitable for use in life-support applications, devices or systems or other critical applications. Use of CMC products in such applications is understood to be fully at the risk of the customer. In order to minimize risks associated with the customer's applications, the customer should provide adequate design and operating safeguards. HsinChu Headquarter 5F-1, No. 11, Park Avenue II, Science-Based Industrial Park, HsinChu City, Taiwan T E L : +886-3-567 9979 F A X : +886-3-567 9909 Sales & Marketing 21F., No. 96, Sec. 1, Sintai 5th Rd., Sijhih City, Taipei County 22102, Taiwan, R.O.C. T E L : +886-2-2696 3558 F A X : +886-2-2696 3559 2009/07/17 Rev1.2 Champion Microelectronic Corporation Page 8 |
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