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 HTT1129E
Silicon NPN Epitaxial Twin Transistor
REJ03G0840-0200 (Previous ADE-208-1541A) Rev.2.00 Aug.10.2005
Features
* Include 2 transistors in a small size SMD package: EMFPAK-6 (6 Leads: 1.2 x 0.8 x 0.5 mm)
Q1: Equivalent Buffer transistor 2SC5849 2SC5872 Q2: Equivalent OSC transistor
Outline
RENESAS Package code: PXSF0006LA-A (Package name: EMFPAK-6)
Pin Arrangement
6
5
4
B1 6
Q1
E2 5
Q2
B2 4
1. Collector Q1 2. Emitter Q1 3. Collector Q2 4. Base Q2 5. Emitter Q2 6. Base Q1
1
2
3
C1
1
E1
2
C2
3
Note:
Marking is "Z".
Rev.2.00 Aug 10, 2005 page 1 of 8
HTT1129E
Absolute Maximum Ratings
(Ta = 25C)
Item Symbol Ratings Q1 15 6 1.5 80 Q2 15 6 0.8 50 Unit V V V mA mW C C
Collector to base voltage VCBO Collector to emitter voltage VCEO Emitter to base voltage VEBO Collector current IC Collector power dissipation PC Junction temperature Tj Storage temperature Tstg Note: *Value on PCB. (FR-4 (13 x 13 x 0.635 mm)).
Total 200* 150 150 -55 to +150 -50 to +150
Collector Power Dissipation Curve
Collector Power Dissipation Pc* (mW)
250 200
*Value on PCB. (FR-4 (13 x13 x 0.635 mm)) 2 devices total
150
100
50
0
50
100
150
200
Ambient temperature Ta (C)
Rev.2.00 Aug 10, 2005 page 2 of 8
HTT1129E
Q1 Electrical Characteristics
(Ta = 25C)
Item Collector to base breakdown voltage Collector cutoff current Collector cutoff current Emitter cutoff current DC current transfer ratio Reverse transfer capacitance Gain bandwidth product Forward transfer coefficient Noise figure Symbol V(BR)CBO ICBO ICEO IEBO hFE Cre fT |S21|2 NF Min 15 90 2 7 Typ 120 0.50 4 11 1.7 Max 0.1 0.1 0.1 140 0.65 2.3 Unit V A A A pF GHz dB dB Test conditions IC = 10 A, IE = 0 VCB = 15 V, IE = 0 VCE = 6 V, RBE = infinite VEB = 1.5 V, IC = 0 VCE = 1 V, IC = 5 mA VCB = 1 V, f = 1 MHz Emitter ground VCE = 1 V, IC = 5 mA, f = 1 GHz VCE = 1 V, IC = 5 mA, f = 900 MHz, S = L = 50
Q2 Electrical Characteristics
(Ta = 25C)
Item Collector to base breakdown voltage Collector cutoff current Collector cutoff current Emitter cutoff current DC current transfer ratio Reverse transfer capacitance Gain bandwidth product Forward transfer coefficient Noise figure Symbol V(BR)CBO ICBO ICEO IEBO hFE Cre fT |S21|2 NF Min 16 90 8 13 Typ 120 0.25 10 16 1.0 Max 0.1 0.1 0.1 140 0.35 1.6 Unit V A A A pF GHz dB dB Test conditions IC = 10 A, IE = 0 VCB = 15 V, IE = 0 VCE = 6 V, RBE = infinite VEB = 0.8 V, IC = 0 VCE = 1 V, IC = 5 mA VCB = 1 V, f = 1 MHz Emitter ground VCE = 1 V, IC = 5 mA, f = 1 GHz VCE = 1 V, IC = 5 mA, f = 900 MHz S = L = 50
Rev.2.00 Aug 10, 2005 page 3 of 8
HTT1129E
Q1 Main Characteristics
Typical Output Characteristics
20
180 A
Typical Forward Transfer Characteristics
25
160 A
Collector Current IC (mA)
Collector Current IC (mA)
16 12
140 A
120 A
VCE = 1 V 20
100 A
15
80 A
8
60 A
10
40 A
4
IB = 20 A
5
0
1
2
3
4
5
6
0
0.2
0.4
0.6
0.8
1.0
Collector to Emitter Voltage VCE (V) DC Current Transfer Ratio vs. Collector Current
Base to Emitter Voltage VBE (V)
Reverse Transfer Capacitance vs. Collector to Base Voltage
Reverse Transfer Capacitance Cre (pF)
200
1.0
DC Current Transfer Ratio hFE
VCE = 1 V
Emitter ground f = 1 MHz 0.8 0.6
100
0.4
0.2
0 0.1
1.0
10
100
0
0.5
1.0
1.5
2.0
Collector Current IC (mA)
Collector to Base Voltage VCB (V)
Gain Bandwidth Product vs. Collector Current
20
Noise Figure vs. Collector Current
5 VCE = 1 V f = 900 MHz
Gain Bandwidth Product fT (GHz)
f = 1 GHz 16
VCE = 3 V
4
12
Noise Figure NF (dB)
VCE = 2 V
3
8
2
4
VCE = 1 V
1
0 1
2
5
10
20
50
100
0 1 2 5 10 20 50 100
Collector Current IC (mA)
Collector Current IC (mA)
Rev.2.00 Aug 10, 2005 page 4 of 8
HTT1129E
S21 Parameter vs. Collector Current
20
f = 1 GHz
S21 Parameter |S21|2 (dB)
16
VCE = 2 V
12
VCE = 1 V
8
4
0 1
2
5
10
20
50
100
Collector Current IC (mA)
Rev.2.00 Aug 10, 2005 page 5 of 8
HTT1129E
Q2 Main Characteristics
Typical Output Characteristics
20
Typical Forward Transfer Characteristics
50
160 A
Collector Current IC (mA)
Collector Current IC (mA)
140 A
120 A
VCE = 1 V 40
16 12
100 A
30
80 A
8
60 A
20
40 A
4
IB = 20 A
10
0
1
2
3
4
5
6
0
0.2
0.4
0.6
0.8
1.0
Collector to Emitter Voltage VCE (V) DC Current Transfer Ratio vs. Collector Current
200
Base to Emitter Voltage VBE (V)
Reverse Transfer Capacitance vs. Collector to Base Voltage
Reverse Transfer Capacitance Cre (pF)
0.4 Emitter ground f = 1 MHz 0.3
DC Current Transfer Ratio hFE
VCE = 1 V
100
0.2
0.1
0 0.1
1.0
10
100
0
0.5
1.0
1.5
2.0
Collector Current
IC (mA)
Collector to Base Voltage
VCB (V)
Gain Bandwidth Product vs. Collector Current
20
Noise Figure vs. Collector Current
8 f = 900 MHz
VCE = 1 V
Gain Bandwidth Product fT (GHz)
f = 1 GHz
7
Noise Figure NF (dB)
16
VCE = 3 V
6 5 4
3
2 VCE = 2 V
12
8 4
VCE = 1 V
1
2 5 10 20 50 100
VCE = 3 V
0 1
0 1
2
5
10
20
50
100
Collector Current IC (mA)
Collector Current IC (mA)
Rev.2.00 Aug 10, 2005 page 6 of 8
HTT1129E
S21 Parameter vs. Collector Current
20 f = 900MHz
VCE = 3 V
S21 Parameter |S21|2 (dB)
16
12
8
VCE = 1 V
4 0 1
2
5
10
20
50
100
Collector Current IC (mA)
Rev.2.00 Aug 10, 2005 page 7 of 8
HTT1129E
Package Dimensions
JEITA Package Code 3/4 RENESAS Code PXSF0006LA-A Package Name EMFPAK-6 / EMFPAK-6V MASS[Typ.] 0.0012g
D e
A c LP
E
HE
A
A b
L A e
xM S
Reference Symbol
Dimension in Millimeters
A2
A
yS b b1 c
A1 S I1 c1
e1
b2 A-A Section Pattern of terminal position areas
A A1 A2 b b1 c c1 D E e HE L LP x y b2 e1 I1
Min 0.45 0 0.45 0.1 0.1 1.15 0.75 0.95 0.05 0.1
Nom
0.17 0.15 0.13 0.11 1.2 0.8 0.4 1.0 0.1
Max 0.5 0.01 0.49 0.25 0.15 1.25 0.85 1.05 0.15 0.3 0.05 0.05 0.3 0.35
0.7
Ordering Information
Part Name HTT1129EZTL-E Quantity 5000 Shipping Container 178 mm Reel, 8 mm Emboss Taping
Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of production before ordering the product.
Rev.2.00 Aug 10, 2005 page 8 of 8
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> 2-796-3115, Fax: <82> 2-796-2145
http://www.renesas.com
Renesas Technology Malaysia Sdn. Bhd. Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510
(c) 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .3.0


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