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Engwinklige LED im MIDLED-Gehause Narrow beam LED in MIDLED package Lead (Pb) Free Product - RoHS Compliant SFH 4600 SFH 4605
SFH 4600
SFH 4605
Nicht fur Neuentwicklungen / Not for new designs
Wesentliche Merkmale * Leistungsstarke GaAs-LED (35 mW) mit typischer Emissionswellenlange 950 nm * Enger Abstrahlwinkel ( 20) * Geringe Bauhohe * Als Toplooker und Sidelooker einsetzbar * SFH 4600: Gurtung als Toplooker SFH 4605: Gurtung als Sidelooker Anwendungen * Lichtschranken, Lichtvorhange * Sensorik * IR Scheinwerfer Sicherheitshinweise Je nach Betriebsart emittieren diese Bauteile hochkonzentrierte, nicht sichtbare InfrarotStrahlung, die gefahrlich fur das menschliche Auge sein kann. Produkte, die diese Bauteile enthalten, mussen gema den Sicherheitsrichtlinien der IEC-Normen 60825-1 und 62471 behandelt werden. Typ Type SFH 4600 SFH 4605
1)
Features * High Power GaAs-LED (35 mW) with typical peak wavelength of 950 nm * Narrow halfangle ( 20) * Low profile component * Usable as top-looking and side-looking device * SFH 4600: Taping as Toplooker SFH 4605: Taping as Sidelooker Applications * Interrupters, Lightcurtains * Sensors * IR floodlight Safety Advices Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471.
Bestellnummer Ordering Code Q65110A1575 Q65110A1576
Strahlstarkegruppierung1) (IF = 100 mA, tp = 20 ms) Radiant Intensity Grouping1) Ie (mW/sr) 16 (typ. 30) 16 (typ. 30)
gemessen bei einem Raumwinkel = 0.01 sr / measured at a solid angle of = 0.01 sr 1
2008-01-14
SFH 4600, SFH 4605
ATTENTION - Observe Precautions For Handling - Electrostatic Sensitive Device
Grenzwerte Maximum Ratings Bezeichnung Parameter Betriebs- und Lagertemperatur Operating and storage temperature range Sperrspannung Reverse voltage Vorwartsgleichstrom, TA 60 C Forward current Stostrom, tp = 300 s, D = 0, TA 60 C Surge current Verlustleistung TA = 25 C Power dissipation Symbol Symbol Wert Value - 40 ... + 100 5 100 1 180 340 Einheit Unit C V mA A mW K/W
Top , Tstg VR IF IFSM Ptot
Warmewiderstand Sperrschicht - Umgebung bei RthJA Montage auf FR4 Platine, Padgroe je 16 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 16 mm2 each Warmewiderstand Sperrschicht - Lotstelle bei RthJS Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block Kennwerte (TA = 25 C) Characteristics Bezeichnung Parameter Wellenlange der Strahlung Wavelength at peak emission IF = 100 mA Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA Symbol Symbol peak
180
K/W
Wert Value 950
Einheit Unit nm
40
nm
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SFH 4600, SFH 4605
Kennwerte (TA = 25 C) Characteristics (cont'd) Bezeichnung Parameter Abstrahlwinkel Half angle Aktive Chipflache Active chip area Abmessungen der aktiven Chipflache Dimension of the active chip area Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Switching times, e from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 Durchlassspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 s Sperrstrom Reverse current VR = 5 V Gesamtstrahlungsfluss Total radiant flux IF = 100 mA, tp = 20 ms Symbol Symbol Wert Value 20 0.09 0.3 x 0.3 10 Einheit Unit Grad deg. mm2 mm ns
A LxB LxW tr , tf
VF VF IR
1.5 (< 1.8) 3.2 (< 4.3)
V V
not designed for A reverse operation 35 mW
e typ
Temperaturkoeffizient von Ie bzw. e, TCI IF = 100 mA Temperature coefficient of Ie or e, IF = 100 mA Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA Temperaturkoeffizient von , IF = 100 mA Temperature coefficient of , IF = 100 mA
- 0.44
%/K
TCV TC
- 1.5 + 0.2
mV/K nm/K
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3
SFH 4600, SFH 4605
Strahlstarke Ie in Achsrichtung1) gemessen bei einem Raumwinkel = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of = 0.01 sr Bezeichnung Parameter Strahlstarke Radiant intensity IF = 100 mA, tp = 20 ms Strahlstarke Radiant intensity IF = 1 A, tp = 100 s
1)
Symbol -S Ie min Ie max Ie typ 16 32 160
Werte Values -T 25 50 220 40 80 280 -U
Einheit Unit mW/sr mW/sr mW/sr
Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) / Only one group in one packing unit (variation lower 2:1)
Abstrahlcharakteristik Radiation Characteristics Irel = f ()
40 30 20
10
0 1.0
OHF02432
50 0.8 60
0.6
70
0.4
80 90
0.2 0
100
1.0
0.8
0.6
0.4
0
20
40
60
80
100
120
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4
SFH 4600, SFH 4605
Relative Spectral Emission Irel = f ()
100
OHF00777
Radiant Intensity
Ie = f (IF) Ie 100 mA
OHF00809
Single pulse, tp = 20 s
10 e e (100 mA)
2
Max. Permissible Forward Current IF = f (TA), RthJA = 340 K/W
110 mA
OHF02533
erel
80
I F 90
80 70
60
10
0
60 50
40
10
-1
40 30
20
10 -2
20 10
0
10
-3
800 850
900
950 1000
nm 1100
10 0
10 1
10 2
10 3 mA 10 4 F
0
0
20
40
60
80 C 100
TA
Forward Current IF = f (VF) Single pulse, tp = 20 s
10 4 mA 10
3 OHF00784
Permissible Pulse Handling Capability IF = f (), TA 60 C, duty cycle D = parameter
IF
1.2 A 1.0
OHF02532
F
D = TP
t
tP
IF T
10 2
D=
0.8 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1
10
1
0.6
10 0 10 -1 10 -2 10 -3
0.4
0.2
0 0.5 1 1.5 2 2.5 3 3.5 V 4.5
VF
0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102
tp
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SFH 4600, SFH 4605
Mazeichnung Package Outlines
3.3 2.9 0.75 Silicone area (1.2)
1)
0.75 0.55 0.42
Isolating area
1.7 1.5
0.55 0.42
2.35 2.15
0.83 0.53
Pad 1 metallisation
1)
Pad 2 metallisation
(0.8)
Backside metallisation
Device casted with silicone. Avoid mechanical stress on silicone surface.
OHF02956
Mae in mm / Dimensions in mm.
Gehause / Package Anschlussbelegung Pin configuration
MID mit klarem Silikonverguss / MID casted with clear Silicone Pad 1 = Anode / anode Pad 2 = Kathode / cathode Verpackungseinheit 2000/Rolle, o180 mm oder 9000/Rolle, o330 mm Packing unit 2000/reel, o180 mm or 9000/reel, o330 mm
3.5 (0.138) 0.05 (0.002) 1.75 (0.069) 0.05 (0.002)
Gurtung / Polaritat und Lage Method of Taping / Polarity and Orientation
1.5 (0.059) +0.1 (0.004)
4 (0.157) 2 (0.079) 0.05 (0.002)
2.3 (0.091) 0.15 (0.006)
Pad 1 Orientation
0.3 (0.012) 0.02 (0.001)
1.7 (0.067) 0.05 (0.002) 3.3 (0.130) 0.15 (0.006)
Optical axis/viewing direction 2.45 (0.096) 0.05 (0.002)
OHAY2430
Mae in mm (inch) / Dimensions in mm (inch).
2008-01-14
6
3.25 (0.128) 0.05 (0.002)
8 (0.315)
2
0.53
0.83
SFH 4600, SFH 4605
Empfohlenes Lotpaddesign Recommended Solder Pad Design
SFH 4600
Cu-Flache > 16 mm 2 Cu-area Lotstopplack Solder resist
OHF02422
SFH 4605
4.0
Paddesign for improved heat dissipation
1.7
Cu-Flache > 16 mm 2 Cu-area Lotstopplack Solder resist
Mae in mm / Dimensions in mm.
OHF02421
Verarbeitungshinweis: Das Gehause ist mit Silikon vergossen. Mechanischer Stress auf der Bauteiloberflache sollte so gering wie moglich gehalten werden. Handling indication: The package is casted with silicone. Mechanical stress at the surface of the unit should be as low as possible.
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7
4.5
Paddesign for improved heat dissipation
1.25
Padgeometrie fur verbesserte Warmeableitung
1.35
Padgeometrie fur verbesserte Warmeableitung
2.4
SFH 4600, SFH 4605
Lotbedingungen Soldering Conditions Reflow Lotprofil fur bleifreies Loten Reflow Soldering Profile for lead free soldering
300 C 255 C 240 C 217 C 200 30 s max 150 120 s max 100 Ramp Up 3 K/s (max) 25 C 0 0 50 100 150 200 250 s 300 100 s max Ramp Down 6 K/s (max) 10 s min
Vorbehandlung nach JEDEC Level 2 Preconditioning acc. to JEDEC Level 2 (nach J-STD-020C) (acc. to J-STD-020C)
OHLA0687
T 250
Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile
C 260 C +0C -5 245 C 5 C C 235 C +5C -0
50
t
Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
2008-01-14
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