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HSDL - 9100
Surface-Mount Proximity Sensor
Data Sheet
Description
The HSDL-9100 is an analog-output reflective sensor with an integrated high efficiency infrared emitter and photodiode housed in a small form factor SMD package. The optical proximity sensor is housed in a specially designed metal-shield to ensure excellent optical isolation resulting in low optical cross-talk. HSDL-9100 is a class of its own with its small form SMD package and at a detection range from near zero to 60mm. It is specifically optimized for size, performance and ease of design in mobile constrained applications such as mobile phones and notebooks. HSDL-9100 has extremely low dark current and high signal to noise ratio (SNR) where high SNR is achieved with a pair of highly efficient infrared emitter and highly sensitive detector.
Features
* Excellent optical isolation resulting in near zero optical cross-talk * High efficiency emitter and high sensitivity photodiode for high signal-to-noise ratio * Low cost & lead-free miniature surface-mount package Height - 2.70 mm Width - 2.75 mm Length - 7.10 mm * Detect objects from near zero to 60mm * Low dark current * Guaranteed Temperature Performance -40C to 85C * Lead-free and RoHS Compliant
Application Support Information
The Application Engineering Group is available to assist you with the application design associated with HSDL-9100 Proximity Sensor. You can contact them through your local sales representatives for additional details.
Applications
* Mobile phones * Notebooks * Industrial Control * Printers, Photocopiers and Facsimile machines * Home Appliances * Vending Machines
Order Information Part Number HSDL-9100-001 HSDL-9100-021 Packaging Type Tape and Reel Tape and Reel Package PCB Substrate, moulded package PCB Substrate, moulded package Quantity 500 2500
Block Layout
LED 1 LED_A LED_K Photodiode DET_K DET_A
Pins Configuration Table Pin 1 2 3
TOP VIEW
Symbol LED_A LED_K DET_A DET_K
Description LED Anode LED Cathode Photodiode Anode Photodiode Cathode
Notes 1 -
4
Figure 1. Block Layout of HSDL-9100
Notes: Voltage to supply across the LED; VLED
Absolute Maximum Ratings (Ta=25C) Ratings Parameter Emitter Continuous Forward Current Coupled Total Power Dissipation (refer to Figure 1) Operating Temperature Storage Temperature Reflow Soldering Temperature Electrical-Optical Characteristics (Ta=25C) Ratings Parameter Emitter Forward Voltage Reverse Voltage Peak Wavelength Spectrum Width of Half Value Detector Dark Current Forward Voltage Reverse Breakdown Voltage Symbol VF VR lp Dp IDark VF VBR Test Condition IF = 100mA IR = 10uA IF = 20mA IF = 20mA VR = 10V, L** =0 IF = 10mA , L=0 IR = 100uA, L =0 Refer to Fig 2 Refer Note 1 Refer to Fig 3 RL = 50W RL = 50W RL = 5.1KW RL = 5.1KW Min 5 0.5 Typ 1.50 940 50 2 Max 1.65 10 1.3 35 Units V V nm nm nA V V Symbol IDC PTOT TOP TSTG TSOL Min. -40 -40 Max 100 165 +85 +100 260 Units mA mW C C C
Coupled Output Current Peak Output Distance Operating Cross Talk Current Rise Time (LED) Fall Time (LED) Rise Time (Photodiode) Fall Time (Photodiode) ** L = 0 (zero light condition)
IO DO IFD TRL TFL TRD TRD
-
0.1 5 50 50 6 6
200 -
mA mm nA ns ns ms ms
Note: 1. ILed = 300mA Pulse, 5% Duty Cycle (Kodak 18% Reflectance Gray Card)
Output Current Test Condition (Ta=25C)
Dark Current Test Condition (Ta=25C)
LIGHT SEALED DARK BOX
KODAK GRAY CARD 1% REFLECTION
LED PHOTODIODE
D
IF
IO
LED
PHOTODIODE
IF
IDARK
Figure 2. Test Condition used are D = 5mm 18% Gray Card, ILED = 300mA Pulse, 5% Duty Cycle Figure 3. Test Condition used are ILED = 300mA Pulse, 5% Duty Cycle
Response Time Test Condition (Ta=25C)
KODAK GRAY CARD 1% REFLECTION
LED PHOTODIODE
mm
INPUT
IF R LED PULSE GENERATOR
0%
IO
RL
OUTPUT
SCOPE
10% TF
TR
Figure 4. Response Time Test Condition
Typical Characteristics
LED Forward Current Vs Temperature 100 0 0 0 Forward Current Power (mW) 0 0 0 0 0 10 0 0 10 0 0 0 0 0 0 0 0 00 10 10 10 10 100 0 0 0 0 0 Temperature (C) 0 10 0 0 0 0 0 Temperature (C) 0 0 0 Power Dissipation Vs Temperature
LED Forward Current Vs Forward Voltage @ Across Temperature 0.1 0.1 Forward Current (A) 0.0 0.0 0.0 0.0 0 0 0. 0. 0. 0. 1 1. 1. 1. Forward Voltage (V) -
1
E 0.0 0
-
(Photodiode) Forward Current Vs Forward Voltage@Across Temp -
Forward Current (A)
10
.0E
0
.0E
- -
0 0 0 0 00
.0E
.0E
-
.0E
-
+0 .0E 0
0.
0.
0. 0. 1 Forward Voltage (V)
1.
1.
1.
Forward Current (A) Vs Temperature (degC) @Vcc=1V and 1.V 0.1 0.0 0.0 Forward Current (A) 0.0 0.0 0.0 0.0 0.0 0.01 0 -0 -0 0 0 0 0 0 100 Temperature (C) 1V 1.V Response Time (us) 0.0
E 1.0 0 + .0E 0 0 0 E+ 0.0 0 0 E+ 0.0 0 0 E+ 0.0 0 0 E+ 0.0 0 0 E+ 0.0 0 0 E+ 0.0 0 0 E+ 0.0 0 E+0 0.0 0 10 E+ 0.1 0.0 00 +
(Photodiode) Rise/Fall Time Vs Load Resistance@Room Temp, ILED=00mA Pulse (Rise (Fall)
Mean (Fall)
1
10 100 Load Resistance (kohm)
1000
10000
(Photodiode) Dark Current Vdet = //V vs Across Temperature
E
V V V
1.0
Output Voltage vs Distance @ Room Temp and RL = 100K Ohm ILED = 100mA, 00mA and 00mA Pulse
E+
1.0
00mA 00mA 100mA
Dark Current (A) 10 0.0 E
Output Voltage (mV)
0 10
.0E
+0
.0E -
0
10 .0E +0
E
10
-0
1.0
-0
0
0
0
0
0
100
1.0
Temperature (C)
E+
0
10 0 0 0 0 0 0 100 10 00 00 0 Distance (mm)
1000 00 00 Output Voltage (mV) 00 00 00 00 00 00 100 0 -10 -
Output Voltage Vs Edge Distance @ Room Temp and RL=100K Ohm ILED=00mA, D=//mm mm mm mm
The diagram below illustrates the explanation of edge distance. Edge detection is labeled as D in the diagram below.
1% Reflection Gray Card
-
- - 0 Edge Distance (mm)
Distance = D(mm)
LED Distance = -D(mm) PIN
mm
HSDL-9100 Package Outline
1.1 1.
R0.
Mounting Centre
.
R1
.0
Tx
0.1
.
1. . .
Rx
. . . 0.
.
UNIT: mm Tolerance: 0.mm
.1 0.
.
1.1 0. 0.
LED Cathode
.
Photodiode Anode
LED Anode Figure 5. Package outline dimensions
Photodiode Cathode
HSDL-9100-021 Tape and Reel Dimensions
Rx Cathode Rx Anode 0.35 40.1 B 1.75 7.5 Tx Cathode Tx Anode 80.1 2.950.1 PROGRESSIVE DIRECTION UNIT: MM A A B PARTS MOUNTED LEADER (400 mm MIN.) EMPTY (40 mm MIN.) OPTION # 001 021 UNIT: mm "B" 178 330 "C" 60 80 QUANTITY 500 2500 DETAIL A 2.0 0.5 13.0 0.5 R 1.0 LABEL 21 0.8 16.4 +2 0 2.0 0.5 B C DETAIL A 16 1.5 20.1 1.550.05
B-B Section
2.780.07
EMPTY (40 mm MIN.)
Figure 6. Tape and Reel Dimensions
7.350.1
5 (MAX)
HSDL-9100 Moisture Proof Packaging All HSDL-9100 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 4. Baking Conditions If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. PACKAGE In reels
Baking Conditions Chart
Units in A Sealed Moisture-Proof Package
Package Is Opened (Unsealed)
Temp 0 C 100 C
Time hours hours hours 1 hour
No Baking Is Necessary Yes
Environment less than deg C, and less than 0% RH Yes
In bulk
1 C 10 C
Package Is Opened less Than hours No
Baking should only be done once. Recommended Storage Conditions STORAGE TEMPERATURE Relative Humidity 10C to 30C below 60% RH
Perform Recommended Baking Conditions
No
Figure 7. Baking conditions chart
Time from unsealing to soldering After removal from the bag, the parts should be soldered within three days if stored at the recommended storage conditions.
Recommended Reflow Profile The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different DT/Dtime temperature change rates. The DT/Dtime rates are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and HSDL-9100 castellation pins are heated to a temperature of 160C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 4C per second to allow for even heating of both the PC board and HSDL-9100 castellations. Process zone P2 should be of sufficient time duration (60 to 120 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 200C (392F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 255C (491F) for optimum results. The dwell time above the liquidus point of solder should be between 20 and 60 seconds. It usually takes about 20 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 60 seconds, the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 200C (392F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25C (77F) should not exceed 6C per second maximum. This limitation is necessary to allow the PC board and HSDL9100 castellations to change dimensions evenly, putting minimal stresses on the HSDL-9100 transceiver.
T - TEMPERATURE (C) 0 0 00 10 10 10 0 0 P1 HEAT UP 0 100 P SOLDER PASTE DRY 10 R1
MAX 0C R R
R
0 sec MAX Above 0 C
R
P SOLDER REFLOW
00
0 P COOL DOWN
00 t-TIME (SECONDS)
Figure 8. Reflow graph
PROCESS ZONE
Symbol P1, R1 P2, R2 P3, R3P3, R4 P4, R5
DT
Maximum
DT/Dtime
Heat Up Solder Paste Dry Solder Reflow Cool Down
25C to 160C 160C to 200C 200C to 255C (260C at 10 seconds max) 255C to 200C 200C to 25C
4C/s 0.5C/s 4C/s -6C/s -6C/s
Appendix A: HSDL-9100 SMT Assembly Application Note
Recommended land pattern
FIDUCIAL 0. Component placement FIDUCIAL
Recommended Metal solder Stencil Aperture It is recommended that only a 0.152 mm (0.006 inch) or a 0.127 mm (0.005 inch) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and no shorting. See Table 1 below the drawing for combinations of metal stencil aperture and metal stencil thickness that should be used. Aperture opening for shield pad is 3.05 mm x 1.1 mm as per land pattern. Table 1. Combinations of metal stencil aperture and metal stencil thickness
Stencil thickness, t (mm)
1. 0.
1. . . Mounting Center
Figure 10. Recommended land pattern
Aperture size (mm) Length, l Width, w 0.+/-0.0 0.+/-0.0
Apertures as per Land Dimensions
t
l w
0.1 0.1
1.0+/-0.0 1.
Figure 11. Solder stencil aperture
Adjacent Land Keep out and Solder Mask Areas Adjacent land keep out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. The minimum solder resist strip width required to avoid solder bridging adjacent pads is 0.2mm.It is recommended that two fiducial crosses be placed at mid length of the pads for unit alignment. Also do take note that there should not be any electrical routing with the component placement compartment.
Note: Wet/Liquid Photo-imaginable solder resist/mask is recommended
Dim. h l k j
k j
mm .1 11 . .
Component placement
h
Solder Pad, Mask and Metal Stencil
Metal stencil for solder paste printing Solder Mask Stencil Aperture Land Pattern l Mounting Center
Figure 12. Keep-out area
Solder Mask
PCBA
Figure 9. Stencil and PCBA
10
Appendix B: General Application Guide for the HSDL-9100 Description The Proximity sensor has several possible applications for multimedia product, Automation, and Personal handled. The proximity sensor is basically made up of the emitter (infrared LED) and detector (photodiode). The block diagram of the sensor is shown in Figure 13. The emitter will emit IR light pulse. This light travels out in the field of view and will either hit an object or continue. No light will be reflected when no object is detected. On the other hand, the detector will detect the reflected IR light when it hits the object. Interface to the Recommended I/O chip The HSDL-9100 is general interface with the GPIO pin of the controller chipset. The LED_A, pin1 is connected to the PWM port alternatively the external timer circuitry can be used to drive the LED. The DET_K, pin 4 is interface to the signal conditioning before driving the GPIO port. Figure 14 shows the hardware reference design with HSDL-9100.
Photodiode Photodiode anode Photodiode cathode
LED cathode
1
LED anode
LED Figure 13. Proximity sensor block diagram (refer to Pins Configuration Table)
STN/TFT LCD Panel
Key Pad
LCD Control Touch Panel A/D
Peripherial interface IrDA interface
IR Transceiver
Mobile Application chipset
AC sound
PCM Sound
Memory Expansion
Logic Bus Driver
Memory I/F Baseband controller GPIO
IS PWM
Audio Input
ROM FLASH SDRAM
Power Management
Antenna *IR LED driver Signal Conditional
HSDL-100
* The LED can be driven by the PWM output or the external timer circuitry.
Figure 14. Mobile Application Platform
11
The next section discusses interfacing configuration with general processor including the recommended signal conditional circuitry. The DET_K pin of HSDL-9100 is connected to the filter circuit then to the comparator before interfacing with the GPIO pin. The filter circuit is implement to provide the ambient light filter. The PWM is pulse to drive the LED_K pin alternative the external timer 555 can also be replaced. The detector distance can be varies with the increase/decrease of the LED current supply.
Interfacing circuitry with signal conditional circuitry
VCC HSDL-100 LEDA LEDK DETK DETA
PWM
0 Ohm BC
VCC K Ohm K Ohm 0 pf 10 Ohm K Ohm GND BCB 1M Ohm VCC GND k Ohm VCC
GND GPIO
controller chipset
00 Ohm GND Signal conditioning circuitry
Figure 15. HSDL9100 configuration with controller chipset
For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries. Data subject to change. Copyright (c) 2006 Avago Technologies Pte. All rights reserved. 5989-3179EN - March 29, 2006

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