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| RMWT11001 June 2004 RMWT11001 11-33 GHz Tripler MMIC General Description The RMWT11001 is an 11 to 33 GHz Tripler designed for use in point to point and point to multi-point radios, and various communications applications. In conjunction with other Fairchild RF Components amplifiers, multipliers and mixers it forms part of a complete 38 GHz transmit/receive chipset. The RMWT11001 utilizes our 0.25m power PHEMT process and is sufficiently versatile to serve in a variety of multiplier applications. Features * 4 mil substrate * Conversion loss 14.5dB (typ.) * No DC bias required * Chip size 1.6mm x 1.05mm Device Absolute Ratings Symbol PIN TC Tstg Parameter RF Input Power (from 50 source) Operating Baseplate Temperature Storage Temperature Range Ratings +22 -30 to +85 -55 to +125 Units dBm C C Electrical Characteristics (At 25C), 50 system, Pin = +18 dBm Parameter Input Frequency Range Output Frequency Range Input Drive Power Conversion Loss Conversion Loss Variation vs Freq Fundamental Rejection 2nd Harmonic Rejection 4th Harmonic Rejection Input Return Loss (Pin = +18 dBm) Min 10.6 31.8 +17 Typ Max 11.7 35.1 17.5 Units GHz GHz dBm dB dB dBc dBc dBc dB +19 14.5 1 -20 -30 -25 11 (c)2004 Fairchild Semiconductor Corporation RMWT11001 Rev. C RMWT11001 Application Information CAUTION: THIS IS AN ESD SENSITIVE DEVICE. Chip carrier material should be selected to have GaAs compatible thermal coefficient of expansion and high thermal conductivity such as copper molybdenum or copper tungsten. The chip carrier should be machined, finished flat, plated with gold over nickel and should be capable of withstanding 325C for 15 minutes. Die attachment should utilize Gold/Tin (80/20) eutectic alloy solder and should avoid hydrogen environment for PHEMT devices. Note that the backside of the chip is gold plated and is used as RF ground. These GaAs devices should be handled with care and stored in dry nitrogen environment to prevent contamination of bonding surfaces. These are ESD sensitive devices and should be handled with appropriate precaution including the use of wrist grounding straps. All die attach and wire/ribbon bond equipment must be well grounded to prevent static discharges through the device. Recommended wire bonding uses 3 mils wide and 0.5 mil thick gold ribbon with lengths as short as practical allowing for appropriate stress relief. The RF input and output bonds should be typically 0.012" long corresponding to a typical 2 mil gap between the chip and the substrate material. MMIC CHIP RF IN X3 RF OUT GROUND (Back of Chip) Figure 1. Functional Block Diagram 0.0 1.05 1.6 1.05 0.752 0.752 0.5955 0.439 0.5955 0.439 0.0 0.0 Dimensions in mm 1.6 0.0 Figure 2. Chip Layout and Bond Pad Locations (Chip Size is 1.6mm x 1.05mm x 100m. Back of chip is RF Ground) (c)2004 Fairchild Semiconductor Corporation RMWT11001 Rev. C RMWT11001 DIE-ATTACH 80Au/20Sn 5 MIL THICK ALUMINA 50 5 MIL THICK ALUMINA 50 RF INPUT RF OUTPUT 2 MIL GAP L < 0.015" (2 Places) Note: Use 0.003" by 0.0005" Gold Ribbon for bonding. RF input and output bonds should be less than 0.015" long with stress relief. Figure 3. Recommended Assembly Diagram Recommended Procedure for Operation The following sequence must be followed to properly test the amplifier. Step 1: The RMWT1101 does not require DC bias. Apply RF input signal at the appropriate frequency band and input drive level. Step 2: Follow turn-off sequence of: Turn off RF input power. (c)2004 Fairchild Semiconductor Corporation RMWT11001 Rev. C RMWT11001 Typical Characteristics RMWT1101, 11 to 33 GHz Tripler, Typical Performance, Chip Bonded into 50 Test Fixture -12.00 FIXTURED (Pin = +21dBm) CONVERSION GAIN (dB) -14.00 FIXTURED (Pin = +17dBm) -16.00 FIXTURED (Pin = +21dBm) -18.00 -20.00 30.00 31.00 32.00 33.00 34.00 35.00 36.00 OUTPUT FREQUENCY (GHz) RMWT1101, 11 to 33 GHz Tripler, Typical Performance, Chip Bonded into 50 Test Fixture 0.00 FUNDAMENTAL REJECTION (dBc) -5.00 -10.00 -15.00 FIXTURED (Pin = +17dBm) -20.00 -25.00 FIXTURED (Pin = +21dBm) FIXTURED (Pin = +19dBm) -30.00 10.00 10.40 10.80 11.20 11.60 12.00 INPUT FREQUENCY (GHz) (c)2004 Fairchild Semiconductor Corporation RMWT11001 Rev. C RMWT11001 Typical Characteristics (Continued) RMWT1101, 11 to 33 GHz Tripler, Typical Performance, Chip Bonded into 50 Test Fixture 0.00 -5.00 -10.00 -15.00 -20.00 FIXTURED (Pin = 19dBm) FIXTURED (Pin = +21dBm) 2nd HARMONIC REJECTION (dBc) -25.00 -30.00 FIXTURED (Pin = +17dBm) -35.00 10.00 10. 40 10.80 11. 20 11.60 12.00 INPUT FREQUENCY (GHz) RMWT1101, 11 to 33 GHz Tripler, Typical Performance, Chip Bonded into 50 Test Fixture 0.00 -5.00 4th HARMONIC REJECTION (dBc) -10.00 -15.00 -20.00 FIXTURED (Pin = +19dBm) -25.00 FIXTURED (Pin = +17dBm) FIXTURED (Pin = +21dBm) -30.00 -35.00 10.00 10.40 10.80 11.20 11.60 12.00 INPUT FREQUENCY (GHz) (c)2004 Fairchild Semiconductor Corporation RMWT11001 Rev. C RMWT11001 Typical Characteristics (Continued) RMWT1101, 11 to 33 GHz Tripler, Typical Performance, Chip Bonded into 50 Test Fixture 0.00 INPUT RETURN LOSS AT PIN = 29dBm (dB) -5.0 0 -10.00 -15.00 -20.00 -25.00 10.00 10.40 10.80 11.20 11.60 12.00 INPUT FREQUENCY (GHz) RMWT1101, 11 to 33 GHz Tripler, Typical Performance over Temperature, Chip Bonded into 50 Test Fixture, Pin = +19dBm -12 SERIES 1 +25C -14 SERIES 2 +75C -16 CONVERSION GAIN (dB) -18 -20 31 32 33 34 35 36 OUTPUT FREQUENCY (GHz) (c)2004 Fairchild Semiconductor Corporation RMWT11001 Rev. C TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM FAST ActiveArrayTM FASTrTM BottomlessTM FPSTM CoolFETTM FRFETTM CROSSVOLTTM GlobalOptoisolatorTM DOMETM GTOTM EcoSPARKTM HiSeCTM E2CMOSTM I2CTM EnSignaTM i-LoTM FACTTM ImpliedDisconnectTM FACT Quiet SeriesTM ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM OCXTM OCXProTM OPTOLOGIC Across the board. Around the world.TM OPTOPLANARTM PACMANTM The Power Franchise POPTM Programmable Active DroopTM Power247TM PowerSaverTM PowerTrench QFET QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM SILENT SWITCHER SMART STARTTM SPMTM StealthTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogic TINYOPTOTM TruTranslationTM UHCTM UltraFET VCXTM DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I11 |
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