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  Datasheet File OCR Text:
 SPICE MODELS: RH02 RH04 RH06
RH02 - RH06
0.5A SURFACE MOUNT GLASS PASSIVATED FAST RECOVERY BRIDGE RECTIFIER Features
* * * * * *
Glass Passivated Die Construction Low Forward Voltage Drop Surge Overload Rating to 30A Peak Ideally Suited for Automatic Assembly Miniature Package Saves Space on PC Boards Lead Free Finish, RoHS Compliant (Note 4) MiniDIP Dim B C D E F G H J K L Min 3.6 0.15 3/4 3/4 3/4 0.70 4.5 2.3 2.3 0.50 Max 4.0 0.35 0.20 7.0 3.00 1.10 4.9 2.7 2.7 0.80
L
G
Mechanical Data
* * * * * *
Case: MiniDIP Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 Terminals: Finish 3/4 Bright Tin. Plated Leads, Solderable per MIL-STD-202, Method 208 Polarity: As Marked on Case Marking: Type Number Weight: 0.125 grams (approx.)
B
DE
H J K F
C
All Dimensions in mm
Maximum Ratings and Electrical Characteristics
Characteristic Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Average Forward Rectified Current (Note 1) TA = @ 40C Non-Repetitive Peak Forward Surge Current, 8.3 ms Single half-sine-wave Superimposed on Rated Load (JEDEC method) Instantaneous Voltage Drop @ 0.4A (per element) Peak Reverse Current at Rated DC Blocking Voltage (per element) Maximum Reverse Recovery Time Typical Junction Capacitance (per element) Operating and Storage Temperature Range
Notes: 1. 2. 3. 4.
@ TA = 25C unless otherwise specified RH02 200 140 RH04 400 280 0.5 30 1.15 5.0 100 150 13.0 85 -55 to +150 250 RH06 600 420 Unit V V A A V mA ns pF K/W C
Symbol VRMM VRWM VDC VRMS IO IFSM VF IR trr Cj RqJA Tj, TSTG
@ TA = 25C @ TA = 125C (Note 3) (Note 2)
Typical Thermal Resistance, Junction to Ambient (Note 1)
Mounted on Glass Epoxy PC Board. Measured at 1.0 MHz and Applied Reverse Voltage of 4.0 V. trr test conditions: IF = 0.5A, IR = 1.0A, Irr = 0.25A. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
DS30137 Rev. 6 - 2
1 of 3 www.diodes.com
RH02 - RH06
a Diodes Incorporated
I(AV), AVERAGE FORWARD RECTIFIED CURRENT (A)
0.8
Alumina Substrate
0.6
IF, INSTANTANEOUS FORWARD CURRENT (A)
10
1.0
0.4
Glass Epoxy PC Board
0.1
0.2
Resistive or Inductive Load
0 0 40 80 120 160 TA, AMBIENT TEMPERATURE ( C) Fig. 1 Output Current Derating Curve
0.01 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 2 Typical Forward Characteristics (per leg)
IFSM, PEAK FORWARD SURGE CURRENT (A)
35 30
Cj, JUNCTION CAPACITANCE (pF)
100
Tj = 25 C f = 1.0MHz
20
10
10
TA = 25 C Single Half Sine-Wave Pulse Width = 5.3ms (JEDEC Method)
0 1.0 10 NUMBER OF CYCLES AT 60 Hz Fig. 3 Maximum Peak Forward Surge Current (per leg)
100
1 1 10 VR, REVERSE VOLTAGE (V) Fig. 4 Typical Junction Capacitance 100
10
Tj = 125 C
1.0
0.1
Tj = 25 C
0.01 0 20 40 60 80 100 120 140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Fig. 5 Typical Reverse Characteristics (per element)
DS30137 Rev. 6 - 2
2 of 3 www.diodes.com
RH02 - RH06
Ordering Information
Device RH0x-T
Notes:
(Note 5) Packaging MiniDIP Shipping 3000/Tape & Reel
5. For Packaging Details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
DS30137 Rev. 6 - 2
3 of 3 www.diodes.com
RH02 - RH06


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