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| Surface Mount Monolithic PIN Diode Chip V 1.00 MA4SPS552 Features n n n n n n n Case Style ODS-1281 A Surface Mount Device No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance High Power Handling (Efficient Heatsinking) B Description This device is a silicon-glass PIN diode chip fabricated with M/A-COM's patented HMIC process. This device features two silicon pedestals embedded in a low loss glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls conductive. Selective backside metalization is applied producing a surface mount device. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. C D E F Applications These packageless devices are suitable for usage in moderate incident power (5 W C.W.) or higher incident peak power (200 W) series, shunt, or series-shunt switches. Small parasitic inductance, 0.7 nH, and excellent RC time constant, 0.20 pS, make the devices ideal for wireless TR switch and accessory switch circuits, where higher P1dB and IP3 values are required. These diodes can also be used in , T, tapered resistance, and switched-pad attenuator control circuits for 50 or 75 systems. G Absolute Maximum Ratings1 @ T A = +25C (unless otherwise specified) Parameter Forward Current Reverse Voltage Operating Temperature Storage Temperature Junction Temperature Dissipated RF & DC Power Mounting Temperature Absolute Maximum 100 mA -200 V -65 C to +150 C -65 C to +150 C Dim Inches Millimeters A B C D E F G Min. 0.0207 0.0108 0.0040 0.0069 0.0018 0.0061 0.0069 Max. 0.0226 0.0128 0.0080 0.0089 0.0037 0.0081 0.0089 Min. 0.525 0.275 0.102 0.175 0.045 0.155 0.175 Max. 0.575 0.325 0.203 0.225 0.095 0.205 0.225 +175 C 1W +235 C for 10 seconds 1. Backside metal: 0.1 micron thk. 2. Hatched areas indicate bond pads. 1. Exceeding these limits may cause permanent damage. Surface Mount PIN Diode Chip Electrical Specifications: @ +25 C Symbol CT CT RS RS VF VF VR IR RJL TL Parameter Total Capacitance Total Capacitance Series Resistance Series Resistance Forward Voltage Forward Voltage Reverse Voltage Reverse Leakage Current Thermal Resistance Minority Carrier Lifetime Conditions -40 V, 1 MHz -40 V, 1 GHz 100 mA, 100 MHz 20 mA, 100 MHz 100 mA 10 mA -10 A -40 V Steady State (50% - 90% V) +10 mA / -6 mA Units pF pF V V V nA C/W s MA4SPS552 SurMount TM Series V 1.00 Min. Typ. 0.08 0.06 1.7 2.4 1.00 0.86 Max. 0.14 1.25 1.00 l -200 l l -275 l l -10 l 30 2.5 Handling Procedures All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should insure that abrasion and mechanical shock are minimized. When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a vacuum tip and a force of 60 to 100 grams applied normal to the top surface of the device. When soldering to soft substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so that its mounting pads are aligned with the circuit board's mounting pads and reflow the solder by heating the circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to the top surface of the die. Since the HMICTM glass is transparent, the edges of the mounting pads closest to each other can be visually inspected through the die after attach is completed. Bonding Techniques Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently located on the bottom surface of these diodes and are removed from the active junction locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of 80/20 Au/Sn and 60/40 Sn/Pb solder is recommended, with an equal temperature profile across the contacts. Conductive epoxy paste for attachment may also be used. 2 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. n n n North America: Tel. (800) 366-2266 Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300 Surface Mount PIN Diode Chip MA4SPS552 SurMount TM Series V 1.00 Capacitance vs Frequency 0.20 0.18 0.16 0V 0.14 0.12 -5V 0.10 0.08 0.06 0.04 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00 -40V Frequency ( GHz ) Capacitance vs Voltage 0.20 0.18 0.16 0.14 0.12 0.10 0.08 0.06 0.04 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 100 MHz 1 GHz Voltage ( V ) 3 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. n n n North America: Tel. (800) 366-2266 Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300 Surface Mount PIN Diode Chip MA4SPS552 SurMount TM Series V 1.00 Rs vs I 100.0 1GHz 10.0 100MHz 1.0 0.01 0.10 1.00 I ( mA ) 10.00 100.00 Rs vs Frequency 4.0 3.5 3.0 2.5 2.0 50mA 10mA 20mA 1.5 1.0 0.5 0.0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 100mA Frequency (GHz) 4 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. n n n North America: Tel. (800) 366-2266 Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300 Surface Mount PIN Diode Chip MA4SPS552 SurMount TM Series V 1.00 Parallel Resistance vs V 1.0E+06 100MHz 1.0E+05 1GHz 1.0E+04 1.0E+03 0.0 -5.0 -10.0 -15.0 -20.0 -25.0 -30.0 -35.0 -40.0 Reverse Bias ( -V ) 5 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. n n n North America: Tel. (800) 366-2266 Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300 Surface Mount PIN Diode Chip SURMOUNT PIN Diode Model MA4SPS552 SurMount TM Series V 1.00 Ls = 0.7 nH Rp Cp Rvia = 0.05 Rvia = 0.05 _ Rs = Rp + 2 * Rvia + Ordering Information Part Number MA4SPS552 MA4SPS552-T MA4SPS552-W Die in Carrier Tape/Reel Wafer on Frame Package 6 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. n n n North America: Tel. (800) 366-2266 Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300 |
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