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| SURMOUNTTM PIN Diodes MA4SPS421, MA4SPS422 Features * * * * * * * Surface Mount 100 m I-Region Length Device No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance Higher Average and Peak Power Handling MA4SPS420 Series V2 Absolute Maximum Ratings1 @ TA = +25 C (unless otherwise specified) Parameter Forward Current Reverse Voltage Operating Temperature Absolute Maximum 250 mA l -200 V l -55 C to +125 C -55 C to +150 C +175 C 1.8 W +235 C for 10 seconds Description and Applications This device is a Silicon-Glass PIN diode chip fabricated with M/A-COM's patented HMICTM process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This Vertical Topology provides for Exceptional Heat Transfer. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. These packageless devices are suitable for usage in Moderate Incident Power ( 10 W C.W. ) or Higher Incident Peak Power ( 500 W ) Series, Shunt, or Series-Shunt Switches. Smaller Parasitic Inductance, 0.1to 0.2 nH, and Excellent RC Constant ( 0.45 pS ), make the devices ideal for Higher Frequency Switch Elements compared to their Plastic Device Counterparts. Storage Temperature Junction Temperature Dissipated Power (RF & DC) Mounting Temperature 1. Operation of this device above any one of these parameters may cause permanent damage. Case Style ODS-1294 (MA4SPS421) Case Style ODS-1295 (MA4SPS422) B A C A C Dimensions Dim A B C D E F G Min. 0.040 0.021 0.004 0.013 0.011 0.013 0.019 Inches Max. 0.042 0.023 0.008 0.015 0.013 0.015 0.021 Millimeters Min. 1.025 0.525 0.102 0.325 0.275 0.325 0.475 Max. 1.075 0.575 0.203 0.375 0.325 0.375 0.525 1. Backside metal: 0.1 microns thick. 2. Shaded Areas Indicate Backside Ohmic Gold Contacts. 3. Both Devices have Same Outline Dimensions ( A to G ). D E F G G D E F Bottom Side Contacts are Circuit Side 1 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. SURMOUNTTM PIN Diodes MA4SPS421, MA4SPS422 Electrical Specifications @ + 25 C Parameter Symbol Conditions Units Min. Typ. MA4SPS421 Capacitance Capacitance Capacitance Capacitance Resistance Forward Voltage Reverse Leakage Current Input Third Order Intercept Point CT CT CT CT RS VF IR IIP3 0 V, 1 MHz 1 MA4SPS420 Series V2 Max. Min. Typ. MA4SPS422 Max pF pF pF pF V A dBm 0.130 .08 0.090 .07 6.2 0.900 0.175 0.340 0.14 0.500 0 V, 1 GHz1,3 -40 Volts, 1 MHz1 -40 Volts, 1 GHz +10 mA, 1 GHz +10 mA l -200 V l F 1 = 1000 MHz F 2 = 1010 MHz Input Power = +10 dBm I bias = +10 mA IH = 0.5 A, IL = 10 mA +10 mA / -6 mA (50% - 90% V) 1,3 0.125 0.180 0.13 3.1 0.300 2,3 0.950 l -10 l 0.840 0.900 l -10 l +50 +50 C.W. Thermal Resistance Minority Carrier Lifetime RJL TL C/W s 80 5 70 10 1. Total capacitance, CT, is equivalent to the sum of Junction Capacitance ,Cj, and Parasitic Capacitance, Cpar. 2. Series resistance Rs is equivalent to the total diode resistance : Rs = Rj ( Junction Resistance) + Rc ( Ohmic Resistance) 3. Rs and CT are measured on an HP4291A Impedance Analyzer with die mounted in an ODS-186 package with Sn 60 / Pb 40 solder. 4. Steady-state R JL measured with die mounted in an ODS-186 package with Sn 60 / Pb 40 solder. 2 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. SURMOUNTTM PIN Diodes MA4SPS421, MA4SPS422 Handling MA4SPS420 Series V2 All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should insure that abrasion and mechanical shock are minimized. Bonding Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently located on the bottom surface of these devices and are removed from the active junction locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of 80 Au / 20 Sn or Sn 60 / Pb 40 solder is recommended. Conductive silver epoxy for die attachment may also be used for lower incident power (<1 W average incident power) applications. When soldering these devices to a hard substrate, hot gas die bonding is preferred. We re-commend utilizing a vacuum tip and force of 60 to100 grams applied normal to the top surface of the device. When soldering to soft substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to the top surface of the die. The solder joint must Not be made one at a time, creating un-equal heat flow and thermal stress. Solder reflow should Not be performed by causing heat to flow through the top surface of the die. Since the HMIC glass is transparent, the edges of the mounting pads closest to each other can be visually inspected through the die after attach is completed. A typical profile for a Sn 60/ Pb 40 Soldering process is provided in Application Note, " M538 " , " Surface Mounting Instructions " on the MA-COM website www.macom.com. 3 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. SURMOUNTTM PIN Diodes MA4SPS421, MA4SPS422 MA4SPS420 Typical Performance Curves @ +25 C Rs vs. Current (@ 100MHz & 1GHz) MA4SPS421 100 100 MA4SPS420 Series V2 Rs vs. Current (@ 100MHz & 1GHz) MA4SPS422 Rs (ohms) Rs (ohms) 10 10 1 0.001 0.01 Current (A) 0.1 1 0.001 0.01 Current (A) 0.1 Ct vs Voltage (@ 100MHz & 1GHz) MA4SPS421 3.0E-13 2.5E-13 2.0E-13 Ct (F) 1.5E-13 1.0E-13 5.0E-14 0.0E+00 0 10 20 Voltage (V) 30 40 100MHz 1GHz Ct (F) 3.0E-13 2.5E-13 Ct vs Voltage (@ 100MHz & 1GHz) MA4SPS422 100MHz 2.0E-13 1.5E-13 1.0E-13 5.0E-14 0.0E+00 0 10 20 Voltage (V) 30 40 1GHz Rp vs Voltage (@ 100MHz & 1GHz) MA4SPS421 1000000 100000 Rp (ohms) 10000 1000 100 10 1 0 10 20 Voltage (V) 30 40 100MHz Rp (ohms) 1000000 100000 10000 1000 100 10 1 0 Rp vs Voltage (@ 100MHz & 1GHz) MA4SPS422 100MHz 1GHz 1GHz 10 20 Voltage (V) 30 40 4 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. 3 SURMOUNTTM PIN Diodes MA4SPS421, MA4SPS422 MA4SPS420 Typical Performance Curves @ +25 C Ct vs Frequency (@ 0, 5 & 40V) MA4SPS421 3.0E-13 2.5E-13 2.0E-13 Ct (F) 1.5E-13 0V 1.0E-13 5.0E-14 40V Ct (F) 3.0E-13 2.5E-13 2.0E-13 1.5E-13 1.0E-13 5.0E-14 0.0E+00 0.0E+00 40V 0V MA4SPS420 Series V2 Ct vs Frequency (@ 0, 5 & 40V) MA4SPS422 0.0E+00 0.0E+00 5.0E+08 1.0E+09 Frequency (Hz) 1.5E+09 2.0E+09 5.0E+08 1.0E+09 Frequency (Hz) 1.5E+09 2.0E+09 Ls vs Frequency (@ 10mA & 100mA) MA4SPS421 3.00E-10 2.50E-10 100mA 2.00E-10 Ls (H) 1.50E-10 1.00E-10 5.00E-11 0.00E+00 0.0E+00 10mA Ls (H) 2.00E-10 1.50E-10 1.00E-10 3.00E-10 2.50E-10 Ls vs Frequency (@ 10mA & 100mA) MA4SPS422 100mA 10mA 5.00E-11 0.00E+00 0.0E+00 5.0E+08 1.0E+09 Frequency (Hz) 1.5E+09 2.0E+09 5.0E+08 1.0E+09 Frequency (Hz) 1.5E+09 2.0E+09 Rs vs Frequency (@ 10mA & 100mA) MA4SPS421 10 9 8 7 6 5 4 3 2 1 0 0E+0 10 9 8 7 6 5 4 3 2 1 0 0E+0 Rs vs Frequency (@ 10mA & 100mA) MA4SPS422 Rs (ohms) 100mA Rs (ohms) 10mA 10mA 100mA 2E+8 4E+8 6E+8 8E+8 1E+9 2E+8 4E+8 6E+8 8E+8 1E+9 Frequency (H) Frequency (H) 5 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. SURMOUNTTM PIN Diodes MA4SPS421, MA4SPS422 MA4SPS421 SPICE Model MA4SPS420 Series V2 PinDiodeModel NLPINM1 Is=1.0E-14 A Vi=0.0 V Un=900 cm^2/V-sec Wi=100 um Rr=11 K Ohm Cmin=0.06 pF Tau= 5 usec Rs=0.1 Ohm Cj0=0.07 pF Vj=0.7 V M=0.5 Fc=0.5 Imax=3.1 E+8 A/m^2 Kf=0.0 Af=1.0 wBv=260 V wPmax=1.6 W Ffe=1.0 MA4SPS421 Schematic Ls Cp Rp Rvia Rvia _ Notes : Rs = 2 * Rvia + Rp + 6 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. SURMOUNTTM PIN Diodes MA4SPS421, MA4SPS422 MA4SPS422 SPICE Model MA4SPS420 Series V2 PinDiodeModel NLPINM1 Is=1.0E-14 A Vi=0.0 V Un=900 cm^2/V-sec Wi=100 um Rr=9 K Ohm Cmin=0.12 pF Tau= 10 usec Rs=0.1 Ohm Cj0=0.13 pF Vj=0.7 V M=0.5 Fc=0.5 Imax=7.8 E+7 A/m^2 Kf=0.0 Af=1.0 wBv=340 V wPmax=1.8 W Ffe=1.0 MA4SPS422 Schematic Ls Cp Rp Rvia Rvia _ Notes : Rs = 2 * Rvia + Rp + 7 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. |
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