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PRELIMINARY CSPEMI606/608 LCD EMI Filter Array with ESD Protection
Features
* * * * * * Six and eight channels of EMI filtering
+15kV ESD protection on each channel
Product Description
CAMD's CSPEMI606 and CSPEMI608 are EMI filter arrays with ESD protection, which integrate six and eight Pi- filters (C-R-C), respectively. The CSPEMI60x has component values of 15pF-100-15pF. These devices include ESD protection diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports are designed and characterized to safely dissipate ESD strikes of 15kV, beyond the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than 30kV. This device is particularly well suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of its small package format and easyto-use pin assignments. In particular, the CSPEMI60x is ideal for EMI filtering and protecting data lines from ESD for the LCD display in clamshell handsets. The CSPEMI606 and CSPEMI608 are available in space-saving, low-profile chip-scale packages with optional lead-free finishing.
* *
(IEC 61000-4-2 Level 4, contact discharge) +30kV ESD protection on each channel (HBM) Better than 30dB of attenuation at 1GHz to 3GHz 15-bump, 2.960mm x 1.330mm footprint Chip Scale Package (CSPEMI606) Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 20-bump, 4.000mm x 1.458mm footprint Chip Scale Package (CSPEMI608) Lead-free version available
Applications
* * * * * * LCD data lines in clamshell wireless handsets EMI filtering & ESD protection for high-speed I/O data ports Wireless handsets / cell phones Notebook computers PDAs / Handheld PCs EMI filtering for high-speed data lines
Electrical Schematic
100 FILTERn* 15pF 15pF FILTERn*
GND (Pins B1-Bn)
1 of n EMI Filtering + ESD Channels (n=6 for CSPEMI606, 8 for CSPEMI608)
* See Package/Pinout Diagram for expanded pin information.
(c) 2003 California Micro Devices Corp. All rights reserved. 10/10/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com
1
PRELIMINARY CSPEMI606/608
PACKAGE / PINOUT DIAGRAMS
TOP VIEW
Orientation Marking (see note 2)
BOTTOM VIEW
(Bumps Up View)
FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6
(Bumps Down View)
1 A B C 2 3 4 5 6
C1
C2
GND
C3
GND
C4 B2
C5
GND
C6 B3
606
2 3 4 5 6 7 8
B1 Orientation Marking
FILTER1 FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
A1
A1
A2
A3
A4
A5
A6
CSPEMI606 CSP Package
Orientation Marking (see note 2)
1 A B C
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
FILTER7
FILTER8
C1
C2
GND
C3
GND
C4 B2
C5
GND
C6 B3
C7
GND
C8 B4
EMI608
Orientation Marking
B1
FILTER1 FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
FILTER7
FILTER8
A1
A1
A2
A3
A4
A5
A6
A7
A8
Notes: CSPEMI608 CSP Package 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
CSPEMI606 CSPEMI608 PIN(s) A1 A2 A3 A4 A5 A6 B1-B3 PIN(s) A1 A2 A3 A4 A5 A6 A7 A8 B1-B4 NAME NAME FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 GND DESCRIPTION DESCRIPTION Filter Channel 1 Filter Channel 2 Filter Channel 3 Filter Channel 4 Filter Channel 5 Filter Channel 6 Filter Channel 7 Filter Channel 8 Device Ground CSPEMI606 CSPEMI608 PIN(s) C1 C2 C3 C4 C5 C6 PIN(s) C1 C2 C3 C4 C5 C6 C7 C8 NAME NAME FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 DESCRIPTION DESCRIPTION Filter Channel 1 Filter Channel 2 Filter Channel 3 Filter Channel 4 Filter Channel 5 Filter Channel 6 Filter Channel 7 Filter Channel 8
Ordering Information
PART NUMBERING INFORMATION
Standard Finish Ordering Part Bumps 15 20 Package CSP CSP Number1 CSPEMI606 CSPEMI608 Part Marking 606 EMI608 Lead-free Finish 2 Ordering Part Number1 CSPEMI606G CSPEMI608G Part Marking 606 EMI608
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
(c) 2003 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com
10/10/03
PRELIMINARY CSPEMI606/608
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 500 UNITS C mW mW
STANDARD OPERATING CONDITIONS
PARAMETER Operating Temperature Range RATING -40 to +85 UNITS C
ELECTRICAL OPERATING CHARACTERISTICS1
SYMBOL R C VDIODE ILEAK VSIG PARAMETER Resistance Capacitance Diode Standoff Voltage Diode Leakage Current (reverse bias) Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off Frequency ZSOURCE=50 ZLOAD=50 , At 2.5V DC, 1MHz, 30mV AC IDIODE=10A VDIODE=+3.3V ILOAD = 10mA 5.6 -0.4 Notes 2,4 and 5 30 15 Notes 2,3,4 and 5 +12 -7 R=100, C=15pF 120 MHz V V kV kV 6.8 -0.8 9.0 -1.5 V V CONDITIONS MIN 80 12 5.5 100 TYP 100 15 MAX 120 18 UNITS pF V nA
VESD
VCL
fC
Note 1: TA=25C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: These parameters are guaranteed by design and characterization.
(c) 2003 California Micro Devices Corp. All rights reserved. 10/10/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com
3
PRELIMINARY CSPEMI606/608
Performance Information
Typical Filter Performance (TA=25C, DC Bias=0V, 50 Ohm Environment)
Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B1)
Figure 2. Insertion Loss VS. Frequency (A2-C2 to GND B1)
(c) 2003 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com
10/10/03
PRELIMINARY CSPEMI606/608
Performance Information (cont'd)
Typical Filter Performance (TA=25C, DC Bias=0V, 50 Ohm Environment)
Figure 3. Insertion Loss VS. Frequency (A3-C3 to GND B2)
Figure 4. Insertion Loss VS. Frequency (A4-C4 to GND B2)
(c) 2003 California Micro Devices Corp. All rights reserved. 10/10/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com
5
PRELIMINARY CSPEMI606/608
Performance Information (cont'd)
Typical Filter Performance (TA=25C, DC Bias=0V, 50 Ohm Environment)
Figure 5. Insertion Loss VS. Frequency (A5-C5 to GND B3)
Figure 6. Insertion Loss VS. Frequency (A6-C6 to GND B3)
(c) 2003 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com
10/10/03
PRELIMINARY CSPEMI606/608
Performance Information (cont'd)
Typical Filter Performance (TA=25C, DC Bias=0V, 50 Ohm Environment)
Figure 7. Insertion Loss VS. Frequency (A7-C7 to GND B4, CSPEMI608 Only)
Figure 8. Insertion Loss VS. Frequency (A8-C8 to GND B4, CSPEMI608 Only)
(c) 2003 California Micro Devices Corp. All rights reserved. 10/10/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com
7
PRELIMINARY CSPEMI606/608
Performance Information (cont'd)
Figure 9. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25C)
(c) 2003 California Micro Devices Corp. All rights reserved.
8
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com
10/10/03
PRELIMINARY CSPEMI606/608
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Soldering Maximum Temperature VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125mm - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50m +20m 60 seconds 260C
Non-Solder Mask Defined Pad 0.275mm DIA.
Solder Stencil Opening 0.330mm DIA.
Solder Mask Opening 0.325mm DIA.
Figure 10. Recommended Non-Solder Mask Defined Pad Illustration
250
Temperature (C)
200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0
Figure 11. Eutectic (SnPb) Solder Ball Reflow Profile
(c) 2003 California Micro Devices Corp. All rights reserved. 10/10/03
Figure 12. Lead-free (SnAgCu) Solder Ball Reflow Profile
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com
9
PRELIMINARY CSPEMI606/608
Mechanical Details
CSPEMI606/608 devices are packaged in a custom Chip Scale Packages (CSP). Dimensions for each of these devices are presented in the following pages. CSPEMI606 Mechanical Specifications The package dimensions for the CSPEMI606 are presented below.
C1
Mechanical Package Diagrams
BOTTOM VIEW
A1 B1 C B2 B4 B3
SIDE VIEW
PACKAGE DIMENSIONS
Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min 2.915 1.285 0.495 0.245 0.430 0.430 0.180 0.180 0.561 0.355 Nom 2.960 1.330 0.500 0.250 0.435 0.435 0.230 0.230 0.605 0.380 Max 3.005 1.375 0.505 0.255 0.440 0.440 0.280 0.280 0.649 0.405 Min Custom CSP 15 Inches Nom Max 0.1148 0.1165 0.1183 0.0506 0.0524 0.0541 0.0195 0.0197 0.0199 0.0096 0.0098 0.0100 0.0169 0.0171 0.0173 0.0169 0.0171 0.0173 0.0071 0.0091 0.0110 0.0071 0.0091 0.0110 0.0221 0.0238 0.0255 0.0140 0.0150 0.0159 3500 pieces
A2
C2
B A 1 2 3 4 5 6
0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
D1 D2
Package Dimensions for CSPEMI606 Chip Scale Package
# per tape and reel
Controlling dimension: millimeters
(c) 2003 California Micro Devices Corp. All rights reserved.
10
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com
10/10/03
PRELIMINARY CSPEMI606/608
Mechanical Details (cont'd)
CSPEMI608 Mechanical Specifications The package dimensions for the CSPEMI608 are presented below.
C1
Mechanical Package Diagrams
BOTTOM VIEW
A1 B1 C A2 B C2 B2 B4 B3
SIDE VIEW
PACKAGE DIMENSIONS
Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min 3.955 1.413 0.495 0.245 0.430 0.430 0.200 0.244 0.561 0.355 Nom 4.000 1.458 0.500 0.250 0.435 0.435 0.250 0.294 0.605 0.380 Max 4.045 1.503 0.505 0.255 0.440 0.440 0.300 0.344 0.649 0.405 Min Custom CSP 20 Inches Nom Max 0.1557 0.1575 0.1593 0.0556 0.0574 0.0592 0.0195 0.0197 0.0199 0.0096 0.0098 0.0100 0.0169 0.0171 0.0173 0.0169 0.0171 0.0173 0.0079 0.0098 0.0118 0.0096 0.0116 0.0135 0.0221 0.0238 0.0255 0.0140 0.0150 0.0159 3500 pieces
A 1
A 2 3 4 5 6 7 8 D1 D2
0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Package Dimensions for CSPEMI608 Chip Scale Package
# per tape and reel
Controlling dimension: millimeters
(c) 2003 California Micro Devices Corp. All rights reserved. 10/10/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com
11
PRELIMINARY CSPEMI606/608
Mechanical Details (cont'd)
CSP Tape and Reel Specifications
PART NUMBER CSPEMI606 CSPEMI608 CHIP SIZE (mm) 2.96 X 1.33 X 0.6 4.00 X 1.46 X 0.6 POCKET SIZE (mm) B0 X A0 X K0 3.10 X 1.45 X 0.74 4.11 X 1.57 X 0.76 TAPE WIDTH W 8mm 8mm REEL DIAMETER 178mm (7") 178mm (7")
10 Pitches Cumulative Tolerance On Tape 0.2 mm
QTY PER REEL 3500 3500
P0 4mm 4mm
P1 4mm 4mm
Po Top Cover Tape
Ao W
Ko
Bo
For Tape Feeder Reference Only including Draft. Concentric Around B.
Embossment
P1 User Direction of Feed
Center Lines of Cavity
Figure 13. Tape and Reel Mechanical Data
(c) 2003 California Micro Devices Corp. All rights reserved.
12
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com
10/10/03

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