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| CYStech Electronics Corp. SURFACE MOUNT SWITCHING DIODE Spec. No. : C329SE Issued Date : 2005.04.18 Revised Date : Page No. : 1/3 CDSN4148SE Description The CDSN4148SE is designed for high-speed switching application in hybrid thick-and thin-film circuits. Features *High speed switching *High mounting capability, strong surge withstand, high reliability *Case:1206(3216) standard package, molded plastic *Terminals: Solder plated, solderable per MIL-STD-750 method 2026 *Polarity: Indicated by cathode band *Mounting position: Any *Weight: 0.0085 gram(approximately) Mechanical data Absolute Maximum Ratings ( at TA=25C unless otherwise specified ) Characteristics Reverse Voltage Repetitive Peak Reverse Voltage Average Forward Current Surge Forward Current @ tp=1 s @ tp=1 s Power Dissipation Junction Temperature Storage Temperature Range Symbol VR VRRM IO IFSM PD Tj Ts Value 75 100 150 4 1 350 -55 to +175 -55 to +175 Unit V V mA A mW C C Characteristics (at TA=25C unless otherwise specified) Characteristics Forward Voltage at IF=50mA Frverse Current VR=20V VR =75V Capacitance between terminals at f=1MHz and 0V reverse voltage Reverse Recovery Time From IF=-IR=10mA to IRR=-1mA, VR=6V, RL=50 CDSN4148SE Symbol VF IR CT trr Min - Typ - Max 1 25 2.5 3 4 Unit V nA A pF ns CYStek Product Specification CYStech Electronics Corp. Characteristic Curves Forward Current Derating Curve 120 Percentage of Rated Forward Current---(%) 100 80 60 40 20 0 0 25 50 75 100 125 150 1 0.2 0.4 0.6 1000 Spec. No. : C329SE Issued Date : 2005.04.18 Revised Date : Page No. : 2/3 Forward Current vs Forward Voltage Forward Current---IF(mA) M ounting on glass epoxy PCBs -25 100 25 75 10 125 0.8 1 1.2 Ambient Temperature---TA() Forward Voltage---VF(V) Capacitance vs Reverse Voltage 5 Capacitance between terminals---C T(pF) Reverse Leakage Current vs Reverse Voltage 100 Reverse Leakage Current---IR(A) 4 f=1MHz Ta=25 10 150 3 1 12 5 2 0.1 7 5 1 0.01 25 0 0 2 4 6 8 10 12 14 Reverse Voltage---VR(V) 0.001 0 10 20 30 Reverse Voltage---VR(V) CDSN4148SE CYStek Product Specification CYStech Electronics Corp. 1206 Dimension Spec. No. : C329SE Issued Date : 2005.04.18 Revised Date : Page No. : 3/3 1206 Plastic Surface Mounted Package CYStek Package Code: SE *:Typical DIM A B C D Inches Min. Max. 0.118 0.126 0.020(typ) 0.063(typ) 0.055(typ) Millimeters Min. Max. 3.00 3.20 0.50(typ) 1.6(typ) 1.4(typ) DIM E F R - Inches Min. Max. 0.043(typ) 0.035(typ) 0.010(typ) - Millimeters Min. Max. 1.1(typ) 0.9(typ) 0.25(typ) - Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : * Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek reserves the right to make changes to its products without notice. * CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. CDSN4148SE CYStek Product Specification |
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