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| 3.0x1.5mm SMD CHIP LED LAMP APL3015SYCK SUPER BRIGHT YELLOW Features !3.0mmx1.5mm SMT LED, 1.4mm THICKNESS. !LOW POWER CONSUMPTION. !WIDE VIEWING ANGLE. !IDEAL FOR BACKLIGHT AND INDICATOR. !VARIOUS COLORS AND LENS TYPES AVAILABLE. !INNER LENS TYPE. !PACKAGE : 2000PCS / REEL. Description The Super Bright Yellow source color devices are made with DH InGaAlP on GaAs substrate Light Emitting Diode. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.2(0.0079") unless otherwise noted. 3. Lead spacing is measured where the lead emerge package. 4. Specifications are subject to change without notice. SPEC NO: CDA0329 APPROVED : J. Lu REV NO: V.1 CHECKED : DATE: OCT/25/2001 DRAWN: M.F.CAI PAGE: 1 OF4 Selection Guide Par t No . Dic e L en s Ty p e Iv (mc d ) @ 20 mA Mi n . APL3015SY CK SUPER BRIGHT Y ELLOW ( InGaAlP ) WATER CLEAR 40 Ty p . 100 Viewin g An g le 21/2 70 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25C Sy m b o l peak D 1/2 C P ar am et er Peak Wavelength D ev i c e Super Bright Yellow Ty p . 590 Max . Un its nm Tes t Co n d it io n s IF=20mA Dominate Wavelength Super Bright Yellow 590 nm IF=20mA Spectral Line Halfwidth Super Bright Yellow 20 nm IF=20mA Capacitance Super Bright Yellow 20 pF VF=0V;f=1MHz VF IR Forward Voltage Reverse Current Super Bright Yellow Super Bright Yellow 2.0 2.5 10 V uA IF=20mA V R = 5V Absolute Maximum Ratings at TA=25C P ar am et er Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating Temperature Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. Su p er B r ig h t Yello w 125 30 175 5 -40C To +85C -40C To +85C Un its mW mA mA V SPEC NO: CDA0329 APPROVED : J. Lu REV NO: V.1 CHECKED : DATE: OCT/25/2001 DRAWN: M.F.CAI PAGE: 2 OF4 Super Bright Yellow APL3015SYCK SPEC NO: CDA0329 APPROVED : J. Lu REV NO: V.1 CHECKED : DATE: OCT/25/2001 DRAWN: M.F.CAI PAGE: 3 OF4 APL3015SYCK SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: CDA0329 APPROVED : J. Lu REV NO: V.1 CHECKED : DATE: OCT/25/2001 DRAWN: M.F.CAI PAGE: 4 OF4 |
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