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| Preliminary 29-32 GHz Surface Mount Medium Power Amplifier AA032P1-A4 Patent Pending Features Surface Mount Package 11 dB Gain 24 dBm P1 dB Output Power 100% DC and RF Testing Description The AA032P1-A4 is a broadband millimeterwave medium power amplifier in a rugged surface mount package that is compatible with high-volume solder installation. The amplifier is designed for use in millimeterwave communication and sensor systems as an output stage or driver in the transmit chain or LO chain when high gain and high linearity is required. The robust ceramic surface mount package provides excellent electrical performance and a high degree of environmental protection for long-term reliability. All amplifiers are screened at the operating frequencies prior to shipment for guaranteed performance. Amplifier is targeted for highvolume millimeterwave applications such as point-to-point and point-to-multipoint wireless communications systems and satellite communication systems. Pin Out VG N/C VD RF In AA032P1-A4 YYWW Orientation N/C N/C N/C Indicated by Missing Castellations RF Out Electrical Specifications at 25C (VD = 6 V, VG = -1 V) Parameter Bandwidth Small Signal Gain1 Output Power at 1 dB Gain Compression2 Input Return Loss4 Output Return Drain Current3 1. Small signal gain over entire bandwidth is measured on 100% of parts. 2. Output power P1 dB is measured at 31 GHz on 100% of parts. 3. Drain current is measured on 100% of parts. 4. Not measured on 100% of parts. Symbol BW G P1 dB RLI RLO dG/dT ID Min. 29 9 23 Typ. 11 24 9 7 -0.038 400 Max. 32 Unit GHz dB dBm dB dB dB/C Loss4 Temperature Coefficient of Gain4 450 mA Alpha Industries, Inc. [978] 241-7000 * Fax [978] 241-7906 * Email sales@alphaind.com * www.alphaind.com Specifications subject to change without notice. 1/02A 1 29-32 GHz Surface Mount Medium Power Amplifier AA032P1-A4 Typical Performance Data (VD = 6 V, VG = -1 V) 20 20 -55C 10 S21 10 +85C +25C (dB) 0 S11 -10 S22 -20 25 30 35 40 (dB) 0 -10 -20 27 29 31 33 35 Frequency (GHz) Frequency (GHz) S-Parameters 27 P1 dB = 24.7 dBm @ 30 GHz 26 25 Gain vs. Temperature Output Power (dBm) 24 21 18 P1 dB = 23.0 dBm @ 28 GHz 15 P1 dB = 23.9 dBm @ 32 GHz 12 3 6 9 12 15 18 6.0 V 5.5 V P1 dB (dBm) P1 dB = 24.3 dBm @ 31GHz 24 23 22 21 20 29 30 31 32 Input Power (dBm) Frequency (GHz) Output Power vs. Input Power P1 dB vs. Frequency Outline Drawing 0.080 (0.20 mm) 0.291 (7.39 mm) 0.026 (0.66 mm) 0.153 (3.87 mm) C L Absolute Maximum Ratings Characteristic 0.065 (1.65 mm) 0.040 (1.02 mm) 0.037 (0.94 mm) C L Value -55C to +85C -65C to +125C 7 VDC 22 dBm Operating Temperature (TC) Storage Temperature (TST) Bias Voltage (VD) Power In (PIN) 0.306 (7.77 mm) YYWW 0.014 (0.36 mm) 0.054 (1.37 mm) 0.145 (3.68 mm) 0.275 (6.98 mm) 0.056 (1.42 mm) 0.040 (1.02 mm) 0.285 (7.24 mm) 2 Alpha Industries, Inc. [978] 241-7000 * Fax [978] 241-7906 * Email sales@alphaind.com * www.alphaind.com Specifications subject to change without notice. 1/02A 29-32 GHz Surface Mount Medium Power Amplifier AA032P1-A4 Typical S-Parameters at 25C (VD = 6 V, VG = -1 V) Frequency (GHz) 10 12 14 16 18 20 22 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 S11 Mag. (dB) -0.5 -0.7 -1.0 -1.3 -0.8 -0.6 -1.0 -2.4 -2.8 -3.1 -3.5 -6.1 -8.7 -7.8 -5.7 -5.0 -6.6 -7.5 -9.8 -13.4 -7.6 -5.8 -8.7 -4.8 Ang. (Deg.) -94 -158 111 39 -36 -109 -165 77 -7 -75 -136 159 121 60 1 -52 -86 -129 167 143 163 129 77 23 Mag. (dB) -35.3 -50.8 -56.9 -43.2 -40.3 -29.3 -15.8 -3.6 1.4 5.3 9.8 12.7 13.1 12.6 12.1 11.9 10.5 10.3 11.0 10.7 8.8 6.3 2.2 -0.4 S21 Ang. (Deg.) 4 -154 100 83 31 17 -76 171 106 43 -24 -104 179 111 51 -13 -71 -124 178 111 39 -25 -87 -141 Mag. (dB) -61.1 -51.1 -55.0 -43.0 -45.1 -39.2 -52.1 -38.7 -46.4 -39.8 -32.0 -28.7 -28.4 -28.0 -28.6 -28.4 -28.9 -27.7 -26.9 -26.1 -26.1 -23.7 -21.4 -19.8 S12 Ang. (Deg.) -114 176 99 84 8 62 41 -48 -65 -37 -75 -156 132 77 22 -23 -66 -114 -177 123 65 25 -16 -72 Mag. (dB) -0.5 -0.3 -0.4 -0.9 -1.3 -1.1 -2.1 -3.3 -3.3 -2.7 -2.8 -6.7 -17.0 -16.3 -19.6 -26.1 -14.2 -9.4 -10.8 -16.7 -11.9 -10.7 -11.5 -9.2 S22 Ang. (Deg.) 44 0 -37 -96 -147 166 104 -3 -55 -105 -152 162 145 -177 177 118 14 -10 -39 -114 149 99 47 9 Biasing For biasing on, adjust VG from 0 to approximately -1 V. Adjust VD from 0 to desired value (5 V-6 V recommended). Adjust VG to achieve desired ID (400 mA recommended). For biasing off, reverse the biasing on procedure. Alpha Industries, Inc. [978] 241-7000 * Fax [978] 241-7906 * Email sales@alphaind.com * www.alphaind.com Specifications subject to change without notice. 1/02A 3 29-32 GHz Surface Mount Medium Power Amplifier AA032P1-A4 Alpha-2TM Surface Mount Package Handling and Mounting Millimeterwave components require careful mounting design to maintain optimal performance. The Alpha-2TM surface mount package (patent pending) provides a rugged and repeatable electrical connection using standard solder techniques. The -A4 package is one of several parts in the Alpha-2TM surface mount package family. DC Connections Via Holes to Ground RF In RF Out Handling The -A4 surface mount package is very rugged. However, due to ceramic's brittle nature, one should exercise care when handling with metal tools. Do not apply heavy pressure to the lid. Vacuum tools may be used to pick and place this part. Only personnel trained in both ESD precautions and handling precautions should be allowed to handle these packages. DC Connections Footprint Geometry for -A4 Surface Mount Package. Mounting footprint geometry for the -A4 package will be supplied by Alpha Industries in electronic format upon request. Package Construction The -A4 surface mount package consists of a base and a lid. The package base is ceramic with filled vias and plated castellations. The package lid is unplated alumina. The lid seal is epoxy. Mounting the Package The -A4 surface mount package is compatible with highvolume surface mount installation using solder. RF and DC connections are accomplished with metallized edge castellations that hold solder fillets. Ground connections are accomplished by both metallized edge castellations and filled vias to the bottom of the package. Care should be taken to ensure that there are no voids or gaps in the solder so that good RF, DC and ground contact is maintained. Mounting Design The -A4 surface mount package is installed on top of a printed circuit board on a specially designed footprint. DC Bias Lines (Up to 3 per side) Electrically & Thermally Conductive Ground Plane RF In RF Out DC Bias Lines (Up to 3 per side) Printed Circuit Board Rogers 4003, 0.008" (0.20 mm) Thick or Equivalent -A4 Surface Mount Package Installation. 4 Alpha Industries, Inc. [978] 241-7000 * Fax [978] 241-7906 * Email sales@alphaind.com * www.alphaind.com Specifications subject to change without notice. 1/02A |
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