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 MC10H124 Quad TTL-to-MECL Translator With TTL Strobe Input
The MC10H124 is a quad translator for interfacing data and control signals between a saturated logic section and the MECL section of digital systems. The 10H part is a functional/pinout duplication of the standard MECL 10K family part, with 100% improvement in propagation delay, and no increase in power-supply current. * Propagation Delay, 1.5 ns Typical * Improved Noise Margin 150 mV (Over Operating Voltage and Temperature Range) * Voltage Compensated * MECL 10K-Compatible * Pb-Free Packages are Available*
5 6 7
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16 CDIP-16 L SUFFIX CASE 620A 1 16 PDIP-16 P SUFFIX CASE 648 1 1 PLCC-20 FN SUFFIX CASE 775 10H124 AWLYYWW 16 EIAJ-16 M SUFFIX CASE 966 1 A WL, L YY, Y WW, W = Assembly Location = Wafer Lot = Year = Work Week 10H124 ALYW MC10H124P AWLYYWW MC10H124L AWLYYWW
4 2 3 1
10
12 15
11 GND = PIN 16 VCC ( +5.0 VDC) = PIN 9 VEE ( -5.2 VDC) = PIN 8
13 14
Figure 1. Logic Diagram
BOUT AOUT BOUT AOUT AIN
COMMON STROBE
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10 9
GND COUT DOUT DOUT COUT DIN CIN VCC
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet.
BIN VEE
Pin assignment is for Dual-in-Line Package. For PLCC pin assignment, see Table 1.
Figure 2. Pin Assignment
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
(c) Semiconductor Components Industries, LLC, 2004
1
September, 2004 - Rev. 8
Publication Order Number: MC10H124/D
MC10H124
Table 1. DIP CONVERSION TABLE 16-Pin DIL to 20-Pin PLCC
16 PIN DIL 20 PIN PLCC 1 2 2 3 3 4 4 5 5 7 6 8 7 9 8 10 9 12 10 13 11 14 12 15 13 17 14 18 15 19 16 20
Table 2. MAXIMUM RATINGS
Symbol VEE VCC VI Iout TA Tstg Power Supply (VCC = 5.0 V) Power Supply (VEE = -5.2 V) Input Voltage (VCC = 5.0 V) TTL Output Current - Continuous - Surge Operating Temperature Range Storage Temperature Range - Plastic - Ceramic Characteristic Rating -8.0 to 0 0 to +7.0 0 to VCC 50 100 0 to +75 -55 to +150 -55 to +165 Unit Vdc Vdc Vdc mA C C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
Table 3. ELECTRICAL CHARACTERISTICS (VEE = -5.2 V 5%, VCC = 5.0 V 5.0%)
0 Symbol IE ICCH ICCL IR Characteristic Negative Power Supply Drain Current Positive Power Supply Drain Current Reverse Current Pin 6 Pin 7 Forward Current Pin 6 Pin 7 Input Breakdown Voltage Input Clamp Voltage High Output Voltage Low Output Voltage High Input Voltage Min - - - - - - - 5.5 - -1.02 -1.95 2.0 Max 72 16 25 200 50 -12.8 -3.2 - -1.5 -0.84 -1.63 - Min - - - - - - - 5.5 - -0.98 -1.95 2.0 25 Max 66 16 25 200 50 -12.8 -3.2 - -1.5 -0.81 -1.63 - Min - - - - - - - 5.5 - -0.92 -1.95 2.0 75 Max 72 18 25 200 50 mA -12.8 -3.2 - -1.5 -0.735 -1.60 - Vdc Vdc Vdc Vdc Vdc Unit mA mA mA
IF
V(BR)in VI VOH VOL VIH
VIL Low Input Voltage - 0.8 - 0.8 - 0.8 Vdc 1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through a 50 W resistor to -2.0 V.
Table 4. AC CHARACTERISTICS
0 Symbol
tpd tr tf
25 Max 2.5 1.5 1.5 Min 0.55 0.5 0.5 Max 2.65 1.6 1.6 Min 0.85 0.5 0.5
75 Max 3.1 1.7 1.7 Unit ns ns ns
Characteristic Propagation Delay Rise Time Fall Time
Min 0.55 0.5 0.5
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously.
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MC10H124
APPLICATIONS INFORMATION The MC10H124 has TTL-compatible inputs and MECL complementary open-emitter outputs that allow use as an inverting/non-inverting translator or as a differential line driver. When the common strobe input is at the low-logic level, it forces all true outputs to a MECL low-logic state and all inverting outputs to a MECL high-logic state.
ORDERING INFORMATION
Device MC10H124L MC10H124P MC10H124PG MC10H124FN MC10H124FNG MC10H124FNR2 MC10H124M* MC10H124MEL* Package CDIP-16 PDIP-16 PDIP-16 (Pb-Free) PLCC-20 PLCC-20 (Pb-Free) PLCC-20 EIAJ-16 (Pb-Free) EIAJ-16 (Pb-Free) Shipping 25 Units/Rail 25 Units/Rail 25 Units/Rail 46 Units/Rail 46 Units/Rail 1000 Tape & Reel 50 Units/Rail 2000 Tape & Reel
An advantage of this device is that TTL-level information can be transmitted differentially, via balanced twisted pair lines, to MECL equipment, where the signal can be received by the MC10H115 or MC10H116 differential line receivers. The power supply requirements are ground, +5.0 V, and -5.2 V.
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This device is manufactured with a Pb-Free external lead finish only.
Resource Reference of Application Notes
AN1405/D AN1406/D AN1503/D AN1504/D AN1568/D AN1642/D AND8001/D AND8002/D AND8020/D AND8066/D AND8090/D - ECL Clock Distribution Techniques - Designing with PECL (ECL at +5.0 V) - ECLinPSt I/O SPiCE Modeling Kit - Metastability and the ECLinPS Family - Interfacing Between LVDS and ECL - The ECL Translator Guide - Odd Number Counters Design - Marking and Date Codes - Termination of ECL Logic Devices - Interfacing with ECLinPS - AC Characteristics of ECL Devices
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MC10H124
PACKAGE DIMENSIONS
PLCC-20 FN SUFFIX PLASTIC PLCC PACKAGE CASE 775-02 ISSUE D
B -N- Y BRK D -L- -M- W D X V VIEW D-D Z 0.007 (0.180) U
M
T L-M
M
S
N
S S
0.007 (0.180)
T L-M
N
S
20
1
G1
0.010 (0.250)
S
T L-M
S
N
S
A Z R
0.007 (0.180) 0.007 (0.180)
M
T L-M T L-M
S
N N
S
M
S
S
H
0.007 (0.180)
M
T L-M
S
N
S
C
E 0.004 (0.100) G G1 0.010 (0.250) S T L-M J -T-
SEATING PLANE
K1 K F VIEW S 0.007 (0.180)
M
VIEW S
S
T L-M
S
N
S
N
S NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM A B C E F G H J K R U V W X Y Z G1 K1
INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 --- 0.025 --- 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 --- 0.020 2_ 10 _ 0.310 0.330 0.040 ---
MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 --- 0.64 --- 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 --- 0.50 2_ 10 _ 7.88 8.38 1.02 ---
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MC10H124
PACKAGE DIMENSIONS
CDIP-16 L SUFFIX CERAMIC DIP PACKAGE CASE 620A-01 ISSUE O
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. 5 THIS DRAWING REPLACES OBSOLETE CASE OUTLINE 620-10. DIM A B C D E F G H K L M N INCHES MIN MAX 0.750 0.785 0.240 0.295 --- 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 --- 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01
B
16
A
9
A M
B
1 8
L
16X
J
E F
0.25 (0.010)
M
TB
C K T N G
16X
SEATING PLANE
D
0.25 (0.010)
M
TA
PDIP-16 P SUFFIX PLASTIC DIP PACKAGE CASE 648-08 ISSUE T
-A-
16 9 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL.
B
1 8
F S
C
L
-T- H G D
16 PL
SEATING PLANE
K
J TA
M
M
0.25 (0.010)
M
DIM A B C D F G H J K L M S
INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040
MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01
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MC10H124
PACKAGE DIMENSIONS
EIAJ-16 M SUFFIX 16 PIN PLASTIC EIAJ PACKAGE CASE 966-01 ISSUE O
16 9
LE Q1 E HE M_ L DETAIL P
1
8
Z D e A VIEW P
c
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --- 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --- 0.78 INCHES MIN MAX --- 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --- 0.031
b 0.13 (0.005)
M
A1 0.10 (0.004)
ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
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MC10H124/D


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