View ISL83239E04_719109.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

(R)
CT RODU U CT E TE P L PROD OBSO ITUTE UBST 8E IBLE S POS Sheet ICL323 Data S
ISL83239E
June 2004 FN6015.3
15kV ESD Protected, 10nA SupplyCurrent, +3V to +5.5V, 250kbps, RS-232 Transmitters/Receivers
The Intersil ISL83239E contains 3.0V to 5.5V powered RS-232 transmitters/receivers which meet ElA/TIA-232 and V.28/V.24 specifications, even at VCC = 3.0V. Additionally, it provides 15kV ESD protection (IEC61000-4-2 Air Gap and Human Body Model) on transmitter outputs and receiver inputs (RS-232 pins). Targeted applications are cell phones, PDAs, Palmtops, and data cables where the low operational, and even lower standby, power consumption is critical. Efficient on-chip charge pumps, coupled with the manual powerdown function, reduce the standby supply current to a 10nA trickle. Small footprint packaging, and the use of small, low value capacitors ensure board space savings as well. Data rates greater than 250kbps are guaranteed at worst case load conditions. The ISL83239E is a 5 driver, 3 receiver device that also includes a noninverting always-active receiver for "wake-up" capability. Table 1 summarizes the features of the device represented by this data sheet, while Application Note AN9863 summarizes the features of each device comprising the ICL32XX 3V family.
Features
* ESD Protection For RS-232 I/O Pins to 15kV (IEC61000) * Drop In Replacement for SP3239E * Meets EIA/TIA-232 and V.28/V.24 Specifications at 3V * RS-232 Compatible Outputs at 2.7V * Latch-Up Free * On-Chip Voltage Converters Require Only Four External Capacitors * Manual Powerdown Feature * Flow Through Pinout * Rx and Tx Hysteresis For Improved Noise Immunity * Guaranteed Minimum Data Rate . . . . . . . . . . . . . 250kbps * Guaranteed Minimum Slew Rate . . . . . . . . . . . . . . . 6V/s * Wide Power Supply Range . . . . . . . Single +3V to +5.5V * Low Supply Current in Powerdown State. . . . . . . . . .10nA
Applications
* Any System Requiring RS-232 Communication Ports - Battery Powered, Hand-Held, and Portable Equipment - Laptop Computers, Notebooks, Palmtops - Modems, Printers and other Peripherals - PDA Data Cradles and Cables - Cellular/Mobile Phones, Data Cables
Part # Information
PART NO. ISL83239EIA ISL83239EIA-T ISL83239EIV ISL83239EIV-T TEMP. RANGE (C) -40 to 85 -40 to 85 -40 to 85 -40 to 85 PACKAGE 28 Ld SSOP Tape and Reel 28 Ld TSSOP Tape and Reel PKG. DWG. # M28.209 M28.209 M28.173 M28.173
TABLE 1. SUMMARY OF FEATURES NO. OF NO. OF PART NUMBER Tx. Rx. ISL83239E 5 3 NO. OF MONITOR Rx. (ROUTB) 1 DATA RATE (kbps) 250 Rx. ENABLE FUNCTION? No READY OUTPUT? No MANUAL POWERDOWN? Yes AUTOMATIC POWERDOWN FUNCTION? No
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright (c) Intersil Americas Inc. 2004. All Rights Reserved All other trademarks mentioned are the property of their respective owners.
ISL83239E Pinout
ISL83239E (SSOP, TSSOP) TOP VIEW
C2+ 1 GND 2 C23 28 C1+ 27 V+ 26 VCC 25 C124 T1IN 23 T2IN 22 T3IN 21 R1OUT 20 R2OUT 19 T4IN 18 R3OUT 17 T5IN 16 R1OUTB 15 N.C.
V- 4 T1OUT 5 T2OUT 6 T3OUT 7 R1IN 8 R2IN 9 T4OUT 10 R3IN 11 T5OUT 12 N.C. 13 SHDN 14
Pin Descriptions
PIN VCC V+ VGND C1+ C1C2+ C2TIN TOUT RIN ROUT ROUTB SHDN N.C. System power supply input (3.0V to 5.5V). Internally generated positive transmitter supply (+5.5V). Internally generated negative transmitter supply (-5.5V). Ground connection. External capacitor (voltage doubler) is connected to this lead. External capacitor (voltage doubler) is connected to this lead. External capacitor (voltage inverter) is connected to this lead. External capacitor (voltage inverter) is connected to this lead. TTL/CMOS compatible transmitter Inputs. 15kV ESD Protected, RS-232 level (nominally 5.5V) transmitter outputs. 15kV ESD Protected, RS-232 compatible receiver inputs. TTL/CMOS level receiver outputs. TTL/CMOS level, noninverting, always enabled receiver output. Active low input shuts down transmitters, receivers, and on-board power supply, to place device in low power mode. No internal connection. FUNCTION
2
ISL83239E Typical Operating Circuit
ISL83239E
C3 (OPTIONAL CONNECTION, NOTE 1) +3.3V 26 VCC 27 V+ 4 + C3 0.1F NOTE 2 C4 0.1F + T1OUT 23 22 T3IN T4IN T5IN TTL/CMOS LOGIC LEVELS 16 R1OUTB 21 R1OUT R1 R2OUT 20 R2 18 R3OUT R3 14 5k 5k 11 R3IN 5k 9 R2IN RS-232 LEVELS 8 R1IN 19 17 T4 10 12 T5OUT T2 6 7 T3OUT T4OUT + VT1 5 T2OUT RS-232 LEVELS T3 T5 GND 2 + 0.1F 28 + 25 1 + 3 24 T1IN C1+ C1C2+ C2-
C1 0.1F NOTE 2 C2 0.1F
T2IN
VCC
SHDN
NOTES: 1. The Negative Terminal of C3 Can Be Connected to Either VCC or GND. 2. For VCC = 3.15V (3.3V -5%), use C1 - C4 = 0.1F or greater. For VCC = 3.0V (3.3V -10%), use C1 - C4 = 0.22F.
3
ISL83239E
Absolute Maximum Ratings
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3V to -7V V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14V Input Voltages TIN, SHDN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25V Output Voltages TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.2V ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC +0.3V Short Circuit Duration TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Thermal Information
Thermal Resistance (Typical, Note 3)
JA (C/W)
28 Ld TSSOP Package . . . . . . . . . . . . . . . . . . . . . . 75 28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 100 Maximum Junction Temperature (Plastic Package) . . . . . . . 150C Maximum Storage Temperature Range . . . . . . . . . . . -65C to 150C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300C (Lead Tips Only)
Operating Conditions
Temperature Range ISL83239EI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40C to 85C
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE: 3. JA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
Test Conditions: VCC = 3.15V to 5.5V, C1 - C4 = 0.1F; VCC = 3V, C1 - C4 = 0.22F, Unless Otherwise Specified. Typicals are at TA = 25C TEST CONDITIONS TEMP (C) MIN TYP MAX UNITS
PARAMETER DC CHARACTERISTICS Supply Current, Powerdown Disabled Supply Current, Powerdown
All Outputs Unloaded, VCC = 3.15V, SHDN = VCC SHDN = GND
25 25
-
0.3 10
1.0 300
mA nA
LOGIC AND TRANSMITTER INPUTS AND RECEIVER OUTPUTS Input Logic Threshold Low Input Logic Threshold High TIN, SHDN TIN, SHDN VCC = 3.3V VCC = 5.0V Transmitter Input Hysteresis Input Leakage Current Output Leakage Current Output Voltage Low Output Voltage High RECEIVER INPUTS Input Voltage Range Input Threshold Low VCC = 3.3V VCC = 5.0V Input Threshold High Input Hysteresis Input Resistance TRANSMITTER OUTPUTS Output Voltage Swing Output Resistance Output Short-Circuit Current Output Leakage Current VOUT = 12V, VCC = 0V or 3V to 5.5V, SHDN = GND All Transmitter Outputs Loaded with 3k to Ground VCC = V+ = V- = 0V, Transmitter Output = 2V Full Full Full Full 5.0 300 5.4 10M 35 60 25 V mA A VCC = 3.3V to 5.0V Full 25 25 25 25 25 -25 0.6 0.8 3 1.2 1.5 1.6 0.5 5 25 2.4 7 V V V V V k TIN, SHDN SHDN = GND (Receivers Disabled) IOUT = 1.6mA IOUT = -1.0mA Full Full Full 25 Full Full Full Full 2.0 2.4 0.5 0.01 0.05 0.8 1.0 10 0.4 V V V V A A V V
VCC -0.6 VCC -0.1
4
ISL83239E
Electrical Specifications
Test Conditions: VCC = 3.15V to 5.5V, C1 - C4 = 0.1F; VCC = 3V, C1 - C4 = 0.22F, Unless Otherwise Specified. Typicals are at TA = 25C (Continued) TEST CONDITIONS TEMP (C) MIN TYP MAX UNITS
PARAMETER TIMING CHARACTERISTICS Maximum Data Rate Receiver Propagation Delay
RL = 3k, CL = 1000pF One Transmitter Switching Receiver Input to Receiver Output, CL = 150pF Normal Operation Normal Operation tPHL - tPLH tPHL - tPLH, CL = 150pF VCC = 3.3V, RL = 3k to 7k, Measured From 3V to -3V or -3V to 3V CL = 150pF to 1000pF CL = 150pF to 2500pF tPHL tPLH
Full 25 25 25 25 25 25 25 25
250 6 4
700 0.15 0.15 200 200 100 50 17 12
-
kbps s s ns ns ns
Receiver Output Enable Time Receiver Output Disable Time Transmitter Skew Receiver Skew Transition Region Slew Rate
30 30
ns V/s V/s
ESD PERFORMANCE RS-232 Pins (TOUT, RIN) Human Body Model IEC61000-4-2 Air Gap Discharge IEC61000-4-2 Contact Discharge All Other Pins Human Body Model 25 25 25 25 15 15 8 2.5 kV kV kV kV
Detailed Description
The ISL83239E operates from a single +3V to +5.5V supply, guarantees a 250kbps minimum data rate, requires only four small external 0.1F (0.22F for VCC = 3.0V) capacitors, features low power consumption, and meets all EIA/TIA-232 and V.28 specifications. The circuit is divided into three sections: The charge pump, the transmitters, and the receivers. mode (see Table 2). These outputs may be driven to 12V when disabled. The ISL83239E guarantees a 250Kbps data rate for full load conditions (3k and 250pF), VCC 3.0V, with one transmitter operating at full speed. Under more typical conditions of VCC 3.3V, C1-4 = 0.1F, RL = 3k, and CL = 250pF, one transmitter easily operates at 1Mbps. Transmitter inputs float if left unconnected, and may cause ICC increases. Connect unused inputs to GND for the best performance.
Charge-Pump
Intersil's new 3V RS-232 family utilizes regulated on-chip dual charge pumps as voltage doublers, and voltage inverters to generate 5.5V transmitter supplies from a VCC supply as low as 3.0V. This allows these devices to maintain RS-232 compliant output levels over the 10% tolerance range of 3.3V powered systems. The efficient on-chip power supplies require only four small, external 0.1F capacitors for the voltage doubler and inverter functions at VCC = 3.3V. See the "Capacitor Selection" section, and Table 3 for capacitor recommendations for other operating conditions. The charge pumps operate discontinuously (i.e., they turn off as soon as the V+ and V- supplies are pumped up to the nominal values), resulting in significant power savings.
Receivers
The ISL83239E contains standard inverting receivers that tristate when the SHDN control line is driven low. Additionally, it includes a noninverting (monitor) receiver (denoted by the ROUTB label) that is always active, regardless of the state of any control lines. All the receivers convert RS-232 signals to CMOS output levels and accept inputs up to 25V while presenting the required 3k to 7k input impedance (see Figure 1) even if the power is off (VCC = 0V). The receivers' Schmitt trigger input stage uses hysteresis to increase noise immunity and decrease errors due to slow input signal transitions. Monitor receivers remain active even during manual powerdown, making them extremely useful for Ring Indicator monitoring. Standard receivers driving powered down peripherals must be disabled to prevent current flow through the peripheral's protection diodes (see Figures 2 and 3). This renders them useless for wake up functions, but the
Transmitters
The transmitters are proprietary, low dropout, inverting drivers that translate TTL/CMOS inputs to EIA/TIA-232 output levels. Coupled with the on-chip 5.5V supplies, these transmitters deliver true RS-232 levels over a wide range of single supply system voltages. All transmitter outputs disable and assume a high impedance state when the device enters the powerdown 5
ISL83239E
corresponding monitor receiver can be dedicated to this task as shown in Figure 3.
VCC RXIN -25V VRIN +25V GND 5k RXOUT GND VROUT VCC VCC TRANSITION DETECTOR TO WAKE-UP LOGIC VCC R1OUTB RX VOUT = HI-Z R1OUT TX T1IN T1OUT SHDN = GND R1IN ISL83239E
FIGURE 1. INVERTING RECEIVER CONNECTIONS
Powerdown Functionality
This 3V device requires a nominal supply current of 0.3mA during normal operation (not in powerdown mode). This is considerably less than the 5mA to 11mA current required of 5V RS-232 devices. The already low current requirement drops significantly when the device enters powerdown mode. In powerdown, supply current drops to 10nA, because the on-chip charge pump turns off (V+ collapses to VCC, V- collapses to GND), and the transmitter outputs three-state. This micro-power mode makes the ISL83239E ideal for battery powered and portable applications.
POWERED DOWN UART
FIGURE 3. DISABLED RECEIVERS PREVENT POWER DRAIN
Capacitor Selection
The charge pumps require 0.1F capacitors for 3.3V (5% tolerance) operation. For other supply voltages refer to Table 3 for capacitor values. Do not use values smaller than those listed in Table 3. Increasing the capacitor values (by a factor of 2) reduces ripple on the transmitter outputs and slightly reduces power consumption. C2, C3, and C4 can be increased without increasing C1's value, however, do not increase C1 without also increasing C2, C3, and C4 to maintain the proper ratios (C1 to the other capacitors). When using minimum required capacitor values, make sure that capacitor values do not degrade excessively with temperature. If in doubt, use capacitors with a larger nominal value. The capacitor's equivalent series resistance (ESR) usually rises at low temperatures and it influences the amount of ripple on V+ and V-.
TABLE 3. REQUIRED CAPACITOR VALUES VCC (V) C1 (F) 0.22 0.1 0.047 0.22 C2, C3, C4 (F) 0.22 0.1 0.33 1.0
Software Controlled (Manual) Powerdown
On the ISL83239E, the powerdown control is via a simple shutdown (SHDN) pin. Driving this pin high enables normal operation, while driving it low forces the IC into it's powerdown state. Connect SHDN to VCC if the powerdown function isn't needed. Note that all the transmitter and receiver outputs three-state during shutdown (see Table 2). The time required to exit powerdown, and resume transmission is only 100s.
TABLE 2. POWERDOWN LOGIC TRUTH TABLE SHDN TRANSMITTER RECEIVER ROUTB MODE OF INPUT OUTPUTS OUTPUTS OUTPUT OPERATION L H High-Z Active High-Z Active Active Active Manual Powerdown Normal Operation
VCC
VCC CURRENT FLOW VOUT = VCC
3.0 to 3.6 (3.3V 10%) 3.15 to 3.6 (3.3V 5%) 4.5 to 5.5 3.0 to 5.5
VCC
Rx POWERED DOWN UART Tx GND SHDN = GND OLD RS-232 CHIP
Power Supply Decoupling
In most circumstances a 0.1F bypass capacitor is adequate. In applications that are particularly sensitive to power supply noise, decouple VCC to ground with a capacitor of the same value as the charge-pump capacitor C1. Connect the bypass capacitor as close as possible to the IC.
FIGURE 2. POWER DRAIN THROUGH POWERED DOWN PERIPHERAL
6
ISL83239E Operation Down to 2.7V
ISL83239E transmitter outputs meet RS-562 levels (3.7V), at the full data rate, with VCC as low as 2.7V. RS-562 levels typically ensure interoperability with RS-232 devices.
VCC 0.1F +
+ C1
C1+ C1-
VCC
V+
Transmitter Outputs when Exiting Powerdown
Figure 4 shows the response of two transmitter outputs when exiting powerdown mode. As they activate, the two transmitter outputs properly go to opposite RS-232 levels, with no glitching, ringing, nor undesirable transients. Each transmitter is loaded with 3k in parallel with 2500pF. Note that the transmitters enable only when the magnitude of the supplies exceed approximately 3V.
+ C3
+ C2
ISL83239E C2+ C2TIN ROUT TOUT
V-
C4 +
RIN 5K
CL
VCC 5V/DIV SHDN T1
SHDN
FIGURE 5. TRANSMITTER LOOPBACK TEST CIRCUIT
5V/DIV 2V/DIV T1IN
T2 VCC = +3.3V C1 - C4 = 0.1F TIME (20s/DIV)
T1OUT
FIGURE 4. TRANSMITTER OUTPUTS WHEN EXITING POWERDOWN
R1OUT VCC = +3.3V C1 - C4 = 0.1F 5s/DIV
High Data Rates
The ISL83239E maintains the RS-232 5V minimum transmitter output voltages even at high data rates. Figure 5 details a transmitter loopback test circuit, and Figure 6 illustrates the loopback test result at 120kbps. For this test, all transmitters were simultaneously driving RS-232 loads in parallel with 1000pF, at 120kbps. Figure 7 shows the loopback results for a single transmitter driving 1000pF and an RS-232 load at 250kbps. The static transmitters were also loaded with an RS-232 receiver.
FIGURE 6. LOOPBACK TEST AT 120kbps
5V/DIV T1IN
T1OUT
R1OUT VCC = +3.3V C1 - C4 = 0.1F 2s/DIV
FIGURE 7. LOOPBACK TEST AT 250kbps
7
ISL83239E Interconnection with 3V and 5V Logic
The ISL83239E directly interfaces with 5V CMOS and TTL logic families. Nevertheless, with the device at 3.3V, and the logic supply at 5V, AC, HC, and CD4000, outputs can drive ISL83239E inputs, but ISL83239E outputs do not reach the minimum VIH for these logic families. See Table 4 for more information.
TABLE 4. LOGIC FAMILY COMPATIBILITY WITH VARIOUS SUPPLY VOLTAGES VCC SYSTEM POWER-SUPPLY SUPPLY VOLTAGE VOLTAGE (V) (V) 3.3 5 5 3.3 5 3.3
IEC61000-4-2 Testing
The IEC61000 test method applies to finished equipment, rather than to an individual IC. Therefore, the pins most likely to suffer an ESD event are those that are exposed to the outside world (the RS-232 pins in this case), and the IC is tested in its typical application configuration (power applied) rather than testing each pin-to-pin combination. The lower current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the HBM test. The extra ESD protection built into this device's RS-232 pins allows the design of equipment meeting level 4 criteria without the need for additional board level protection on the RS-232 port. AIR-GAP DISCHARGE TEST METHOD For this test method, a charged probe tip moves toward the IC pin until the voltage arcs to it. The current waveform delivered to the IC pin depends on approach speed, humidity, temperature, etc., so it is difficult to obtain repeatable results.The "E" device RS-232 pins withstand 15kV air-gap discharges. CONTACT DISCHARGE TEST METHOD During the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. The result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than 8kV. All "E" family devices survive 8kV contact discharges on the RS-232 pins.
COMPATIBILITY Compatible with all CMOS families. Compatible with all TTL and CMOS logic families. Compatible with ACT and HCT CMOS, and with TTL. ISL83239E outputs are incompatible with AC, HC, and CD4000 CMOS inputs.
15kV ESD Protection
All pins on ISL832XX devices include ESD protection structures, but the ISL83239E incorporates advanced structures which allow the RS-232 pins (transmitter outputs and receiver inputs) to survive ESD events up to 15kV. The RS-232 pins are particularly vulnerable to ESD damage because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that might destroy unprotected ICs. These new ESD structures protect the device whether or not it is powered up, protect without allowing any latchup mechanism to activate, and don't interfere with RS-232 signals as large as 25V.
Human Body Model (HBM) Testing
As the name implies, this test method emulates the ESD event delivered to an IC during human handling. The tester delivers the charge through a 1.5k current limiting resistor, making the test less severe than the IEC61000 test which utilizes a 330 limiting resistor. The HBM method determines an ICs ability to withstand the ESD transients typically present during handling and manufacturing. Due to the random nature of these events, each pin is tested with respect to all other pins. The RS-232 pins on "E" family devices can withstand HBM ESD events to 15kV.
8
ISL83239E Typical Performance Curves
6 TRANSMITTER OUTPUT VOLTAGE (V) VOUT+ 4 20 2 0 -2 -4 -6 VOUT -SLEW 0 1000 2000 3000 4000 5000 5 0 1000 2000 3000 4000 5000 1 TRANSMITTER AT 250kbps OTHER TRANSMITTERS AT 30kbps SLEW RATE (V/s) -SLEW
VCC = 3.3V, TA = 25C
25
15
+SLEW
10
LOAD CAPACITANCE (pF)
LOAD CAPACITANCE (pF)
FIGURE 8. TRANSMITTER OUTPUT VOLTAGE vs LOAD CAPACITANCE
FIGURE 9. SLEW RATE vs LOAD CAPACITANCE
55 50 SUPPLY CURRENT (mA) 45 40 35 30 25 20 0 1000 20kbps 120kbps SUPPLY CURRENT (mA) 250kbps
3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 2.5
NO LOAD ALL OUTPUTS STATIC
2000
3000
4000
5000
3.0
3.5
4.0
4.5
5.0
5.5
6.0
LOAD CAPACITANCE (pF)
SUPPLY VOLTAGE (V)
FIGURE 10. SUPPLY CURRENT vs LOAD CAPACITANCE WHEN TRANSMITTING DATA
FIGURE 11. SUPPLY CURRENT vs SUPPLY VOLTAGE
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP): GND TRANSISTOR COUNT: 609 PROCES Si Gate CMOS
9
ISL83239E Shrink Small Outline Plastic Packages (SSOP)
N INDEX AREA H E -B1 2 3 SEATING PLANE -AD -CA 0.25 0.010 L GAUGE PLANE 0.25(0.010) M BM
M28.209 (JEDEC MO-150-AH ISSUE B)
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A A1 A2 B C D MIN 0.002 0.065 0.009 0.004 0.390 0.197 MAX 0.078 0.072 0.014 0.009 0.413 0.220 MILLIMETERS MIN 0.05 1.65 0.22 0.09 9.90 5.00 MAX 2.00 1.85 0.38 0.25 10.50 5.60 NOTES 9 3 4 6 7 8o Rev. 1 3/95

A1 0.10(0.004)
E
A2 C
e
B 0.25(0.010) M C AM BS
e H L N
0.026 BSC 0.292 0.022 28 0o 8o 0.322 0.037
0.65 BSC 7.40 0.55 28 0o 8.20 0.95
NOTES: 4. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 5. Dimensioning and tolerancing per ANSI Y14.5M-1982. 6. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 7. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 8. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 9. "L" is the length of terminal for soldering to a substrate. 10. "N" is the number of terminal positions. 11. Terminal numbers are shown for reference only. 12. Dimension "B" does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of "B" dimension at maximum material condition. 13. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
10
ISL83239E Thin Shrink Small Outline Plastic Packages (TSSOP)
N INDEX AREA E E1 -B1 2 3 0.05(0.002) -AD -CSEATING PLANE A 0.25 0.010 L 0.25(0.010) M GAUGE PLANE BM
M28.173
28 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A A1 A2 b c MIN 0.002 0.031 0.0075 0.0035 0.378 0.169 MAX 0.047 0.006 0.051 0.0118 0.0079 0.386 0.177 MILLIMETERS MIN 0.05 0.80 0.19 0.09 9.60 4.30 MAX 1.20 0.15 1.05 0.30 0.20 9.80 4.50 NOTES 9 3 4 6 7 8o Rev. 0 6/98
e
b 0.10(0.004) M C AM BS
A1 0.10(0.004)
D
A2 c
E1 e E L N
0.026 BSC 0.246 0.0177 28 0o 8o 0.256 0.0295
0.65 BSC 6.25 0.45 28 0o 6.50 0.75
NOTES: 14. These package dimensions are within allowable dimensions of JEDEC MO-153-AE, Issue E. 15. Dimensioning and tolerancing per ANSI Y14.5M-1982. 16. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 17. Dimension "E1" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 18. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 19. "L" is the length of terminal for soldering to a substrate. 20. "N" is the number of terminal positions. 21. Terminal numbers are shown for reference only. 22. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of "b" dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 23. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. (Angles in degrees)
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com 11

▲Up To Search▲

Price & Availability of ISL83239E04

	To Download ISL83239E04 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .