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Global Mixed-mode Technology Inc.
Remote/Local Temperature Sensor with SMBus Serial Interface
Features
Two Channels: Measures Both Remote and Local Temperatures No Calibration Required SMBus 2-Wire Serial Interface Programmable Under/Overtemperature Alarms Supports SMBus Alert Response Accuracy: 2C (+60C to + 100C, local) 3C (-40C to +125C, local) 3C (+60C to +100C, remote) 3A (typ) Standby Supply Current 70A (max) Supply Current in Auto- Convert Mode +3V to +5.5V Supply Range Small, 16-Pin SSOP Package
G767
General Description
The G767 is a precise digital thermometer that reports the temperature of both a remote sensor and its own package. The remote sensor is a diode-connected transistor typically a low-cost, easily mounted 2N3904 NPN type-that replace conventional thermistors or thermocouples. Remote accuracy is 3C for multiple transistor manufacturers, with no calibration needed. The remote channel can also measure the die temperature of other ICs, such as microprocessors, that contain an on-chip, diode-connected transistor. The 2-wire serial interface accepts standard System Management Bus (SMBusTM) Write Byte, Read Byte, Send Byte, and Receive Byte commands to program the alarm thresholds and to read temperature data. The data format is 7 bits plus sign, with each bit corresponding to 1C, in two's-complement format. Measurements can be done automatically and autonomously, with the conversion rate programmed by the user or programmed to operate in a single-shot mode. The adjustable rate allows the user to control the supply-current drain. The G767 is available in a small, 16-pin SSOP surface-mount package.
Applications
Desktop and Notebook Computers Smart Battery Packs LAN Servers Industrial Controls Central Office Telecom Equipment Test and Measurement Multi-Chip Modules
Ordering Information
ORDER ORDER NUMBER NUMBER (Pb free)
G767 G767f
TEMP. RANGE
-55C to +125C
PACKAGE
SSOP-16
Pin Configuration
G767
Typical Operating Circuit
3V TO 5.5V N.C. Vcc DXP DXN N.C. ADD1 GND 1 2 3 4 5 6 7 16 15 14 13 12 11 10 9 N.C STBY SMBCLK N.C. SMBDATA ALERT ADD0 N.C. 2N3904 2200 pF DXN Vcc STBY 10k EACH 0.1 F 200
DXP
SMBCLK SMBDATA ALERT
CLOCK DATA INTERRUPT TO C
ADD0 ADD1 GND
GND 8
SSOP-16
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Absolute Maximum Ratings
Vcc to GND......................................-0.3V to +6V DXP, ADD to GND....................-0.3V to (Vcc + 0.3V) DXN to GND..................................-0.3V to +0.8V SMBCLK, SMBDATA, ALERT , STBY to GND............ .........................................................-0.3V to +6V SMBDATA, ALERT Current.............-1mA to +50mA DXN Current................................................1mA
G767
ESD Protection (SMBCLK, SMBDATA, ALERT , human body model)......................................4000V ESD Protection (other pins, human body model)..2000V Continuous Power Dissipation (T A = +70C) SSOP(derate 8.30mW/C above +70C).........667mW Operating Temperature Range..........-55C to +125C Junction Temperature.................................+150C Storage temperature Range.............-65C to +165C Reflow Temperature (soldering, 10sec)................260C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Electrical Characteristics
(Vcc = + 3.3V, TA = 0C to +85C, unless otherwise noted.) PARAMETER
ADC and power supply Temperature Resolution (Note 1) Monotonicity guaranteed Initial Temperature Error, TA = +60C to +100C Local Diode (Note 2) TA = 0C to +85C Temperature Error, Remote Di- TR = +60C to +100C ode (Notes 2 and 3) TR = -55C to +125C Temperature Error, Local Diode Including long-term drift (Notes 1 and 2)
CONDITIONS
MIN TYP MAX UNITS
8 -2 -3 -3 -5 -2.5 -3.5 3.0 2.6 --1.0 ----------94 -25 80 8 ------------------2.8 50 1.7 50 3 4 35 120 125 --100 10 160 --2 3 3 5 2.5 3.5 5.5 2.95 --2.5 --10 --70 180 156 25 120 12 --A ms % A A Bits C C C V V mV V mV A
TA = +60C to +100C TA = 0C to +85C
Supply-Voltage Range Undervoltage Lockout Threshold Vcc input, disables A/D conversion, rising edge Undervoltage Lockout Hysteresis Power-On Reset Threshold Vcc , falling edge POR Threshold Hysteresis SMBus static Logic inputs forced Standby Supply Current Hardware or software to Vcc or GND standby, SMBCLK at 10kHz Auto-convert mode,average meas- 0.25 conv/sec Average Operating Supply ured over 4sec. Logic inputs forced Current 2.0 conv/sec to Vcc or GND Conversion Time From stop bit to conversion complete(both channels) Conversion Rate Timing Error Remote-Diode Source Current Address Pin Bias Current Auto-convert mode DXP forced to 1.5V High level Low level ADD0, ADD1; momentary upon power-on reset
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Electrical Characteristics (continued) (Vcc = + 3.3V, TA = 0 to +85C, unless otherwise noted.) PARAMETER CONDITIONS
SMBus Interface Logic Input High Voltage Logic Input Low Voltage Logic Output Low Sink Current
ALERT Output High Leakage Current
G767
MIN TYP MAX UNITS
2.2 --6 ---1 --DC 4.7 4 4.7 500 4 4 800 0 ------------5 ----------------------0.8 --1 1 --100 ----------------1 V V mA A A pF kHz s s s ns s s ns s s
STBY , SMBCLK, SMBDATA; Vcc = 3V to 5.5V STBY , SMBCLK, SMBDATA; Vcc = 3V to 5.5V
ALERT , SMBDATA forced to 0.4V ALERT forced to 5.5V
Logic Input Current SMBus Input Capacitance SMBus Clock Frequency SMBCLK Clock Low Time SMBCLK Clock High Time SMBus Start-Condition Setup Time
Logic inputs forced to Vcc or GND SMBCLK, SMBDATA (Note 4) tLOW , 10% to 10% points tHIGH , 90% to 90% points
SMBus Repeated Start-Condition Setup Time tSU : STA , 90% to 90% points SMBus Start-Condition Hold Time tHD: STA , 10% of SMBDATA to 90% of SMBCLK SMBus Start-Condition Setup Time SMBus Data Valid to SMBCLK Rising-Edge Time SMBus Data-Hold Time SMBCLK Falling Edge to SMBus Data-Valid Time tSD: STO , 90% of SMBDATA to 10% of SMBDATA tSU: DAT , 10% or 90% of SMBDATA to 10% of SMBCLK tHD : DAT (Note 5) Master clocking in data
Electrical Characteristics
(Vcc = + 3.3V, TA = -5.5 to + 125C, unless otherwise noted.) (Note 6) PARAMETER CONDITIONS
ADC and power supply Temperature Resolution (Note 1) Initial Temperature Error, Local Diode (Note 2) Temperature Error, Remote Diode (Notds2 and 3) Supply-Voltage Range Conversion Time Conversion Rate Timing Error SMBus Interface Logic Input High Voltage Logic Input Low Voltage Logic Output Low Sink Current
ALERT Output High Leakage Current
MIN TYP MAX UNITS
8 -2 -3 -3 -5 3.0 94 -25 2.2 2.4 --6 ---2 ------------125 ----------------2 3 3 5 5.5 156 25 ----0.8 --1 2 Bits C C V ms %
Monotonicity guaranteed TA = +60C to +100C TA = -55C to +125C TR = +60C to +100C TR = -55C to +125C From stop bit to conversion complete (both channels) Auto-convert mode Vcc = 3V
Vcc = 5.5V STBY, SMBCLK, SMBDATA; Vcc = 3V to 5.5V ALERT, SMBDATA forced to 0.4V ALERT forced to 5.5V Logic inputs forced to Vcc or GND
STBY, SMBCLK, SMBDATA
V V mA A A
Logic Input Current
Note1: Guaranteed but not 100% tested. Note2: Quantization error is not included in specifications for temperature accuracy. For example, if the G767 device temperature is exactly +66.7C, or +68C (due to the quantization error plus the +1/2C offset used for rounding up) and still be within the guaranteed 1C error limits for the +60C to 100C temperature range. See Table2. Note3: A remote diode is any diode-connected transistor from Table1. TR is the junction temperature of the remote of the remote diode. See Remote Diode Selection for remote diode forward voltage requirements. Note4: The SMBus logic block is a static design that works with clock frequencies down to DC. While slow operation is possible, it violates the 10kHz minimum clock frequency and SMBus specifications, and may monopolize the bus. Note5: Note that a transition must internally provide at least a hold time in order to bridge the undefined region (300ns max) of SMBCLK's falling edge. Note6: Specifications from -55C to +125C are guaranteed by design, not production tested.
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Pin Description
PIN
1,5,9,13,16 2 3 4 6 7,8 10 11 12 14 15
G767
NAME
N.C. Vcc DXP DXN ADD1 GND ADD0
ALERT
FUNCTION
No Connection. Not internally connected. May be used for PC board trace routing Supply Voltage Input , 3V to 5.5V. Bypass to GND with a 0.1F capacitor. A 200 series resistor is recommended but not required additional noise filtering. Combined Current Source and A/D Positive Input for remote-diode channel. Do not leave DXP floating; tie DXP to DXN if no remote diode is used. Place a 2200pF capacitor between DXP and DXN for noise filtering. Combined Current Sink and A/D Negative Input. SMBus Address Select pin (Table 8). ADD0 and ADD1 are sampled upon power-up. Excess capacitance (>50pF) at the address pins when floating may cause address-recognition problems. Ground SMBus Slave Address Select pin SMBus Alert (interrupt) Output, open drain
SMBDATA SMBus Serial-Data Input / Output , open drain SMBCLK SMBus Serial-Clock Input Hardware Standby Input. Temperature and comparison threshold data are retained in standby mode. STBY Low = standby mode, high = operate mode.
Detailed Description
The G767 is a temperature sensor designed to work in conjunction with an external microcontroller (C) or other intelligence in thermostatic, process-control, or monitoring applications. The C is typically a power-management or keyboard controller, generating SMBus serial commands by "bit-banging" general-purpose input-output (GPIO) pins or via a dedicated SMBus interface block. Essentially an 8-bit serial analog-to digital converter (ADC) with a sophisticated front end, the G767 contains a switched current source, a multiplexer, an ADC, an SMBus interface, and associated control logic (Figure 1). Temperature data from the ADC is loaded into two data registers, where it is automatically compared with data previously stored in four over/under- temperature alarm registers. 60ms period (each channel, typical), with excellent noise rejection. The multiplexer automatically steers bias currents through the remote and local diodes, measures their forward voltages, and computes their temperatures. Both channels are automatically converted once the conversion process has started, either in free-running or single-shot mode. If one of the two channels is not used, the device still performs both measurements, and the user can simply ignore the results of the unused channel. If the remote diode channel is unused, tie DXP to DXN rather than leaving the pins open. The worst-case DXP-DXN differential input voltage range is 0.25V to 0.95V. Excess resistance in series with the remote diode causes about +1/2C error per ohm. Likewise, 200V of offset voltage forced on DXP-DXN causes about 1C error.
ADC and Multiplexer The ADC is an averaging type that integrates over a
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STBY ADD0 ADD1 VCC ADDRESS DECODER 2
REMOTE
G767
MUX DXP DXN + + + ADC CONTROL LOGIC
LOCAL
7 SMBUS
SMBDATA SMBCLK
DIODE FAULT
READ WRITE
8
8
8
REMOTE TEMPERATURE DATA REGISTER
LOCAL EMPERATURE DATA REGISTER
8
COMMAND BYTE (INDEX) REGISTER
8
HIGH-TEMPETATURE THRESHOLD (REMOTEHIGH)
HIGH-TEMPETATURE THRESHOLD (LOCALTHIGH)
8
STATUS BYTE REGISTER
LOW-TEMPETATURE THRESHOLD (REMOTELOW)
LOW-TEMPETATURE THRESHOLD (LOCAL TLOW)
CONFIGURATION BYTE REGISTER
8
DIGITAL COMPARATOR (REMOTE) CONVERSION RATE REGISTER
DIGITAL COMPARATOR (LOCAL)
ALERT
Q R S
SELECTED VIA SLAVE ADD = 0001 100
ALERT RESPONSE ADDRESS REGISTER
Figure 1. Functional Diagram A/D Conversion Sequence If a Start command is written (or generated automatically in the free-running auto-convert mode), both channels are converted, and the results of both measurements are available after the end of conversion. A BUSY status bit in the status byte shows that the device is actually performing a new conversion; however, even if the ADC is busy, the results of the previous conversion are always available. Remote-Diode Selection Temperature accuracy depends on having a good-quality, diode-connected small-signal transistor. Accuracy has been experimentally verified for all of the devices listed in Table 1. The G767 can also directly measure the die temperature of CPUs and other integrated circuits having on-board temperature-sensing diodes.
The transistor must be a small-signal type with a relatively high forward voltage; otherwise, the A/D input voltage range can be violated. The forward voltage must be greater than 0.25V at 10A; check to ensure
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this is true at the highest expected temperature. The forward voltage must be less than 0.95V at 100A; check to ensure this is true at the lowest expected temperature. Large power transistors don't work at all. Also, ensure that the base resistance is less than 100. Tight specifications for forward-current gain (+50 to +150, for example) indicate that the manufacturer has good process controls and that the devices have consistent VBE characteristics.
Thermal Mass and Self-Heating Thermal mass can seriously degrade the G767's effective accuracy. The thermal time constant of the SSOP-16 package is about 140sec in still air. For the G767 junction temperature to settle to within +1C after a sudden +100C change requires about five time constants or 12 minutes. The use of smaller packages for remote sensors, such as SOT23s, improves the situation. Take care to account for thermal gradients between the heat source and the sensor, and ensure that stray air currents across the sensor package do not interfere with measurement accuracy.
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Self-heating does not significantly affect measurement accuracy. Remote-sensor self-heating due to the diode current source is negligible. For the local diode, the worst-case error occurs when auto-converting at the fastest rate and simultaneously sinking maximum current at the ALERT output. For example, at an 8Hz rate and with ALERT sinking 1mA, the typical power dissipation is Vcc x 450A plus 0.4V x 1mA. Package theta J-A is about 150C /W, so with Vcc = 5V and no copper PC board heat-sinking, the resulting temperature rise is: dT = 2.7mW x 150C /W = 0.4C Even with these contrived circumstances, it is difficult to introduce significant self-heating errors.
Do not route the DXP-DXN lines next to the deflection coils of a CRT. Also, do not route the traces across a fast memory bus, which can easily introduce +30C error, even with good filtering, Otherwise, most noise sources are fairly benign.
G767
Route the DXP and DXN traces in parallel and in close proximity to each other, away from any high-voltage traces such as +12VDC. Leakage currents from PC board contamination must be dealt with carefully, since a 20M leakage path from DXP to ground causes about +1C error. Connect guard traces to GND on either side of the DXP-DXN traces (Figure 2). With guard traces in place, routing near high-voltage traces is no longer an issue. Route through as few vias and crossunders as possible to minimize copper/solder thermocouple effects. When introducing a thermocouple, make sure that both the DXP and the DXN paths have matching thermocouples. In general, PC board-induced thermocouples are not a serious problem, A copper-solder thermocouple exhibits 3V/C, and it takes about 200V of voltage error at DXP-DXN to cause a +1C measurement error. So, most parasitic thermocouple errors are swamped out. Use wide traces. Narrow ones are more inductive and tend to pick up radiated noise. The 10 mil widths and spacing recommended on Figure 2 aren't absolutely necessary (as they offer only a minor improvement in leakage and noise), but try to use them where practical. Keep in mind that copper can't be used as an EMI shield, and only ferrous materials such as steel work will. Placing a copper ground plane between the DXP-DXN traces and traces carrying high-frequency noise signals does not help reduce EMI.
Table 1. Remote-Sensor Transistor Manufacturers MANUFACTURER
Philips Motorola(USA) National Semiconductor(USA)
MODEL NUMBER
PMBS3904 MMBT3904 MMBT3904
Note:Transistors must be diode-connected (base shorted to collector).
ADC Noise Filtering The ADC is an integrating type with inherently good noise rejection, especially of low-frequency signals such as 60Hz/120Hz power-supply hum. Micropower operation places constraints on high-frequency noise rejection; therefore, careful PC board layout and proper external noise filtering are required for high-accuracy remote measurements in electrically noisy environments.
High-frequency EMI is best filtered at DXP and DXN with an external 2200pF capacitor. This value can be increased to about 3300pF(max), including cable capacitance. Higher capacitance than 3300pF introduces errors due to the rise time of the switched current source. Nearly all noise sources tested cause the ADC measurements to be higher than the actual temperature, typically by +1C to 10C, depending on the frequency and amplitude (see Typical Operating Characteristics).
PC Board Layout Place the G767 as close as practical to the remote diode. In a noisy environment, such as a computer motherboard, this distance can be 4 in. to 8 in. (typical) or more as long as the worst noise sources (such as CRTs, clock generators, memory buses, and ISA/PCI buses) are avoided.
PC Board Layout Checklist Place the G767 close to a remote diode. Keep traces away from high voltages (+12V bus). Keep traces away from fast data buses and CRTs. Use recommended trace widths and spacing. Place a ground plane under the traces Use guard traces flanking DXP and DXN and con necting to GND. Place the noise filter and the 0.1F Vcc bypass capacitors close to the G767. Add a 200 resistor in series with Vcc for best noise filtering (see Typical Operating Circuit).
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GND 10 MILS 10 MILS DXP MINIMUM 10 MILS DXN 10 MILS GND
G767
Figure 2. Recommended DXP/DXN PC Traces Twisted Pair and Shielded Cables For remote-sensor distances longer than 8 in., or in particularly noisy environments, a twisted pair is recommended. Its practical length is 6 feet to 12feet (typical) before noise becomes a problem, as tested in a noisy electronics laboratory. For longer distances, the best solution is a shielded twisted pair like that used for audio microphones. Connect the twisted pair to DXP and DXN and the shield to GND, and leave the shield's remote end unterminated.
Excess capacitance at DX_limits practical remote sensor distances (see Typical Operating Characteristics), For very long cable runs, the cable's parasitic capacitance often provides noise filtering, so the 2200pF capacitor can often be removed or reduced in value. Cable resistance also affects remote-sensor accuracy; 1 series resistance introduces about + 1C error.
Activate hardware standby mode by forcing the STBY pin low. In a notebook computer, this line may be connected to the system SUSTAT# suspend-state signal. The STBY pin low state overrides any software conversion command. If a hardware or software standby command is received while a conversion is in progress, the conversion cycle is truncated, and the data from that conversion is not latched into either temperature reading register. The previous data is not changed and remains available. Supply-current drain during the 125ms conversion period is always about 450A. Slowing down the conversion rate reduces the average supply current (see Typical Operating Characteristics). In between conversions, the instantaneous supply current is about 25A due to the current consumed by the conversion rate timer. In standby mode, supply current drops to about 3A. At very low supply voltages (under the power-on-reset threshold), the supply current is higher due to the address pin bias currents. It can be as high as 100A, depending on ADD0 and ADD1 settings.
Low-Power Standby Mode Standby mode disables the ADC and reduces the supply-current drain to less than 10A. Enter standby mode by forcing the STBY pin low or via the RUN/STOP bit in the configuration byte register. Hardware and software standby modes behave almost identically: all data is retained in memory, and the SMB interface is alive and listening for reads and writes. The only difference is that in hardware standby mode, the one-shot command does not initiate a conversion.
Standby mode is not a shutdown mode. With activity on the SMBus, extra supply current is drawn (see Typical Operating Characteristics). In software standby mode, the G767 can be forced to perform A/D conversions via the one-shot command, despite the RUN/STOP bit being high.
SMBus Digital Interface From a software perspective, the G767 appears as a set of byte-wide registers that contain temperature data, alarm threshold values, or control bits, A standard SMBus 2-wire serial interface is used to read temperature data and write control bits and alarm threshold data. Each A/D channel within the device responds to the same SMBus slave address for normal reads and writes.
The G767 employs four standard SMBus protocols: Write Byte, Read Byte, Send Byte, and Receive Byte (Figure 3). The shorter Receive Byte protocol allows quicker transfers, provided that the correct data register was previously selected by a Read Byte instruction. Use caution with the shorter protocols in multi-master systems, since a second master could overwrite the command byte without informing the first master. The temperature data format is 7bits plus sign in twos-complement form for each channel, with each data bit representing 1C (Table 2), transmitted MSB first. Measurements are offset by +1/2C to minimize internal rounding errors; for example, +99.6C is reported as +100C.
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Write Byte Format S ADDRESS
7 bits
G767
DATA
8 bits
WR
ACK
COMMAND
8 bits
ACK
ACK
P
1
Slave Address: equivalent to chip- select line of a 3-wire interface Command Byte: selects which register you are writing to Data byte: data goes into the register set by the command byte (to set thresholds, configuration masks, and sam pling rate) Read Byte Format S ADDRESS WR
7 bits
ACK
COMMAND
8bits
ACK
S
ADDRESS
7bits
RD
ACK
DATA
8 bits
///
P
Slave Address: equivalent to chip- select line Command Byte: selects which register you are reading from Slave Address: repeated due to change in data-flow direction Data byte: reads from the register set by the command byte Send Byte Format S ADDRESS
7 bits
WR
ACK
COMMAND
8 bits
ACK
P
Command Byte: sends command with no data , usually used for one-shot command Receive Byte Format S ADDRESS
7 bits
RD
ACK
DATA
8 bits
///
P
Data Byte: reads data from the register commanded by the last Read Byte or Write Byte transmission; also used for SMBus Alert Response return address
S = Start condition Shaded = Slave transmission P = Stop condition /// = Not acknowledged
Figure 3. SMBus Protocols Table 2. Data Format (Twos-Complement) DIGITAL OUTPUT ROUND TEMP. TEMP. DATA BITS (C) (C) SIGN MSB LSB
+130.00 +127.00 +126.50 +126.00 +25.25 +0.50 +0.25 +0.00 -0.25 -0.50 -0.75 -1.00 -25.00 -25.50 -54.75 -55.00 -65.00 -70.00 +127 +127 +127 +126 +25 +1 +0 +0 +0 +0 -1 -1 -25 -25 -55 -55 -65 -65 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 111 111 111 111 001 000 000 000 000 000 111 111 110 110 100 100 011 011 1111 1111 1111 1110 1001 0001 0000 0000 0000 0000 1111 1111 0111 0110 1001 1001 1111 1111
Alarm Threshold Registers Four registers store alarm threshold data, with high-temperature (THIGH) and low-temperature (TLOW) registers for each A/D channel. If either measured temperature equals or exceeds the corresponding alarm threshold value, an ALERT interrupt is asserted.
The power-on-reset (POR) state of both THIGH registers is full scale (0111 1111, or +127C). The POR state of both TLOW registers is 1100 1001 or -55C.
Diode Fault Alarm There is a continuity fault detector at DXP that detects whether the remote diode has an open-circuit condition. At the beginning of each conversion, the diode fault is checked, and the status byte is updated. This fault detector is a simple voltage detector; if DXP rises above VCC - 1V (typical) due to the diode current source, a fault is detected. Note that the diode fault isn't checked until a conversion is initiated, so immediately after power-on reset the status byte indicates no fault is present, even if the diode path is broken.
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If the remote channel is shorted (DXP to DXN or DXP to GND), the ADC reads 0000 0000 so as not to trip either the THIGH or TLOW alarms at their POR settings. In applications that are never subjected to 0C in normal operation, a 0000 0000 result can be checked to indicate a fault condition in which DXP is accidentally short circuited. Similarly, if DXP is short circuited to VCC, the ADC reads +127C for both remote and local channels, and the device alarms.
and TLOW comparisons and when the remote diode is disconnected (for continuity fault detection). The interrupt does not halt automatic conversions; new temperature data continues to be available over the SMBus interface after ALERT is asserted. The interrupt output pin is open-drain so that devices can share a common interrupt line. The interrupt rate can never exceed the conversion rate.
G767
Table 3. Read Format for Alert Response Address (0001 100) BIT NAME FUNCTION
7(MSB) 6 5 4 3 2 1 0(LSB) ADD7 ADD6 ADD5 ADD4 ADD3 ADD2 ADD1 1
The interface responds to the SMBus Alert Response address, an interrupt pointer return-address feature (see Alert Response Address section). Prior to taking corrective action, always check to ensure that an interrupt is valid by reading the current temperature.
Provide the current G767 slave address that was latched at POR (Table 8)
Logic 1
ALERT Interrupts The ALERT interrupt output signal is latched and can only be cleared by reading the Alert Response address. Interrupts are generated in response to THIGH
Alert Response Address The SMBus Alert Response interrupt pointer provides quick fault identification for simple slave devices that lack the complex, expensive logic needed to be a bus master. Upon receiving an ALERT interrupt signal, the host master can broadcast a Receive Byte transmission to the Alert Response slave address (0001 100). Then any slave device that generated an interrupt attempts to identify itself by putting its own address on the bus (Table 3).
Table 4. Command-Byte Bit Assignments REGISTER
RLTS RRTE RSL RCL RCRA RLHN RLLI RRHI RRLS WCA WCRW WLHO WLLM WRHA WRLN OSHT
COMMAND
00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0Ah 0Bh 0Ch 0Dh 0Eh 0Fh
POR STATE
0000 0000* 0000 0000* N/A 0000 0000 0000 0010 0111 1111 1100 1001 0111 1111 1100 1001 N/A N/A N/A N/A N/A N/A N/A
FUNCTINON
Read local temperature: returns latest temperature Read remote temperature: returns latest temperature Read status byte (flags, busy signal) Read configuration byte Read conversion rate byte Read local THIGH limit Read local TLOW limit Read remote THIGH limit Read remote TLOW limit Write configuration byte Write conversion rate byte Write local THIGH limit Write local TLOW limit Write remote THIGH limit Write remote TLOW limit One-shot command (use send-byte format)
*If the device is in hardware standby mode at POR, both temperature registers read 0C.
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The Alert Response can activate several different slave devices simultaneously, similar to the SMBus General Call. If more than one slave attempts to respond, bus arbitration rules apply, and the device with the lower address code wins. The losing device does not generate an acknowledge and continues to hold the ALERT line low until serviced (implies that the host interrupt input is level-sensitive). Successful reading of the alert response address clears the interrupt latch.
Configuration Byte Functions The configuration byte register (Table 5) is used to mask (disable) interrupts and to put the device in software standby mode. The lower six bits are internally set to (XX1111), making them "don't care" bits. Write zeros to these bits. This register's contents can be read back over the serial interface. Status Byte Functions The status byte register (Table 6) indicates which (if any) temperature thresholds have been exceeded. This byte also indicates whether or not the ADC is converting and whether there is an open circuit in the remote diode DXP-DXN path. After POR, the normal state of all the flag bits is zero, assuming none of the alarm conditions are present. The status byte is cleared by any successful read of the status, unless the fault persists. Note that the ALERT interrupt latch is not automatically cleared when the status flag bit is cleared. When reading the status byte, you must check for internal bus collisions caused by asynchronous ADC timing, or else disable the ADC prior to reading the status byte (via the RUN/STOP bit in the configuration byte). In one-shot mode, read the status byte only after the conversion is complete, which is 150ms max after the one-shot conversion is commanded.
G767
Command Byte Functions The 8-bit command byte register (Table 4) is the master index that points to the various other registers within the G767. The register's POR state is 0000 0000, so that a Receive Byte transmission (a protocol that lacks the command byte) that occurs immediately after POR returns the current local temperature data.
The one-shot command immediately forces a new conversion cycle to begin. In software standby mode (RUN/STOP bit = high), a new conversion is begun, after which the device returns to standby mode. If a conversion is in progress when a one-shot command is received in auto-convert mode (RUN/STOP bit = low) between conversions, a new conversion begins, the conversion rate timer is reset, and the next automatic conversion takes place after a full delay elapses.
Table 5. Configuration-Byte Bit Assignments BIT
7 (MSB) 6 5-0
NAME
MASK RUN / STOP RFU
POR STATE
0 0 0
FUNCTION
Masks all ALERT interrupts when high. Standby mode control bit. If high, the device immediately stops converting and enters standby mode. If low, the device converts in either one-shot or timer mode. Reserved for future use
Table 6. Status-Byte Bit Assignments BIT
7 (MSB) 6 5 4 3 2 1 0 (LSB)
NAME
BUSY LHIGH* LLOW* RHIGH* RLOW* OPEN* RFU RFU
FUNCTION
A high indicates that the ADC is busy converting. A high indicates that the local high-temperature alarm has activated. A high indicates that the local low-temperature alarm has activated. A high indicates that the remote high-temperature alarm has activated. A high indicates that the remote low-temperature alarm has activated. A high indicates a remote-diode continuity (open-circuit) fault. Reserved for future use (returns 0) Reserved for future use (returns 0)
*These flags stay high until cleared by POR, or until the status byte register is read.
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Table 7. Conversion-Rate Control Byte DATA
00h 01h 02h 03h 04h 05h 06h 07h 08h to FFh
G767
30 33 35 48 70 128 225 425 -
CONVERSION RATE (Hz)
0.0625 0.125 0.25 0.5 1 2 4 8 RFU
AVERAGE SUPPLY CURRENT (A TYP, at Vcc = 3.3V)
Table 8. RLTS and RRTE Temp Register Update Timing Chart OPERATING MODE
Auto-Convert Auto-Convert Auto-Convert Auto-Convert Auto-Convert Auto-Convert Auto-Convert Auto-Convert Auto-Convert Auto-Convert Auto-Convert Hardware Standby Software Standby Software Standby
CONVERSION INITIATED BY:
Power-on reset 1-shot command, while idling between automatic conversions
NEW CONVERSION RATE TIME UNTIL RLTS AND (CHANGED VIA WRITE TO WCRW) RRTE ARE UPDATED
N/A (0.25Hz) N/A 156ms max 156ms max When current conversion is complete (1-shot is ignored) 20sec 10sec 5sec 2.5sec 1.25sec 625ms 312.5ms 237.5ms 156ms 156ms 156ms
1-shot command that occurs durN/A ing a conversion Rate timer Rate timer Rate timer Rate timer Rate timer Rate timer Rate timer Rate timer
STBY pin
0.0625Hz 0.125Hz 0.25Hz 0.5Hz 1Hz 2Hz 4Hz 8Hz N/A N/A N/A
RUN/STOP bit 1-shot command
To check for internal bus collisions, read the status byte. If the least significant seven bits are ones, discard the data and read the status byte again. The status bits LHIGH, LLOW, RHIGH, and RLOW are refreshed on the SMBus clock edge immediately following the stop condition, so there is no danger of losing temperature-related status data as a result of an internal bus collision. The OPEN status bit (diode continuity fault) is only refreshed at the beginning of a conversion, so OPEN data is lost. The ALERT interrupt latch is independent of the status byte register, so no false alerts are generated by an internal bus collision. When auto-converting, if the THIGH and TLOW limits are close together, it's possible for both high-temp and low-temp status bits to be set, depending on the amount of time between status read operations (espe-
cially when converting at the fastest rate). In these circumstances, it's best not to rely on the status bits to indicate reversals in long-term temperature changes and instead use a current temperature reading to establish the trend direction.
Conversion Rate Byte The conversion rate register (Table 7) programs the time interval between conversions in free-running auto-convert mode. This variable rate control reduces the supply current in portable-equipment applications. The conversion rate byte's POR state is 02h (0.25Hz). The G767 looks only at the 3 LSB bits of this register, so the upper 5 bits are "don't care" bits, which should be set to zero. The conversion rate tolerance is 25% at any rate setting.
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Valid A/D conversion results for both channels are available one total conversion time (125ms nominal, 156ms maximum) after initiating a conversion, whether conversion is initiated via the RUN/STOP bit, hardware STBY pin, one-shot command, or initial power-up. Changing the conversion rate can also affect the delay until new results are available. See Table 8.
G767
ADD1
GND High-Z Vcc GND High-Z Vcc GND High-Z Vcc
Table 9.Slave Address Decoding (ADD0 and ADD1) ADD0
GND GND GND High-Z High-Z High-Z Vcc Vcc Vcc
ADDRESS
0011 000 0011 001 0011 010 0101 001 0101 010 0101 011 1001 100 1001 101 1001 110
Slave Addresses The G767 appears to the SMBus as one device having a common address for both ADC channels. The device address can be set to one of nine different values by pin-strapping ADD0 and ADD1 so that more than one G767 can reside on the same bus without address conflicts (Table 9).
The address pin states are checked at POR only, and the address data stays latched to reduce quiescent supply current due to the bias current needed for high-Z state detection. The G767 also responds to the SMBus Alert Response slave address (see the Alert Response Address section).
Note: High-Z means that the pin is left unconnected and floating.
Power-Up Defaults: Interrupt latch is cleared. Address select pins are sampled. ADC begins auto-converting at a 0.25Hz rate. Command byte is set to 00h to facilitate quick remote Receive Byte queries. THIGH and TLOW registers are set to max and min limits, respectively.
POR AND UVLO The G767 has a volatile memory. To prevent ambiguous power-supply conditions from corrupting the data in memory and causing erratic behavior, a POR voltage detector monitors Vcc and clears the memory if Vcc falls below 1.7V (typical, see Electrical Characteristics table). When power is first applied and Vcc rises above 1.75V (typical), the logic blocks begin operating, although reads and writes at VCC levels below 3V are not recommended. A second Vcc comparator, the ADC UVLO comparator, prevents the ADC from converting until there is sufficient headroom (Vcc = 2.8V typical).
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Global Mixed-mode Technology Inc.
G767
H I J K L M
A
B tLOW tHIGH
C
D
EF
G
SMBCLK SMBDATA
tSU:STA tHD:STA tSU:DAT tHD:DAT tSU:STO tBUF
Figure 4. SMBus Write Timing Diagram
A = start condition B = MSB of address clocked into slave C = LSB of address clocked into slave D = R/W bit clocked into slave E = slave pulls SMBDATA line low F = acknowledge bit clocked into master G = MSB of data clocked into slave H = LSB of data clocked into slave I = slave pulls SMBDATA line low J = acknowledge clocked into master K = acknowledge clocked pulse L = stop condition data executed by slave M = new start condition
A
B tLOW tHIGH
C
D
EF
G
H
I
J
K
SMBCLK SMBDATA
tSU:STA tHD:STA tSU:DAT tSU:STO tBUF
Figure 5. SMBus Read Timing Diagram
A = start condition B = MSB of address clocked into slave C = LSB of address clocked into slave D = R/ W bit clocked into slave E = slave pulls SMBDATA line low F =acknowledge bit clocked into master G = MSB of data clocked into master H = LSB of data clocked into master I = acknowledge clocked pulse J = stop condition K= new start condition
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TEL: 886-3-5788833 http://www.gmt.com.tw
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Global Mixed-mode Technology Inc.
Package Information
C
G767
E1
E L
D 7
(4X)
A2 e b A1
A
y
Note: 1. Package body sizes exclude mold flash and gate burrs 2. Dimension L is measured in gage plane 3. Tolerance 0.10mm unless otherwise specified 4. Controlling dimension is millimeter converted inch dimensions are not necessarily exact.
SYMBOL
A A1 A2 b C D E E1 e L y
MIN.
1.35 0.10 ----0.20 0.19 4.80 5.80 3.80 ----0.40 ----0
DIMENSION IN MM NOM.
1.60 ----1.45 0.25 ----------------0.64 -------------
MAX.
1.75 0.25 ----0.30 0.25 5.00 6.20 4.00 ----1.27 0.10 8
MIN.
0.053 0.004 ----0.008 0.007 0.189 0.228 0.150 ----0.016 ----0
DIMENSION IN INCH NOM.
0.064 ----0.057 0.010 ----------------0.025 -------------
MAX.
0.069 0.010 ----0.012 0.010 0.197 0.244 0.157 ----0.050 0.004 8
Taping Specification
PACKAGE
SSOP-16
F e e d D ir e c tio n T y p ic a l S S O P P a c k a g e O r ie n ta tio n
Q'TY/REEL
2,500 ea
GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
Ver: 2.5 Dec 14, 2004
TEL: 886-3-5788833 http://www.gmt.com.tw
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