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| NJL6170R/6171R PIN PHOTO DIODE s GENERAL DESCRIPTION The NJL6170R/6171R are the 6-divided PIN photo diode, which used in CD audio player. It shrinks the outline by COBP (Chip on Board Package), and attain under half package volume compared with lead frame type. s FEATURES * Super miniature, Super thin type (2.5mmX3.0mmX1.16mm) s APPLICATIONS * CD Audio player etc. s ABSOLUTE MAXIMUM RATINGS (Ta=25C) PARAMETER Reverse Voltage Operating Temperature Storage Temperature Reflow Soldering Temperature SYMBOL VR Topr Tstg Tsol RATINGS 30 -30 to +85 -40 to +100 260 (10sec.) UNIT V C C C s ELECTRO-OPTICAL CHARACTERISTICS (Ta=25C) PARAMETER Reverse Voltage Dark Current Capacitance Short circuit Current Sensitivity Response time Peak Wavelength Forward Voltage * see Pattern segment No. SYMBOL TEST CONDITION VR IR=10A ID VR=15V Ct Isc S tr,tf P VF VR=15V, f=1MHz Ev=1000lx =780nm VR=15V, RL=180 * 1, 2 *2 *1 *2 *1 *2 *1 * 1, 2 *2 *1 * 1, 2 * 1, 2 MIN 30 TYP MAX -- IF=1mA -- -- -- -- 17 110 -- -- -- -- -- -- -- -- 2 3 -- -- 0.5 100 200 800 -- -- 0.2 0.3 -- -- 53 330 -- -- -- -- 1.7 UNIT V nA nA pF pF nA nA A/W nS nS nm V -1- NJL6170R/6171R s OUTLINE (typ.) Unit : mm NJL6170R x | ~ cathode NC anode yz{ anode Pattern segment No. 1 2 E, F A, B, C, D NJL6171R x | ~ cathode NC anode yz{ anode Pattern segment No. 1 2 E, F A, B, C, D -2- NJL6170R/6171R s TYPICAL CHARACTERISTICS Relative Sensitivity vs. Illuminance (Ta=25C) 1.00E-03 100 90 80 70 Spectral Response (Ta=25C) VR=15.0V, =780nm 1.00E-04 Relative Sensitivity (%) ) Light Current IL( 1.00E-05 60 50 40 30 20 10 1.00E-06 1.00E-07 1.00E-08 0.01 0 0.1 1 10 100 500 600 700 800 900 1000 1100 Illuminance (mW/cm2) Wavelength (nm) Dark Current vs. Temperature 1.0.E-09 Relative Sensitivity vs. Temperature 150% 140% 130% VR=15.0V 1.0.E-10 VR=15.0V, =780nm Relative Sensitivity (%) 120% 110% 100% 90% 80% 70% 60% 50% Dark CurrentID(A) 1.0.E-11 1.0.E-12 1.0.E-13 1.0.E-14 -40 -20 0 20 40 60 Ambient Teperature() 80 100 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta(C) Rise Time vs. Reverse Voltage (Ta=25C) 500 Fall Time vs. Reverse Voltage (Ta=25C) 500 400 400 Rise Time tr(ns) 200 Fall Time tf(ns) 300 300 200 PD : E , F PD : A to D 100 100 PD : A to 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Reverse Voltage VR(V) Reverse Voltage VR(V) -3- NJL6170R/6171R Capacitance vs. Reverse Voltage (Ta=25C) 5 4 Capacitance Cj(pF) 3 2 1 PD : E , F PD : A to D 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Reverse Voltage VR(V) s MEASURING CIRCUIT FOR RESPONSE TIME OSC P.G. Input Laser 50 NJL6170R NJL6171R Output tr tf 90% 10% -4- NJL6170R/6171R PRECAUTION FOR HANDLING 1. Soldering to actual circuit board Soldering condition - Heated condition of plastic package. Lower than 240C of maximum surface temperature, less than 30 seconds of time kept higher than 200C. Soldering Method 1) Reflow Method Recommended temperature profile of its method. Preparatory heating condition : 120 to 150C about 60 sec. Recommended soldering temperature : 230 to 240C about 3 to 5 sec. Slowly cool down right after soldering. Soldering to be done within twice under this condition. (C) 250 200 150 100 50 0 Time 2) Reflow Method (In case of infrared heating) - Temperature profile : Same to the above - Avoid direct irradiation to the plastic package because it is mold resin, absorbs the Infrared Radiation and its surface temperature will be higher than lead itself. 3) The other method Avoid rapid heating up like dipping the devices directly into the melting solder or vapor phase method (VPS). If the device is heated to high temperature and kept in its condition for longer time, it would affect to its reliability. It is necessary to solder in short time as soon as possible. Preparatory heating 60 to 120 sec. Less than 30 sec. 3 to 5 sec. 240C max. 2. Cleaning Avoid washing of the device after soldering by reflow method. 3. Attention in handling 1) Treat not to touch the lens surface. 2) Avoid dust and any other foreign materials (paint, bonding material, etc.) on the lens surface. 3) When mounting, special care has to be taken on the mounting position and tilting of the device because it is very important to place the device to the optimum position to the object. 4. Storage In order to prevent from degradation of this device in moisturing at reflow method, so that this device is contained in dampproof packaging. So that mounts the device as short as possible after opening the envelope. -5- NJL6170R/6171R MEMO [CAUTION] The specifications on this databook are only given for information , without any guarantee as regards either mistakes or omissions. The application circuits in this databook are described only to show representative usages of the product and not intended for the guarantee or permission of any right including the industrial rights. -6- |
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