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 PRELIMINARY
HIGH-SPEED 16/8K x 9 SYNCHRONOUS PIPELINED DUAL-PORT STATIC RAM
.eatures
x x
IDT709169/59L
x
x
x x
True Dual-Ported memory cells which allow simultaneous access of the same memory location High-speed clock to data access - Commercial: 6.5/7.5/9ns (max.) Industrial: 7.5ns (max.) Low-power operation - IDT709169/59L Active: 925mW (typ.) Standby: 2.5mW (typ.) Flow-Through or Pipelined output mode on either Port via the FT/PIPE pins Counter enable and reset features Dual chip enables allow for depth expansion without additional logic
x
x x
x
Full synchronous operation on both ports - 3.5ns setup to clock and 0ns hold on all control, data, and address inputs - Data input, address, and control registers - Fast 6.5ns clock to data out in the Pipelined output mode - Self-timed write allows fast cycle time - 10ns cycle time,100MHz operation in Pipelined output mode TTL- compatible, single 5V (10%) power supply Industrial temperature range (-40C to +85C) is available for 83MHz Available in a 100-pin Thin Quad Flatpack (TQFP) and 100pin fine pitch Ball Grid Array (fpBGA) packages.
.unctional Block Diagram
R/WL OEL CE0L CE1L R/WR OER CE0R CE1R
1 0 0/1
1 0 0/1
FT/PIPEL
0/1
1
0
0
1
0/1
FT/PIPER
I/O0L - I/O8L
I/O0R - I/O8R I/O Control I/O Control
A13L(1) A0L CLKL ADSL CNTENL CNTRSTL Counter/ Address Reg. MEMORY ARRAY Counter/ Address Reg.
A13R(1) A0R CLKR ADSR CNTENR CNTRSTR
5653 drw 01
NOTE: 1. A13 is a NC for IDT709159.
JULY 2002
1
(c)2002 Integrated Device Technology, Inc. DSC-5653/1
IDT709169/59L High-Speed 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
Preliminary Industrial and Commercial Temperature Ranges
Description
The IDT709169/59 is a high-speed 16/8K x 9 bit synchronous DualPort RAM. The memory array utilizes Dual-Port memory cells to allow simultaneous access of any address from both ports. Registers on control, data, and address inputs provide minimal setup and hold times. The timing latitude provided by this approach allows systems to be designed with very short cycle times. With an input data register, the IDT709169/59 has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode. Fabricated using IDT's CMOS high-performance technology, these devices typically operate on only 925mW of power.
Pin Configurations(1,2,3,4)
Index
NC NC A7L A8L A9L A10L A11L A12L A13L(1) NC NC NC VCC NC NC NC NC CE0L CE1L CNTRSTL R/WL OEL FT/PIPEL NC NC
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 2 74 3 73 1 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 72 71 70 69 68
NC NC A6L A5L A4L A3L A2L A1L A0L CNTENL CLKL ADSL GND GND ADSR CLKR CNTENR A0R A1R A2R A3R A4R A5R A6R NC
709169/59PF PN100-1(5) 100-Pin TQFP Top View(6)
67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
06/28/02
NC NC A7R A8R A9R A10R A11R A12R A13R(1) NC NC NC GND NC NC NC NC CE0R CE1R CNTRSTR R/WR OER FT/PIPER GND NC .
5653 drw 02
NOTES: 1. A13 is a NC for IDT709159. 2. All VCC pins must be connected to power supply. 3. All GND pins must be connected to ground supply. 4. Package body is approximately 14mm x 14mm x 1.4mm. 5. This package code is used to reference the package diagram. 6. This text does not indicate orientation of the actual part-marking.
GND I/O8L I/O7L I/O6L I/O5L I/O4L I/O3L I/O2L GND I/O1L I/O0L VCC GND I/O0R I/O1R I/O2R VCC I/O3R I/O4R I/O5R I/O6R I/O7R I/O8R NC NC
2 6.42
IDT709169/59L High-Speed 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
Preliminary Industrial and Commercial Temperature Ranges
Pin Configurations (con't.)(1,2,3,4)
709169/59BF BF100(5) 100-Pin fpBGA Top View(6)
A2 A3 A4 A5 A6 A7 A8 A9 A10
06/28/02 A1
A6R
B1
A9R
B2
A12R
B3
NC
B4
GND GND
B5 B6
NC
B7
R/WR GND
B8 B9
NC
B10
A4R
C1
A5R
C2
A8R
C3
A10R
C4
NC
C5
NC
C6
NC
C7
OER
C8
NC
C9
I/O6R
C10
A3R
D1
NC
D2
NC
D3
A7R
D4
NC
D5
CE0R CE1R PL/FTR I/O7R I/O3R
D6 D7 D8 D9 D10
A0R
E1
CLKR
E2
A1R
E3 CNTENR F3
A2R
E4
A11R A13R(1) CNTRSTR I/O8R I/O5R I/O1R
E5 E6 E7 E8 E9 E10
GND ADSR
F1 F2
A1L
F4
ADSL
F5
GND I/O4R
F6 F7
I/O2R I/O0R
F8 F9
VCC
F10
GND CLKL
G1 CNTENL H1 G2
A0L
G3
A3L
G4
VCC
G5
GND
G6
VCC
G7
I/O2L
G8
I/O1L
G9
I/O0L
G10
NC
H2
A5L
H3
A12L
H4 H5
NC
R/WL
H6
NC
H7
I/O4L
H8
GND I/O3L
H9 H10
,
A2L
J1
A4L
J2
A9L
J3
A13L(1)
J4 J5
NC NC
K5
CE1L
J6 J7
NC OEL
K7
I/O7L
J8
I/O6L
J9
I/O5L
J10
NC
K1
A7L
K2
A10L
K3
NC
K4
NC
K6
GND
K8
CNTRSTL
GND
K9
I/O8L
K10
A6L
A8L
A11L
NC
VCC
VCC
CE0L
PL/FTL NC
5653 drw 03
NOTES: 1. A13 is a NC for IDT709159. 2. All VCC pins must be connected to power supply. 3. All GND pins must be connected to ground supply. 4. Package body is approximately 10mm x 10mm x 1.4mm with 0.8mm ball pitch. 5. This package code is used to reference the package diagram. 6. This text does not indicate orientation of the actual part-marking.
6.42 3
IDT709169/59L High-Speed 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
Preliminary Industrial and Commercial Temperature Ranges
Pin Names
Left Port CE0L, CE1L R/WL OEL A0L - A13L(1) I/O0L - I/O8L CLKL ADSL CNTENL CNTRSTL FT/PIPEL Right Port CE0R, CE1R R/WR OER A0R - A13R(1) I/O0R - I/O8R CLKR ADSR CNTENR CNTRSTR FT/PIPER VCC GND
NOTE: 1. A13 is a NC for IDT709159.
Names Chip Enables Read/Write Enable Output Enable Address Data Input/Output Clock Address Strobe Counter Enable Counter Reset Flow-Through/Pipeline Power (5V) Ground (0V)
5653 tbl 01
Truth Table IRead/Write and Enable Control(1,2,3)
OE X X X L H CLK X CE0 H X L L L CE1 X L H H H R/W X X L H X I/O0-8 High-Z High-Z DATAIN DATAOUT High-Z Mode Deselected--Power Down Deselected--Power Down Write Read Outputs Disabled
5653 tbl 02
NOTES: 1. "H" = VIH, "L" = VIL, "X" = Don't Care. 2. ADS, CNTEN, CNTRST = X. 3. OE is an asynchronous input signal.
4 6.42
IDT709169/59L High-Speed 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
Preliminary Industrial and Commercial Temperature Ranges
Truth Table IIAddress Counter Control(1,2)
External Address An X X X Previous Internal Address X An An + 1 X Internal Address Used An An + 1 An + 1 A0 CLK ADS L(4) H H X CNTEN X L(5) H X CNTRST H H H L
(4)
I/O(3) DI/O (n) DI/O(n+1) DI/O(n+1) DI/O(0) External Address Used
MODE
Counter Enabled--Internal Address generation External Addre ss Blocked--Counter disabled (An + 1 reused) Counter Reset to Address 0
5653 tbl 03
NOTES: 1. "H" = VIH, "L" = VIL, "X" = Don't Care. 2. CE0 and OE = VIL; CE1 and R/W = VIH. 3. Outputs configured in Flow-Through Output mode: if outputs are in Pipelined mode the data out will be delayed by one cycle. 4. ADS and CNTRST are independent of all other signals including CE0 and CE1. 5. The address counter advances if CNTEN = VIL on the rising edge of CLK, regardless of all other signals including CE0 and CE1.
Recommended Operating Temperature and Supply Voltage
Grade Commercial Industrial Ambient Temperature(1) 0OC to +70OC -40OC to +85OC GND 0V 0V Vcc 5.0V + 10% 5.0V + 10%
5653 tbl 04
Recommended DC Operating Conditions
Symbol VCC GND VIH VIL Parameter Supply Voltage Ground Input High Voltage Input Low Voltage Min. 4.5 0 2.2 -0.5(2) Typ. 5.0 0
____
Max. 5.5 0 6.0(1) 0.8
Unit V V V V
5653 tbl 05
NOTES: 1. This is the parameter TA. This is the "instant on" case temperature.
____
NOTES: 1. VTERM must not exceed Vcc + 10%. 2. VIL > -1.5V for pulse width less than 10ns.
Absolute Maximum Ratings(1)
Symbol VTERM
(2)
Capacitance(1)
Unit V Symbol CIN COUT
(3)
Rating Terminal Voltage with Respect to GND Temperature Under Bias Storage Temperature DC Output Current
Commercial & Industrial -0.5 to +7.0
(TA = +25C, f = 1.0MHz)
Parameter Input Capacitance Output Capacitance Conditions(2) VIN = 3dV VOUT = 3dV Max. 9 10 Unit pF pF
5653 tbl 07
TBIAS TSTG IOUT
-55 to +125 -65 to +150 50
o
C C
o
mA
5653 tbl 06
NOTES: 1. These parameters are determined by device characterization, but are not production tested. 2. 3dV references the interpolated capacitance when the input and output switch from 0V to 3V or from 3V to 0V. 3. COUT also references CI/O.
NOTES: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. VTERM must not exceed Vcc + 10% for more than 25% of the cycle time or 10ns maximum, and is limited to < 20mA for the period of VTERM > Vcc + 10%.
6.42 5
IDT709169/59L High-Speed 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
Preliminary Industrial and Commercial Temperature Ranges
DC Electrical Characteristics Over the Operating Temperature Supply Voltage Range (VCC = 5.0V 10%)
709169/59L Symbol |ILI| |ILO| VOL VOH Parameter Input Leakage Current(1) Output Leakage Current Output Low Voltage Output High Voltage Test Conditions VCC = 5.5V, VIN = 0V to VCC CE0 = VIH or CE1 = VIL, VOUT = 0V to VCC IOL = +4mA IOH = -4mA Min.
___
Max. 5 5 0.4
___
Unit A A V V
5653 tbl 08
___
___
2.4
NOTE: 1. At Vcc < 2.0V input leakages are undefined.
DC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range(3) (VCC = 5V 10%)
709169/59L6 Com'l Only Symbol ICC Parameter Dynamic Operating Current (Both Ports Active) Standby Current (Both Ports - TTL Level Inputs) Standby Current (One Port - TTL Level Inputs) Full Standby Current (Both Ports CMOS Level Inputs) Full Standby Current (One Port CMOS Level Inputs) Test Condition CEL and CER= VIL Outputs Disabled f = fMAX(1) CEL = CER = VIH f = fMAX(1) CE"A" = VIL and CE"B" = VIH(3) Active Port Outputs Disabled, f=fMAX(1) Both Ports CER and CEL > VCC - 0.2V VIN > VCC - 0.2V or VIN < 0.2V, f = 0(2) CE"A" < 0.2V and CE"B" > VCC - 0.2V(5) VIN > VCC - 0.2V or VIN < 0.2V, Active Port Outputs Disabled , f = fMAX (1) Version COM'L IND COM'L IND COM'L IND COM'L IND COM'L IND L L L L L L L L L L
____ _____
709169/59L7 Com'l & Ind Typ. (4) 210 210 40 40 135 135 0.5 0.5 130 130 Max. 400 440 105 120 220 235 3.0 3.0 190 205
709169/59L9 Com'l Only Typ.(4) 185
____
Typ.(4) 230
____
Max. 430
____
Max. 360
____
Unit mA
ISB1
45
____
115
____
35
____
95
____
mA
ISB2
150
____
235
_____
120
____
205
____
mA
ISB3
0.5
____
3.0
_____
0.5
____
3.0
____
mA
ISB4
160
210
110
____
170
____
mA
5653 tbl 09
NOTES: 1. At f = fMAX, address and control lines (except Output Enable) are cycling at the maximum frequency clock cycle of 1/tCYC, using "AC TEST CONDITIONS" at input levels of GND to 3V. 2. f = 0 means no address, clock, or control lines change. Applies only to input at CMOS level standby. 3. Port "A" may be either left or right port. Port "B" is the opposite from port "A". 4. Vcc = 5V, TA = 25C for Typ, and are not production tested. ICC DC(f=0) = 150mA (Typ). 5. CEX = VIL means CE0X = VIL and CE1X = VIH CEX = VIH means CE0X = VIH or CE1X = VIL CEX < 0.2V means CE0X < 0.2V and CE1X > VCC - 0.2V CEX > VCC - 0.2V means CE0X > VCC - 0.2V or CE1X < 0.2V "X" represents "L" for left port or "R" for right port.
6 6.42
IDT709169/59L High-Speed 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
Preliminary Industrial and Commercial Temperature Ranges
AC Test Conditions
Input Pulse Levels Input Rise/Fall Times Input Timing Reference Levels Output Reference Levels Output Load GND to 3.0V 2ns Max. 1.5V 1.5V Figures 1, 2 and 3
5653 tbl 10
5V 893 DATAOUT 347 30pF DATAOUT 347
5V 893
5pF*
5653 drw 04
5653 drw 05
Figure 1. AC Output Test load.
Figure 2. Output Test Load (For tCKLZ, tCKHZ, tOLZ, and tOHZ). *Including scope and jig.
8 7 6 5 tCD1, tCD2 (Typical, ns) 4 3 2 1 0 -1
- 10pF is the I/O capacitance of this device, and 30pF is the AC Test Load Capacitance
20 40 60 80 100 120 140 160 180 200 Capacitance (pF)
5653 drw 06
Figure 3. Typical Output Derating (Lumped Capacitive Load).
6.42 7
IDT709169/59L High-Speed 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
Preliminary Industrial and Commercial Temperature Ranges
AC Electrical Characteristics Over the Operating Temperature Range (Read and Write Cycle Timing)(3) (VCC = 5V 10%, TA = 0C to +70C)
709169/59L6 Com'l Only Symbol tCYC1 tCYC2 tCH1 tCL1 tCH2 tCL2 tR tF tSA tHA tSC tHC tSB tHB tSW tHW tSD tHD tSAD tHAD tSCN tHCN tSRST tHRST tOE tOLZ tOHZ tCD1 tCD2 tDC tCKHZ tCKLZ Clock Cycle Time (Flow-Through)(2) Clock Cycle Time (Pipelined)
(2) (2)
709169/59L7 Com'l & Ind Min. 22 12 7.5 7.5 5 5
____
709169/59L9 Com'l Only Min. 25 15 12 12 6 6
____
Parameter
Min. 19 10 6.5 6.5 4 4
____
Max.
____ ____
Max.
____ ____
Max.
____ ____
Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
Clock High Time (Flow-Through)
____ ____ ____
____ ____ ____
____ ____ ____
Clock Low Time (Flow-Through)(2) Clock High Time (Pipelined) Clock Low Time (Pipelined) Clock Rise Time Clock Fall Time Address Setup Time Address Hold Time Chip Enable Setup Time Chip Enable Hold Time Byte Enable Setup Time Byte Enable Hold Time R/W Setup Time R/W Hold Time Input Data Setup Time Input Data Hold Time ADS Setup Time ADS Hold Time CNTEN Setup Time CNTEN Hold Time CNTRST Setup Time CNTRST Hold Time Output Enable to Data Valid Output Enable to Output Low-Z(1) Output Enable to Output High-Z
(1) (2)
(2)
____
____
____
3 3
____ ____
3 3
____ ____
3 3
____ ____
____
____
____
3.5 0 3.5 0 3.5 0 3.5 0 3.5 0 3.5 0 3.5 0 3.5 0
____
4 0 4 0 4 0 4 0 4 0 4 0 4 0 4 0
____
4 1 4 1 4 1 4 1 4 1 4 1 4 1 4 1
____
____ ____
____ ____
____ ____
____ ____
____ ____
____ ____
____ ____ ____
____ ____ ____
____ ____ ____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
6.5
____
7.5
____
9
____
2 1
____ ____
2 1
____ ____
2 1
____ ____
7 15 6.5
____
7 18 7.5
____
7 20 9
____
Clock to Data Valid (Flow-Through)(2) Clock to Data Valid (Pipelined)
(2)
Data Output Hold After Clock High Clock High to Output High-Z(1) Clock High to Output Low-Z
(1)
2 2 2
2 2 2
2 2 2
9
____
9
____
9
____
Port-to-Port Delay tCWDD tCCS Write Port Clock High to Read Data Delay Clock-to-Clock Setup Time
____
24 9
____
28 10
____
35 15
ns ns
____
____
____
5653 tbl 11 NOTES: 1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2). This parameter is guaranteed by device characterization, but is not production tested. 2. The Pipelined output parameters (tCYC2, tCD2) to either the Left or Right ports when FT/PIPE = VIH. Flow-Through parameters (tCYC1, tCD1) apply when FT/PIPE = VIL for that port. 3. All input signals are synchronous with respect to the clock except for the asynchronous Output Enable (OE), FT/PIPER and FT/PIPEL.
8 6.42
IDT709169/59L High-Speed 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
Preliminary Industrial and Commercial Temperature Ranges
Timing Waveform of Read Cycle for .low-Through Output (FT/PIPE"X" = VIL)(3,6)
tCYC1 tCH1 CLK CE0 tSC CE1 tHC tSC tHC tCL1
R/W
tSW tSA
tHW tHA An + 1 tCD1 tDC Qn tCKLZ
(1)
ADDRESS
(5)
An
An + 2
An + 3 tCKHZ (1)
DATAOUT
Qn + 1 tOHZ
(1)
Qn + 2 tOLZ
(1)
tDC
OE
(2)
tOE
5653 drw 07
Timing Waveform of Read Cycle for Pipelined Operation (FT/PIPE"X" = VIH)(3,6)
tCYC2 tCH2 CLK CE0 tSC CE1 tHC tSC
(4)
tCL2
tHC
R/W
tSW tHW tSA tHA An + 1 (1 Latency) tCD2 Qn tCKLZ
(1)
ADDRESS
(5)
An
An + 2 tDC Qn + 1
An + 3
DATAOUT
Qn + 2
(1)
(6)
tOHZ
tOLZ
(1)
OE
(2)
tOE
5653 drw 08
NOTES: 1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2). 2. OE is asynchronously controlled; all other inputs are synchronous to the rising clock edge. 3. ADS = VIL, CNTEN and CNTRST = VIH. 4. The output is disabled (High-Impedance state) by CE0 = VIH or CE1 = VIL following the next rising edge of the clock. Refer to Truth Table 1. 5. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only. 6. "X" here denotes Left or Right port. The diagram is with respect to that port.
6.42 9
IDT709169/59L High-Speed 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
Preliminary Industrial and Commercial Temperature Ranges
Timing Waveform of a Bank Select Pipelined Read(1,2)
tCH2 CLK tSA ADDRESS(B1) tSC tHA A0 tHC tSC tCD2 DATAOUT(B1) tSA ADDRESS(B2) tHA A0 A1 A2 A3 A4 A5 A6 Q0 tDC tHC tCD2 tCKHZ Q1 tDC
(3)
tCYC2 tCL2
A1
A2
A3
A4
A5
A6
CE0(B1)
tCD2 Q3 tCKLZ
(3)
tCKHZ (3)
tSC CE0(B2) tSC tHC
tHC
tCD2 DATAOUT(B2) tCKLZ
(3)
tCKHZ (3) Q2
tCD2 tCKLZ
(3) 5653 drw 09
Q4
Timing Waveform of Write with Port-to-Port .low-Through Read(4,5,7)
CLK "A" tSW R/W "A" tSA ADDRESS "A" tHA
NO MATCH
tHW
MATCH
tSD DATAIN "A"
tHD
VALID
tCCS CLK "B"
(6)
tCD1 R/W "B" tSW tSA ADDRESS "B" tHW tHA
NO MATCH
MATCH
tCWDD DATAOUT "B" tDC
(6)
tCD1
VALID VALID
tDC
5653 drw 10
NOTES: 1. B1 Represents Bank #1; B2 Represents Bank #2. Each Bank consists of one IDT709169/59 for this waveform, and are setup for depth expansion in this example. ADDRESS(B1) = ADDRESS(B2) in this situation. 2. OE and ADS = VIL; CE1(B1), CE1(B2), R/W, CNTEN, and CNTRST = VIH. 3. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2). 4. CE0 and ADS = VIL; CE1, CNTEN, and CNTRST = VIH. 5. OE = VIL for the Right Port, which is being read from. OE = VIH for the Left Port, which is being written to. 6. If tCCS < maximum specified, then data from right port READ is not valid until the maximum specified for tCWDD. If tCCS > maximum specified, then data from right port READ is not valid until tCCS + tCD1. tCWDD does not apply in this case. 7. All timing is the same for both Left and Right ports. Port "A" may be either Left or Right port. Port "B" is the opposite from Port "A".
10 6.42
IDT709169/59L High-Speed 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
Preliminary Industrial and Commercial Temperature Ranges
Timing Waveform of Pipelined Read-to-Write-to-Read (OE = VIL)(3)
tCYC2 tCH2 tCL2 CLK
CE0 tSC tHC CE1 tSW tHW R/W tSW tHW
ADDRESS
(4)
An tSA tHA
An +1
An + 2
An + 2 tSD tHD Dn + 2
An + 3
An + 4
DATAIN
(2)
tCD2 Qn READ
tCKHZ
(1)
tCKLZ
(1)
tCD2 Qn + 3
DATAOUT
NOP(5)
WRITE
READ
5653 drw 11
Timing Waveform of Pipelined Read-to-Write-to-Read (OE Controlled)(3)
tCH2 CLK CE0 tSC tHC CE1 tSW tHW R/W tSW tHW tCYC2 tCL2
ADDRESS
(4)
An tSA tHA
An +1
An + 2 tSD tHD
An + 3
An + 4
An + 5
DATAIN
(2)
tCD2 Qn tOHZ(1)
Dn + 2
Dn + 3
tCKLZ(1)
tCD2 Qn + 4
DATAOUT
OE READ WRITE READ
5653 drw 12
NOTES: 1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2). 2. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals. 3. CE0 and ADS = VIL; CE1, CNTEN, and CNTRST = VIH. "NOP" is "No Operation". 4. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only. 5. "NOP" is "No Operation." Data in memory at the selected address may be corrupted and should be re-written to guarantee data integrity.
6.42 11
IDT709169/59L High-Speed 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
Preliminary Industrial and Commercial Temperature Ranges
Timing Waveform of .low-Through Read-to-Write-to-Read (OE = VIL)(3)
tCH1 CLK tCYC1 tCL1
CE0 tSC CE1 tSW tHW R/W tSW tHW tHC
ADDRESS
(4)
An tSA tHA
An +1
An + 2
An + 2 tSD tHD
An + 3
An + 4
DATAIN
(2)
Dn + 2 tCD1 Qn tDC READ tCD1 Qn + 1 tCKHZ (5) NOP
(1)
tCD1 Qn + 3 tCKLZ WRITE
(1)
tCD1
DATAOUT
tDC READ
5653 drw 13
Timing Waveform of .low-Through Read-to-Write-to-Read (OE Controlled)(3)
tCYC1 tCH1 tCL1 CLK CE0 tSC tHC CE1
tSW tHW
R/W ADDRESS
(4)
tSW tHW An tSA tHA An +1 An + 2 tSD tHD Dn + 2
(2)
An + 3
An + 4
An + 5
DATAIN tCD1 Qn tOHZ OE READ
(1)
Dn + 3
tDC
tOE tCD1
(1)
tCD1 Qn + 4 tDC
DATAOUT
tCKLZ
WRITE
READ
5653 drw 14
NOTES: 1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2). 2. Output state (High, Low, or High-impedance is determined by the previous cycle control signals. 3. CE0 and ADS = VIL; CE1, CNTEN, and CNTRST = VIH. "NOP" is "No Operation". 4. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only. 5. "NOP" is "No Operation." Data in memory at the selected address may be corrupted and should be re-written to guarantee data integrity.
12 6.42
IDT709169/59L High-Speed 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
Preliminary Industrial and Commercial Temperature Ranges
Timing Waveform of Pipelined Read with Address Counter Advance(1)
tCH2 CLK tSA ADDRESS tHA tCYC2 tCL2
An tSAD tHAD
ADS
tSAD tHAD
CNTEN tCD2 DATAOUT Qx - 1(2) Qx tDC READ EXTERNAL ADDRESS READ WITH COUNTER Qn
tSCN tHCN
Qn + 1
Qn + 2(2)
Qn + 3
COUNTER HOLD
READ WITH COUNTER
5653 drw 15
Timing Waveform of .low-Through Read with Address Counter Advance(1)
tCH1 CLK tSA ADDRESS tHA tCYC1 tCL1
An tSAD tHAD
ADS
tSAD tHAD tSCN tHCN
CNTEN tCD1 DATAOUT Qx(2) tDC READ EXTERNAL ADDRESS READ WITH COUNTER COUNTER HOLD READ WITH COUNTER
5653 drw 16
Qn
Qn + 1
Qn + 2
Qn + 3(2)
Qn + 4
NOTES: 1. CE0 and OE = VIL, CE1, R/W, and CNTRST = VIH. 2. If there is no address change via ADS = VIL (loading a new address) or CNTEN = VIL (advancing the address), i.e. ADS = VIH and CNTEN = VIH, then the data output remains constant for subsequent clocks.
6.42 13
IDT709169/59L High-Speed 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
Preliminary Industrial and Commercial Temperature Ranges
Timing Waveform of Write with Address Counter Advance (.low-Through or Pipelined Outputs)(1)
tCH2 CLK tSA ADDRESS tHA An tCYC2 tCL2
INTERNAL(3) ADDRESS tSAD tHAD ADS
An(7)
An + 1
An + 2
An + 3
An + 4
CNTEN tSD tHD DATAIN Dn WRITE EXTERNAL ADDRESS Dn + 1 Dn + 1 Dn + 2 Dn + 3 Dn + 4
WRITE WRITE WITH COUNTER COUNTER HOLD
WRITE WITH COUNTER
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Timing Waveform of Counter Reset (Pipelined Outputs)(2)
tCH2 CLK tSA tHA ADDRESS(4) INTERNAL(3) ADDRESS Ax(6) tSW tHW R/W ADS CNTEN tSRST tHRST CNTRST DATAIN DATAOUT(5) COUNTER(6) RESET WRITE ADDRESS 0 READ ADDRESS 0 READ ADDRESS 1 tSD tHD D0 Q0 READ ADDRESS n Q1 READ ADDRESS n+1
5653 drw 18
tCYC2 tCL2
An
An + 1
An + 2
0
1
An
An + 1
Qn
.
NOTES: 1. CE0 and R/W = VIL; CE1 and CNTRST = VIH. 2. CE0 = VIL; CE1 = VIH. 3. The "Internal Address" is equal to the "External Address" when ADS = VIL and equals the counter output when ADS = VIH. 4. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only. 5. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals. 6. No dead cycle exists during counter reset. A READ or WRITE cycle may be coincidental with the counter reset cycle. 7. CNTEN = VIL advances Internal Address from `An' to `An +1'. The transition shown indicates the time required for the counter to advance. The `An +1' Address is written to during this cycle.
14 6.42
IDT709169/59L High-Speed 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
Preliminary Industrial and Commercial Temperature Ranges
A .unctional Description
The IDT709169/59 provides a true synchronous Dual-Port Static RAM interface. Registered inputs provide minimal set-up and hold times on address, data, and all critical control inputs. All internal registers are clocked on the rising edge of the clock signal, however, the self-timed internal write pulse is independent of the LOW to HIGH transition of the clock signal. An asynchronous output enable is provided to ease asynchronous bus interfacing. Counter enable inputs are also provided to stall the operation of the address counters for fast interleaved memory applications. CE0 = VIH or CE1 = VIL for one clock cycle will power down the internal circuitry to reduce static power consumption. Multiple chip enables allow easier banking of multiple IDT709169/59's for depth expansion configurations. When the Pipelined output mode is enabled, two cycles are required to get valid data on the outputs.
Depth and Width Expansion
The IDT709169/59 features dual chip enables (refer to Truth Table I) in order to facilitate rapid and simple depth expansion with no requirements for external logic. Figure 4 illustrates how to control the various chip enables in order to expand two devices in depth. The IDT709169/59 can also be used in applications requiring expanded width, as indicated in Figure 4. Since the banks are allocated at the discretion of the user, the external controller can be set up to drive the input signals for the various devices as required to allow for 18-bit or wider applications.
A14/A13(1)
IDT709169/59
CE0 CE1 VCC
IDT709169/59
CE0 CE1 VCC
Control Inputs
Control Inputs
IDT709169/59
CE1 CE0
IDT709169/59
CE1 CE0 CNTRST CLK ADS CNTEN R/W OE
Control Inputs
Control Inputs
5653 drw 19
Figure 4. Depth and Width Expansion with IDT709169/59
NOTE: 1. A14 is for IDT709169, A13 is for IDT709159.
6.42 15
IDT709169/59L High-Speed 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
Preliminary Industrial and Commercial Temperature Ranges
Ordering Information
IDT XXXXX Device Type A Power 99 Speed A Package A Process/ Temperature Range
Blank I(1)
Commercial (0C to +70C) Industrial (-40C to +85C)
PF BF 6 7 9 L
100-pin TQFP (PN100-1) 100-pin fpBGA (BF100) Commercial Only Commercial & Industrial Commercial Only Low Power
Speed in nanoseconds
709169 144K (16K x 9-Bit) Synchronous Dual-Port RAM 709159 72K (8K x 9- Bit) Synchronous Dual-Port RAM
5653 drw 20
NOTE: 1. Contact your local sales office for Industrial temp range for other speeds, packages and powers.
Datasheet Document History
07/08/02: Initial Public Release
CORPORATE HEADQUARTERS 2975 Stender Way Santa Clara, CA 95054
for SALES: 800-345-7015 or 408-727-611 6 fax: 408-492-8674 www.idt.com
16 6.42
for Tech Support: 831-754-4613 DualPortHelp@idt.com
The IDT logo is a registered trademark of Integrated Device Technology, Inc.


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