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 (R)
STTH3006TPI
Tandem 600V HYPERFAST RECTIFIER
MAJOR PRODUCTS CHARACTERISTICS IF(AV) VRRM Tj (max) VF (max) IRM (typ.) 30 A 600 V (in series) 150 C 2.6 V 6.7 A
2 1 3
1 2 3
FEATURES AND BENEFITS ESPECIALLY SUITED AS BOOST DIODE IN CONTINUOUS MODE POWER FACTOR CORRECTORS AND HARD SWITCHING CONDITIONS DESIGNED FOR HIGH dIF/dt OPERATION. HYPERFAST RECOVERY CURRENT TO COMPETE WITH SiC DEVICES. ALLOWS DOWNSIZING OF MOSFET AND HEATSINKS INTERNAL CERAMIC INSULATED DEVICES WITH EQUAL THERMAL CONDITIONS FOR BOTH 300V DIODES INSULATION (2500VRMS) ALLOWS PLACEMENT ON SAME HEATSINK AS MOSFET FLEXIBLE HEATSINKING ON COMMON OR SEPARATE HEATSINK. MATCHED DIODES FOR TYPICAL PFC APPLICATION WITHOUT NEED FOR VOLTAGE BALANCE NETWORK Package Capacitance: C=16pF
s s s s s s
TOP-3 (Insulated) DESCRIPTION The TURBOSWITCH "H" is an ultra high performance diode composed of two 300V dice in series. TURBOSWITCH "H" family drastically cuts losses in the associated MOSFET when run at high dIF/dt.
ABSOLUTE RATINGS (limiting values, for both diodes) Symbol VRRM IF(RMS) IFSM Tstg Tj Parameter Repetitive peak reverse voltage RMS forward current Surge non repetitive forward current Storage temperature range Maximum operating junction temperature tp = 10 ms sinusoidal Value 600 32 180 -65 +150 + 150 Unit V A A C C
TM: TURBOSWITCH is a trademark of STMicroelectronics
June 2003 - Ed: 1A
1/5
STTH3006TPI
THERMAL AND POWER DATA Symbol Rth (j-c) P Parameter Junction to case thermal resistance Conduction power dissipation for both diodes Test conditions Total IF(AV) = 30 A Tc = 20C = 0.5 Value 1.3 100 Unit C/W W
STATIC ELECTRICAL CHARACTERISTICS (for both diodes) Symbol IR * Parameter Reverse leakage current Tests Conditions VR = VRRM Tj = 25C Tj = 125C VF ** Forward voltage drop IF = 30 A Tj = 25C Tj = 125C Pulse test : * tp = 100 ms, < 2 % ** tp = 380 s, < 2% To evaluate the maximum conduction losses use the following equation : P = 1.8 x IF(AV) + 0.026 IF2(RMS) DYNAMIC CHARACTERISTICS (for both diodes) Symbol trr Parameter Reverse recovery time IF = 0.5 A IR = 1 A Tests Conditions Irr = 0.25 A Tj = 25C Min. Typ. 25 45 Tj = 125C 6.7 0.3 8.5 A Max. Unit ns 2.1 60 Min. Typ. Max. 40 400 3.6 2.6 V Unit A
IF = 1 A dIF/dt = - 50 A/s VR = 30 V IRM S Reverse recovery current Reverse recovery softness factor VR = 400 V IF = 30 A dIF/dt = -200 A/s
TURN-ON SWITCHING CHARACTERISTICS (for both diodes) Symbol tfr VFP Parameter Forward recovery time Transient peak forward recovery voltage Tests Conditions IF = 30 A dIF/dt = 100 A/s VFR = 1.1 x VF max Tj = 25C Min. Typ. Max. 400 6 Unit ns V
IF = 30 A dIF/dt = 100 A/s Tj = 25C
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STTH3006TPI
Fig. 1: Conduction losses versus average current. Fig. 2: Forward voltage drop versus forward current.
IFM(A)
= 0.1 = 0.05 = 0.2
200
P(W)
110 100 90 80 70 60 50 40 30 20 10 0 0 5 10 15 20 25 30 80 60
= 0.5
180 160 140
Tj=125C (maximum values)
=1
120 100
Tj=125C (typical values) Tj=25C (maximum values)
T
40 20
IF(AV)(A)
=tp/T
35
tp
0 40 0 1 2 3
VFM(V)
4 5 6 7 8
Fig. 3: Relative variation of thermal impedance junction to case versus pulse duration.
Zth(j-c)/Rth(j-c)
1.0 0.9 0.8 0.7 0.6 0.5
= 0.5
Fig. 4: Peak reverse recovery current versus dIF/dt (90% confidence).
IRM(A)
18 16 14 12 10 8
IF=0.5 x IF(AV) VR=400V Tj=125C IF=2 x IF(AV)
IF=IF(AV)
IF=0.25 x IF(AV)
0.4 0.3 0.2
= 0.2 = 0.1
6
T
Single pulse
4 2
0.1 0.0 1.E-03 1.E-02
tp(s)
1.E-01
=tp/T
tp
0
dIF/dt(A/s)
0 50 100 150 200 250 300 350 400 450 500
1.E+00
Fig. 5: Reverse recovery time versus dIF/dt (90% confidence).
trr(ns)
100 90 80 70 60 50 40 30
IF=2 x IF(AV) IF=IF(AV) IF=0.5 x IF(AV) VR=400V Tj=125C
Fig. 6: Reverse recovery charges versus dIF/dt (90% confidence).
Qrr(nC)
400 350 300
IF=IF(AV) VR=400V Tj=125C IF=2 x IF(AV)
250
IF=0.5 x IF(AV)
200 150 100
20 10 0 0 50 100 150 200 250 300 350 400 450 500
dIF/dt(A/s)
50
dIF/dt(A/s)
0 0 50 100 150 200 250 300 350 400 450 500
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STTH3006TPI
Fig. 7: Reverse recovery softness factor versus dIF/dt (typical values).
S
0.40
IF=IF(AV) VR=400V Tj=125C
Fig. 8: Relative variation of dynamic parameters versus junction temperature (reference: Tj = 125C).
3.00 2.75 2.50 2.25 2.00 1.75
S IF=IF(AV) VR=400V Reference: Tj=125C
0.35
0.30
1.50 1.25 1.00 0.75
IRM
0.25
0.50 0.25
dIF/dt(A/s)
0.20 0 50 100 150 200 250 300 350 400 450 500
Tj(C)
25 50 75 100 125
0.00
Fig. 9: Transient peak forward voltage versus dIF/dt (90% confidence).
VFP(V)
14
IF=IF(AV) Tj=125C
Fig. 10: Forward recovery time versus dIF/dt (90% confidence).
tfr(ns)
800 700 600 500
IF=IF(AV) VFR=1.1 x VF max. Tj=125C
12 10 8
400 6 300 4 2 200 100 0 0 50 100 150 200 250 300 350 400 450 500 0 100 200 300 400 500
dIF/dt(A/s)
0
dIF/dt(A/s)
Fig. 11: Junction capacitance versus reverse voltage applied (typical values).
C(pF)
1000
F=1MHz VOSC=30mVRMS Tj=25C
100
VR(V)
10 1 10 100 1000
4/5
STTH3006TPI
PACKAGE MECHANICAL DATA TOP-3 Insulated DIMENSIONS REF. Millimeters Inches
Min. Typ. Max. Min. Typ. Max. A B C D E F G H J K L 4.4 1.45 14.35 0.5 2.7 15.8 20.4 15.1 5.4 3.4 4.08 4.6 0.173 0.181 0.061 0.614 0.028 0.114 0.650 0.831 0.610 0.222 0.144 0.164
1.55 0.057 15.60 0.565 0.7 2.9 0.020 0.106
16.5 0.622 21.1 0.815 15.5 0.594 5.65 0.213 3.65 0.134 4.17 0.161
Ordering code STTH3006TPI
s
Marking STTH3006TPI
Package TOP-3 Ins.
Weight 4.5 g.
Base qty 30
Delivery mode Tube
s
s
s
Cooling method: C Recommended torque value: 0.8 N.m. Maximum torque value: 1 N.m. Epoxy meets UL94,V0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics (c) 2003 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 5/5


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