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T5551
Micromodule
Description
The micromodule T5551 is the standard package for TEMIC Semiconductors' contactless identification IC family. This package simplifies the soldering or welding handling and enables smart card applications. The micromodule is 400 m thin, thus opening the way to contactless card applications. The module includes the IC e5551 and an internal 435 pF capacitor.
Features
D Universal metal leadframe packaging for all identification applications, especially for contactless cards and small coins D Optimized mechanical stability D With internal 435 pF capacitor D Designed for high volumes D Overall thickness 400 m
T5551 Coil interface Power Antenna Data Port 2 2 Port 1 1 C
Controller
Memory
e5551
Figure 1. Block diagram
Ordering Information
Extended Type Number T5551-PAE Package Micromodule Remarks Reeled (35 mm, 3 rows), 12-15 k per reel
Rev. A1, 14-Jun-00
1 (4)
T5551
Pin Description
Pin 1 2 Symbol Port 1 Port 2 Function Power supply and data transmission coil 1 Power supply and data transmission coil 2
General
The micromodule is a special package suitable for contactless R/W-identification applications. It is a plastic encapsulated package on a copper leadframe substrate and includes: Read/write IDIC e5551 with EEPROM Chip capacitor C = 435 pF The chip capacitor is connected in parallel to coil 1 and coil 2 of the e5551 and to Pin 1 and Pin 2 of the package.
Electrical Characteristics Absolute Maximum Ratings
Parameter Max. DC current into coil 1/ coil 2 Max. AC current into coil 1/ coil 2 Power dissipation (dice) Operating ambient temperature range Storage temperature range Maximum assembly temperature > 5 min Symbol Icoil icoil Ptot Tamb Tstg Tsld Value 10 20 100 -40 to +85 -40 to +125 +150 Unit mA mApp mW _C _C _C
Capacitor Chip
Parameter Breakdown voltage Capacitance Q Temperature coefficient Test Conditions / Pins Symbol VBR C T Min. 60 Typ. 435 300 68 Max. Unit V pF ppm/K
500 mV, 125 kHz
e5551: for electrical characteristics, please refer to the e5551 data sheet
2 (4)
Rev. A1, 14-Jun-00
T5551
Micromodule
Dimensions in mm
Specification
Pitch Module size Mold dimension Lead frame Bond pad size Surface plating Module thickness 9.5 mm 5 8 mm 5.1 4.9 mm CuSn6 100 m 5 1.5 mm 2.5 m Ag 400 m maximum
Temperature Profile for Processing
150_C / 5 min 390_C / 3 s 500_C / 25 ms
Rev. A1, 14-Jun-00
3 (4)
T5551
Ozone Depleting Substances Policy Statement
It is the policy of TEMIC Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. TEMIC Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. TEMIC Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.
2.
We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use TEMIC Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify TEMIC Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Data sheets can also be retrieved from the Internet: http://www.temic-semi.com
TEMIC Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 (0)7131 67 2594, Fax number: 49 (0)7131 67 2423
4 (4)
Rev. A1, 14-Jun-00

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