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 MBRD835L
Preferred Device
SWITCHMODE] Power Rectifier
DPAK Surface Mount Package
This SWITCHMODE power rectifier which uses the Schottky Barrier principle with a proprietary barrier metal, is designed for use as output rectifiers, free wheeling, protection and steering diodes in switching power supplies, inverters and other inductive switching circuits.
Features http://onsemi.com
SCHOTTKY BARRIER RECTIFIER 8.0 AMPERES, 35 VOLTS
1 3 4
* * * * * *
Low Forward Voltage 125C Operating Junction Temperature Epoxy Meets UL 94 V-0 @ 0.125 in Compact Size Lead Formed for Surface Mount Pb-Free Packages are Available
4 12
MARKING DIAGRAM
Mechanical Characteristics
* Case: Epoxy, Molded * Weight: 0.4 Gram (Approximately) * Finish: All External Surfaces Corrosion Resistant and Terminal * * *
DPAK CASE 369C 3
YWW B 835L
Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds Shipped 75 Units Per Plastic Tube Available in 16 mm Tape and Reel, 2500 Units Per 13 in Reel, by Adding a "T4" Suffix to the Part Number
Y WW
= Year = Work Week
ORDERING INFORMATION
Device MBRD835L MBRD835LG MBRD835LT4 MBRD835LT4G Package DPAK DPAK (Pb-Free) DPAK DPAK (Pb-Free) Shipping 75 Units/Rail 75 Units/Rail 2500/Tape & Reel 2500/Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Preferred devices are recommended choices for future use and best overall value.
Semiconductor Components Industries, LLC, 2005
January, 2005 - Rev. 6
1
Publication Order Number: MBRD835L/D
MBRD835L
MAXIMUM RATINGS
Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TC = 88C) Peak Repetitive Forward Current (At Rated VR, Square Wave, 20 kHz, TC = 80C) Non-Repetitive Peak Surge Current (Surge applied at rated load conditions, halfwave, single phase, 60 Hz) Repetitive Avalanche Current (Current Decaying Linearly to Zero in 1 ms, Frequency Limited by TJmax) Storage / Operating Case Temperature Operating Junction Temperature Voltage Rate of Change (Rated VR) Symbol VRRM VRWM VR IF(AV) IFRM IFSM IAR Tstg TJ dv/dt Value 35 Unit V
8.0 16 75 2.0 -65 to +150 -65 to +125 10,000
A A A A C C V/ms
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Rating Thermal Resistance - Junction-to-Case Thermal Resistance - Junction-to-Ambient (Note 1) Symbol RqJC RqJA Value 2.8 80 Unit C/W C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 2) (iF = 8 Amps, TC = + 25C) (iF = 8 Amps, TC = +125C) Maximum Instantaneous Reverse Current (Note 2) (Rated dc Voltage, TC = + 25C) (Rated dc Voltage, TC = +100C) 1. Rating applies when surface mounted on the minimum pad size recommended. 2. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2%. VF IR 0.51 0.41 1.4 35 V mA
http://onsemi.com
2
MBRD835L
TYPICAL CHARACTERISTICS
iF, INSTANTANEOUS FORWARD CURRENT (mA) IF, INSTANTANEOUS FORWARD CURRENT (AMPS
10
10
1
TJ = 125C
25C
TJ = 125C 1
75C 0.1 25C 0.01
0.1
0.01
0
0.1
0.2 0.3 0.4 0.5 vF, INSTANTANEOUS VOLTAGE (VOLTS)
0.6
0
0.1
0.2 0.3 0.4 0.5 VF, INSTANTANEOUS VOLTAGE (VOLTS)
0.6
Figure 1. Maximum Forward Voltage
1000 100 I R, REVERSE CURRENT (mA) I R, REVERSE CURRENT (mA) 100 10 1 0.1 0.01 0.001 0.01 25C TJ = 125C 100C
Figure 2. Typical Forward Voltage
TJ = 125C 10 100C
1
75C
0.1 25C
0
5
10 15 20 25 VF, REVERSE VOLTAGE (VOLTS)
30
35
0
5
10 15 20 25 VR, REVERSE VOLTAGE (VOLTS)
30
35
Figure 3. Maximum Reverse Current
Figure 4. Typical Reverse Current
http://onsemi.com
3
MBRD835L
TYPICAL CHARACTERISTICS
TJ = 25C C, CAPACITANCE (pF) 1000
TYPICAL MAXIMUM
100
1
10 VR, REVERSE VOLTAGE (VOLTS)
Figure 5. Maximum and Typical Capacitance
IF(AV), AVERAGE FORWARD CURRENT (AMPS) IF(AV), AVERAGE FORWARD CURRENT (AMPS)
16 14.4 12.8 11.2 9.6 8 6.4 4.8 3.2 1.6 0 80 85 90 10 20 95 100 105 110 115 TC, CASE TEMPERATURE (C) 120 125 130 SQUARE WAVE dc TJ = 125C RqJA = 6C/W p (RESISTIVE LOAD) (CAPACITIVE IPK +5 LOAD) IAV
8 7 6 5 4 3 2 1 0 0 10 20 10 20 30 40 50 60 70 80 90 100 110 120 130 TA, AMBIENT TEMPERATURE (C) p (RESISTIVE LOAD) SQUARE WAVE TJ = 125C dc RqJA = 40C/W SURFACE MOUNTED ON MINIMUM RECOMMENDED PAD SIZE (CAPACITIVE IPK +5 LOAD) IAV
Figure 6. Current Derating, Infinite Heatsink
P F(AV), AVERAGE FORWARD POWER DISSIPATION (WATT
Figure 7. Current Derating
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 0 10 20 20 30 40 50 60 70 80 90 100 110 120 130 TA, AMBIENT TEMPERATURE (C) 10 dc TJ = 125C RqJA = 80C/W SURFACE MOUNTED ON MINIMUM RECOMMENDED PAD SIZE (CAPACITIVE IPK +5 LOAD) IAV
8 7 6 5 4 20 3 2 1 0 0 1.5 3 4.5 6 7.5 9 10.5 12 13.5 IF(AV), AVERAGE FORWARD CURRENT (AMPS) 15 10 TJ = 125C p (RESISTIVE LOAD) SQUARE WAVE dc
p (RESISTIVE LOAD) SQUARE WAVE
(CAPACITIVE IPK +5 LOAD) IAV
Figure 8. Current Derating, Free Air
Figure 9. Forward Power Dissipation
http://onsemi.com
4
MBRD835L
PACKAGE DIMENSIONS
DPAK CASE 369C ISSUE O
-T- B V R
4 SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 0.235 0.245 0.250 0.265 0.086 0.094 0.027 0.035 0.018 0.023 0.037 0.045 0.180 BSC 0.034 0.040 0.018 0.023 0.102 0.114 0.090 BSC 0.180 0.215 0.025 0.040 0.020 --- 0.035 0.050 0.155 --- MILLIMETERS MIN MAX 5.97 6.22 6.35 6.73 2.19 2.38 0.69 0.88 0.46 0.58 0.94 1.14 4.58 BSC 0.87 1.01 0.46 0.58 2.60 2.89 2.29 BSC 4.57 5.45 0.63 1.01 0.51 --- 0.89 1.27 3.93 ---
C E
S
A
1 2 3
Z U
K F L D G
2 PL
J H 0.13 (0.005)
M
DIM A B C D E F G H J K L R S U V Z
T
SOLDERING FOOTPRINT*
6.20 0.244 2.58 0.101 5.80 0.228 1.6 0.063 6.172 0.243 3.0 0.118
SCALE 3:1
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
MBRD835L
SWITCHMODE is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: N. American Technical Support: 800-282-9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Phone: 81-3-5773-3850 Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
http://onsemi.com
6
MBRD835L/D


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