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INTEGRATED CIRCUITS
DATA SHEET
TDA5051 Home automation modem
Product specification Supersedes data of 1997 Mar 11 File under Integrated Circuits, IC11 1997 Sep 19
Philips Semiconductors
Product specification
Home automation modem
FEATURES * Full digital carrier generation and shaping * Modulation/demodulation frequency set by clock adjustment, from microcontroller or on-chip oscillator * High clock rate of 6 bits D/A (Digital-to-Analog) converter for rejection of aliasing components * Fully integrated output power stage with overload protection * Automatic gain control at receiver input * 8-bit A/D and narrow digital filtering * Digital demodulation delivering baseband data * Easy compliance with EN50065-1 with simple coupling network * Few external components for low cost applications * SO16 plastic package. QUICK REFERENCE DATA SYMBOL VDD IDD(tot) PARAMETER supply voltage total supply current reception mode transmission mode (DATAIN = 0) power down mode Tamb fcr fosc Vo(rms) Vi(rms) THD ZL BR Note operating ambient temperature carrier frequency oscillator frequency output carrier signal on CISPR16 load (RMS value) input signal (RMS value) total harmonic distortion on CISPR16 load with coupling network load impedance baud rate note 1 ZL = 30 fosc = 8.48 MHz - - - 0 95 6.08 120 66 - 1 - 28 47 19 - 132.5 8.48 - - -55 30 600 CONDITIONS MIN. 4.75 TYP. 5.0 APPLICATIONS
TDA5051
* Home appliance control (air conditioning, shutters, lighting, alarms and so on) * Energy/heating control * ASK (Amplitude Shift Keying) data transmission using the home power network. GENERAL DESCRIPTION The TDA5051 is a modem IC, specifically dedicated to ASK transmission by means of the home power supply network, at 600 or 1200 baud data rate. It operates from a single 5 V supply.
MAX. 5.25 38 68 25 70 148.5 9.504 122 122 - - 1200
UNIT V mA mA mA C kHz MHz dBV dBV dB bits/s
1. Frequency range corresponding to the EN50065-1 band. However the modem can operate at any lower oscillator frequency. ORDERING INFORMATION TYPE NUMBER TDA5051T PACKAGE NAME SO16 DESCRIPTION plastic small outline package: 16 leads; body width 7.5 mm VERSION SOT162-1
1997 Sep 19
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Philips Semiconductors
Product specification
Home automation modem
BLOCK DIAGRAM
TDA5051
handbook, full pagewidth
DGND 5
AGND 12
VDDA 13
VDDD 3 modulated carrier
VDDAP 11
ROM
6
D/A
POWER DRIVE WITH PROTECTION
10
TXOUT
DAC clock 10
9
APGND
1 DATAIN
CONTROL LOGIC
TDA5051
CLKOUT 4 filter clock
15
PD
OSC1
7 OSCILLATOR
OSC2
8
/2
DATAOUT
2
DIGITAL DEMODULATOR
DIGITAL BANDPASS FILTER 8
14 A/D RXIN 5 H PEAK DETECT L U D U/D COUNT
16
6
MGK006
TEST1 SCANTEST
Fig.1 Block diagram.
1997 Sep 19
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Philips Semiconductors
Product specification
Home automation modem
PINNING SYMBOL DATAIN DATAOUT VDDD CLKOUT DGND SCANTEST OSC1 OSC2 APGND TXOUT VDDAP AGND VDDA RXIN PD TEST1 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 DESCRIPTION digital data input (active LOW) digital data output (active LOW)
handbook, halfpage
TDA5051
digital supply voltage clock output digital ground test input (LOW in application) oscillator input oscillator output analog ground for power amplifier analog signal output analog supply voltage for power amplifier analog ground analog supply voltage analog signal input power-down input (active HIGH) test input (HIGH in application)
DATAIN 1 DATAOUT 2 VDDD 3 CLKOUT 4 DGND 5 SCANTEST 6 OSC1 7 OSC2 8
MGK005
16 TEST1 15 PD 14 RXIN
TDA5051T
13 VDDA 12 AGND 11 VDDAP 10 TXOUT 9 APGND
Fig.2 Pin configuration.
1997 Sep 19
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Philips Semiconductors
Product specification
Home automation modem
FUNCTIONAL DESCRIPTION Both transmission and reception stages are controlled either by the master clock of the microcontroller, or by the on-chip reference oscillator connected to a crystal. This holds for the accuracy of the transmission carrier and the exact trimming of the digital filter, thus making the performance totally independent of application disturbances such as component spread, temperature, supply drift and so on. The interface with the power network is made by means of a LC network (see Fig.18). The device includes a power output stage able to feed a 120 dBV (RMS) signal on a typical 30 load. To reduce power consumption, the IC is disabled by a power-down input (pin PD): in this mode, the on-chip oscillator remains active and the clock continues to be supplied at pin CLKOUT. For low-power operation in reception mode, this pin can be dynamically controlled by the microcontroller (see Section "Power-down mode"). When the circuit is connected to an external clock generator (see Fig.6), the clock signal must be applied at pin OSC1 (pin 7); OSC2 (pin 8) must be left open. Use of the on-chip clock circuitry is shown in Fig.7. All logic inputs and outputs are compatible with TTL/CMOS levels, providing an easy connection to a standard microcontroller I/O port. The digital part of the IC is fully scan-testable. Two digital inputs, SCANTEST and TEST1, are used for production test: these pins must be left open in functional mode (correct levels are internally defined by pull-up/down resistors). Transmission mode The carrier frequency is generated by the scanning of a ROM memory under the control of the microcontroller clock or the reference frequency provided by the on-chip oscillator, thus providing strict stability with respect to environmental conditions. High frequency clocking rejects the aliasing components to such an extent that they are filtered by the coupling LC network and do not cause any significant disturbance. The data modulation is applied through pin DATAIN and smoothly applied by specific digital circuitry to the carrier (shaping). Harmonic components are limited in this process, thus avoiding unacceptable disturbance of the transmission channel (according to CISPR16 and EN50065-1 recommendations). A -55 dB total harmonic distortion is reached when using the typical LC coupling network (or an equivalent filter). 1997 Sep 19 5
TDA5051
The D/A converter and the power stage are set in order to provide a maximum signal level of 122 dBV (RMS) at the output. The output of the power stage (TXOUT) always has to be connected to a decoupling capacitor, because of a DC level of 0.5VDD at this pin, present even when the device is not transmitting. This pin also has to be protected against overvoltage and negative transient signals. The DC level of TXOUT can be used to bias an unipolar transient suppressor, as shown in the application diagram (see Fig.18). Direct connection to the mains is done through a LC network for low-cost applications. However, a HF signal transformer could be used when power-line insulation has to be performed. CAUTION In transmission mode, the receiving part of the circuit is not disabled and the detection of the transmitted signal is normally performed. In this mode, the gain chosen before the beginning of the transmission is stored, and the AGC is internally set to -6 dB as long as DATAIN is LOW. Then, the old gain setting is automatically restored. Receiving mode The input signal received by the modem is applied to a wide range input amplifier with Automatic Gain Control (AGC) (-6 to +30 dB). This is basically for noise performance improvement and signal level adjustment that ensures a maximum sensitivity of the A/D converter. Then an 8 bit A/D conversion is performed, followed by digital bandpass filtering, in order to meet the CISPR normalization and to comply with some additional limitations encountered in current applications. After digital demodulation, the baseband data signal is made available after pulse shaping. The signal pin (RXIN) is a high-impedance input, which has to be protected and DC decoupled for the same reasons as with pin TXOUT. The high sensitivity (66 dBV) of this input requires an efficient 50 Hz rejection filter (realized by the LC coupling network) also used as an anti-aliasing filter for the internal digital processing (see Fig.18).
Philips Semiconductors
Product specification
Home automation modem
Data format TRANSMISSION MODE The data input (DATAIN) is active LOW: this means that a burst is generated on the line (pin TXOUT) when pin DATAIN is LOW. Pin TXOUT is in high-impedance state as long as the device is not transmitting. Successive logic 1s are treated in a NRZ mode (see pulse shape description in Figs 8 and 9). RECEIVING MODE
TDA5051
The data output (pin DATAOUT) is active LOW; this means that the data output is LOW when a burst is received. Pin DATAOUT remains LOW as long as a burst is received. Power-down mode Power-down input (pin PD) is active HIGH; this means that the power consumption is minimal when pin PD is HIGH. All functions, except clock generation, are disabled then.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD fosc Tstg Tamb Tj HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices. supply voltage oscillator frequency storage temperature operating ambient temperature junction temperature PARAMETER - -50 -10 - MIN. 4.5 MAX. 5.5 12 +150 +80 125 V MHz C C C UNIT
1997 Sep 19
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Philips Semiconductors
Product specification
Home automation modem
CHARACTERISTICS VDDD = VDDA = 5 V 5%; Tamb = 0 to 70 C; VDDD connected to VDDA; DGND connected to AGND. SYMBOL Supply VDD IDD(RX/TX)(tot) IDD(PD)(tot) IDD(PAMP) supply voltage total analog + digital supply current; TX or RX mode total analog + digital supply current; power-down mode VDD = 5 V 5% VDD = 5 V 5%; PD = HIGH 4.75 - - - 5 28 19 19 5.25 38 25 30 PARAMETER CONDITIONS MIN. TYP.
TDA5051
MAX.
UNIT
V mA mA mA
power amplifier supply current VDD = 5 V 5%; in transmission mode ZL = 30 ; DATAIN = LOW
IDD(PAMP)(max) maximum power amplifier VDD = 5 V 5%; supply current in transmission ZL = 1 ; mode DATAIN = LOW DATAIN input, PD input: DATAOUT output, CLKOUT output VIH VIL VOH VOL HIGH-level input voltage LOW-level input voltage HIGH-level output voltage LOW-level output voltage IOH = -1.6 mA IOL = 1.6 mA
-
76
-
mA
0.2VDD + 0.9 - -0.5 2.4 - - - -
VDD + 0.5 - 0.45
V V V
0.2VDD - 0.1 V
OSC1 input and OSC2 output (OSC2 only used for driving external quartz crystal; must be left open when using an external clock generator) VIH VIL VOH VOL Clock fosc f osc -------f cr f osc ------------------f CLKOUT oscillator frequency ratio between oscillator and carrier frequency ratio between oscillator and clock output frequency 6.080 - - - 64 9.504 - - MHz HIGH-level input voltage LOW-level input voltage HIGH-level output voltage LOW-level output voltage IOH = -1.6 mA IOL = 1.6 mA 0.7VDD -0.5 2.4 - - - - - VDD + 0.5 - 0.45 V V V 0.2VDD - 0.1 V
2
1997 Sep 19
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Philips Semiconductors
Product specification
Home automation modem
TDA5051
SYMBOL Transmission mode fcr tsu th tW(DI)(min) Vo(rms) Io(max) Zo VO THD
PARAMETER
CONDITIONS - - - - 120 - - - Vo(rms) = 121 dB V on CISPR16 load; fosc = 8.48 MHz; DATAIN = LOW (no modulation); see Figs 3 and 16 -
MIN.
TYP. - - - -
MAX.
UNIT
carrier frequency set-up time of the shaped burst hold time of the shaped burst minimum pulse width of DATAIN signal output carrier signal (RMS value) power amplifier maximum output current (peak value) output impedance of the power amplifier output DC level at TXOUT total harmonic distortion on CISPR16 load with the coupling network (measured on the first ten harmonics)
fosc = 8.48 MHz fosc = 8.48 MHz; see Fig.8 fosc = 8.48 MHz; see Fig.8 fosc = 8.48 MHz; see Fig.8 ZL = CISPR16 DATAIN = LOW ZL = 1 ; DATAIN = LOW
132.5 170 170 190 - 160 5 2.5 -55
kHz s s s dBV mA V dB
122 - - - -
B-20dB
bandwidth of the shaped output signal (at -20 dB) on CISPR16 load with the coupling network
Vo(rms) = 121 dB - V on CISPR16 load; fosc = 8.48 MHz; DATAIN = 300 Hz; duty factor = 50%; see Fig.4
3000
-
Hz
Reception mode Vi(rms) VI Zi RAGC tc(AGC) td(dem)(su) td(dem)(h) Bdet analog input signal (RMS value) DC level at pin RXIN RXIN input impedance automatic gain control range automatic gain control time constant demodulation delay set-up time demodulation delay hold time detection bandwidth fosc = 8.48 MHz; see Fig.5 fosc = 8.48 MHz; see Fig.15 fosc = 8.48 MHz; see Fig.15 fosc = 8.48 MHz 68 - - - - - - - - 2.5 50 36 296 410 330 3 122 - - - - 460 380 - dBV V k dB s s s kHz
1997 Sep 19
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Philips Semiconductors
Product specification
Home automation modem
TDA5051
SYMBOL BER
PARAMETER bit error rate
CONDITIONS fosc = 8.48 MHz; 600 baud; S/N = 35 dB; signal 76 dBV; see Fig.17 -
MIN. 1
TYP. -
MAX.
UNIT 1 x 10-4
Power-up timing td(pu)(TX) delay between power-up and DATAIN in transmission mode XTAL = 8.48 MHz; - C1 = C2 = 27 pF; Rp = 2.2 M; see Fig.10 XTAL = 8.48 MHz; - C1 = C2 = 27pF; Rp = 2.2 M; fRXIN = 132.5 kHz; 120 dBV sinewave; see Fig.11 - - 1 - s
td(pu)(RX)
delay between power-up and DATAOUT in reception mode
1
-
s
Power-down timing td(pd)(TX) td(pd)(RX) delay between PD = 0 and DATAIN in transmission mode delay between PD = 0 and DATAOUT in reception mode fosc = 8.48 MHz; see Fig.12 fosc = 8.48 MHz; fRXIN = 132.5 kH; 120 dBV sinewave; see Fig.13 10 500 - - s s
tactive(min)
minimum active time with fosc = 8.48 MHz; T = 10 ms power-down period fRXIN = 132.5 kH; in reception mode 120 dBV sinewave; see Fig.14
-
1
-
s
1997 Sep 19
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Philips Semiconductors
Product specification
Home automation modem
TDA5051
dbook, full pagewidth
0
MGK834
132.5 kHz
Vo(rms) (dBV)
-100 105
f (Hz)
106
Resolution bandwidth = 9 kHz; top: 0 dBV (RMS) = 120 dBV (RMS); marker at -5 dBV (RMS) = 115 dBV (RMS); the CISPR16 network provides an attenuation of 6 dB, so the signal amplitude is 121 dBV (RMS).
Fig.3 Carrier spectrum.
1997 Sep 19
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Philips Semiconductors
Product specification
Home automation modem
TDA5051
1500 Hz -10 handbook, full pagewidth
MBH664
20 dB
dBV (RMS)
-60 117.5
132.5
f (kHz)
147.5
Resolution bandwidth = 100 Hz; B-20dB = 3000 Hz (2 x 1500 Hz).
Fig.4 Shaped signal spectrum.
handbook, full pagewidth
VRXIN
modulated sinewave 122 dBV amplitude
V(I)
0
t
GAGC +30 dB 8.68 dB AGC range -6 dB tc(AGC) (AGC time constant)
MGK011
Fig.5 AGC time constant definition (not to scale).
1997 Sep 19
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Philips Semiconductors
Product specification
Home automation modem
TIMING Configurations for clock
TDA5051
handbook, full pagewidth
OSC1 CLKOUT XTAL MICROCONTROLLER DGND GND 5
MGK007
fosc
7
TDA5051
For parameter description see Table 1.
Fig.6 External clock.
handbook, full pagewidth
CLKIN MICROCONTROLLER GND
CLKOUT fosc / 2
4
8
OSC2
C1
TDA5051
DGND 5 7 OSC1
Rp
XTAL C2
MGK008
For parameter description see Table 1.
Fig.7 Typical configuration for on-chip clock circuit.
Table 1
Clock oscillator parameters fcr CARRIER FREQUENCY 95 to 148.5 kHz
1 f 2 osc
fosc OSCILLATOR FREQUENCY 6.080 to 9.504 MHz
CLOCK OUTPUT FREQUENCY 3.040 to 4.752 MHz
EXTERNAL COMPONENTS C1 = C2 = 27 to 47 pF; Rp = 2.2 to 4.7 M; XTAL = standard quartz crystal
1997 Sep 19
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Philips Semiconductors
Product specification
Home automation modem
Table 2 Calculation of parameters depending of the clock frequency PARAMETER oscillator frequency clock output frequency carrier frequency/digital filter tuning frequency set-up time of the shaped burst CONDITIONS
TDA5051
SYMBOL fosc fCLKOUT fcr tsu th
UNIT Hz Hz Hz s
with on-chip oscillator: frequency of the crystal quartz; with external clock: frequency of the signal applied at OSC1
1 1 2fosc 64fosc
23 1472 ----- or f cr fosc 23 1472 ----- or -----------f cr f osc 1 tsu + ----f cr tW(DI)(min) + th 2514 -----------f osc 3700 ------------ (max.) f osc 3050 ------------ (max.) f osc
hold time of the shaped burst
s
tW(DI)(min)
minimum pulse width of DATAIN signal
s
tW(burst)(min) minimum burst time of VO(DC) signal tc(AGC) tsu(demod) th(demod) AGC time constant
s s
demodulation set-up time
s
demodulation hold time
s
handbook, full pagewidth
TXOUT
tW(burst)
tW(burst)(min)
VO(DC)
tsu 0
th
DATAIN (1) tW(DI) > tW(DI)(min) 1 (2) tW(DI)(min) = tsu + ----f cr (3) tW(DI)(min) < tsu; wrong operation
tW(DI)
tW(DI)(min)
(1)
(2)
(3)
MGK837
Fig.8 Relationship between DATAIN and TXOUT (see Table 3).
1997 Sep 19
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Philips Semiconductors
Product specification
Home automation modem
Table 3 Relationship between DATAIN and TXOUT PD 1 0 0 Note 1. X = don't care. DATAIN X(1) 1 0
TDA5051
TXOUT high impedance high impedance (after th) active with DC offset
handbook, halfpage
tW(burst) tsu th
100%
MGK010
Fig.9 Pulse shape characteristics.
1997 Sep 19
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Philips Semiconductors
Product specification
Home automation modem
Timing diagrams
TDA5051
handbook, full pagewidth
90% VDD
VDD
CLKOUT
NOT DEFINED
CLOCK STABLE
DATAIN
HIGH
TXOUT td(pu)(TX)
MGK015
DATAIN is an edge-sensitive input and must be HIGH before starting a transmission.
Fig.10 Timing diagram during power-up in transmission mode.
handbook, full pagewidth
90% VDD
VDD
CLKOUT
NOT DEFINED
CLOCK STABLE
RXIN
DATAOUT
NOT DEFINED
HIGH td(pu)(RX) td(dem)(h)
MGK016
Fig.11 Timing diagram during power-up in reception mode.
1997 Sep 19
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Philips Semiconductors
Product specification
Home automation modem
TDA5051
handbook, full pagewidth
PD
DATAIN
TXOUT td(pd)(TX) normal operation wrong operation TXOUT delayed by PD
MGK017
Fig.12 Power-down sequence in transmission mode.
handbook, full pagewidth
PD
RXIN
DATAOUT td(dem)(su) DATAOUT delayed by PD td(pd)(RX) td(pd)(RX)
MGK018
Fig.13 Power-down sequence in reception mode.
handbook, full pagewidth
PD
RXIN
DATAOUT tactive(min) T IDD(RX) IDD IDD(PD) 0
MGK845
Fig.14 Power saving by dynamic control of power-down.
1997 Sep 19
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Philips Semiconductors
Product specification
Home automation modem
TEST INFORMATION
TDA5051
handbook, full pagewidth
DATAIN pulse generator 300 Hz 50%
1
10
TXOUT
1 F
TDA5051
DATAOUT (to be tested) 2 7 Y1 Y2 8 30 XTAL fosc 14 RXIN 10 nF
OSCILLOSCOPE
DATAIN
TXOUT/RXIN
DATAOUT
td(dem)(su)
td(dem)(h)
MGK012
Fig.15 Test set-up for measuring demodulation delay.
1997 Sep 19
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Philips Semiconductors
Product specification
Home automation modem
TDA5051
handbook, full pagewidth
coupling network(3) TXOUT 10 F 33 nF 47 H 47 H
CISPR16 network(4)
OSC1
7
10
TDA5051
OSC2 8 1 12, 5, 9 13, 3, 11 DATAIN VDDA, VDDD, VDDAP AGND, DGND, APGND
33 nF
250 nF
50 H 50 5
250 nF
(1) (2)
+5 V POWER SUPPLY 50 H 5 SPECTRUM ANALYSER 50
MGK013
(1) (2) (3) (4)
Square wave TTL signal 300 Hz, duty factor = 50% for measuring signal bandwidth (see spectrum Fig.3). DATAIN = LOW for measuring total harmonic distortion (see spectrum Fig.3). Tuned for fcr = 132.5 kHz. The CISPR16 network provides a -6 dB attenuation.
Fig.16 Test set-up for measuring THD and bandwidth of the TXOUT signal.
1997 Sep 19
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Philips Semiconductors
Product specification
Home automation modem
TDA5051
handbook, full pagewidth
10
TXOUT
in COUPLING NETWORK (1)
out
+
+
TDA5051
12, AGND, DGND, APGND 5, 9 OSC2
SPECTRUM ANALYSER 50
1 DATAIN OSC1
7
8
out XTAL = 8.48 MHz WHITE NOISE GENERATOR
OSC1 7 8
OSC2 14 RXIN out COUPLING NETWORK (1) in PARAMETERS 600 BAUD PSEUDO RANDOM SEQUENCE: 29-1 BITS LONG
TDA5051
(to be tested) 2 DATAOUT DATAIN 12, AGND, DGND, APGND 5, 9
RXD V24/TTL INTERFACE TXD V24 SERIAL DATA ANALYSER
DATAOUT
MGK014
(1) See Fig.16.
Fig.17 Test set-up for measuring bit error rate (BER).
1997 Sep 19
19
Philips Semiconductors
Product specification
Home automation modem
APPLICATION INFORMATION
TDA5051
handbook, full pagewidth
250 V (AC) max
T 630 mA MOV 250 V (AC) 2 F 250 V (AC) 68 (2 W) 47 H 33 nF 250 V (AC) 33 nF 47 H
+5 V 1
1 mH
78L05
2
3 470 F (16 V)
1N4006
7V5 (1.3 W)
1N4006
47 nF
100 F (16 V) VDDD VDDAP 11 VDDA 13 14 RXIN 10 nF TXOUT
1 F (16 V)
+5 V
DATAIN DATAOUT MICROCONTROLLER CLKOUT PD
3 1 2
TDA5051
4 15 7 OSC1 2.2 M XTAL 8.48 MHz 8 5 9 12 10
P6KE6V8 OSC2 DGND APGND AGND
27 pF
27 pF
MGK020
Fig.18 Application diagram without power line insulation.
1997 Sep 19
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Philips Semiconductors
Product specification
Home automation modem
TDA5051
handbook, full pagewidth
20
MBH907
103
gain (dB) 0 input impedance ()
-20
-40
1
102
-60
2
-80
-100 10
102
103
104
105
106
f (Hz)
10 107
Main features of the coupling network: 50 Hz rejection >80 dB; anti-aliasing for the digital filter >50 dB at the sampling frequency (12fosc). Input impedance always higher than 10 within the 95 to 148.5 kHz band.
Fig.19 Gain (curve 1) and input impedance (curve 2) of the coupling network (fcr = 132.5 kHz); L = 47 H; C = 33 nF.
handbook, halfpage
130
MBH908
Vo (dBV) 120
110
100 1 10 Zline ()
102
Main features of the coupling network: 50 Hz rejection >80 dB; anti-aliasing for the digital filter >50 dB at the sampling frequency (12fosc). Input impedance always higher than 10 within the 95 to 148.5 kHz band.
Fig.20 Output voltage versus line impedance (with coupling network); L = 47 H; C = 33 nF.
1997 Sep 19
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Philips Semiconductors
Product specification
Home automation modem
TDA5051
handbook, full pagewidth
250 V (AC) max
T 630 mA MOV 250 V (AC) 100 (0.5 W) TOKO T1002 n=1 470 nF 250 V (AC)
230 V 1 VA +5 V 1 6V 3 470 F (16 V) 6.8 nF 33 nF
4
6
3 n=4 n=1 1 2 3.3 H
78L05
2
FDB08
47 nF
100 F (16 V) VDDD VDDAP 11 VDDA 13 14 RXIN TXOUT
470 nF
+5 V
DATAIN DATAOUT MICROCONTROLLER CLKOUT PD
3 1 2
TDA5051
4 15 7 OSC1 2.2 M XTAL 8.48 MHz 8 5 9 12 10
OSC2 DGND APGND AGND
P6KE6V8
27 pF
27 pF
MGK021
Fig.21 Application diagram with power line insulation.
1997 Sep 19
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Philips Semiconductors
Product specification
Home automation modem
PACKAGE OUTLINE SO16: plastic small outline package; 16 leads; body width 7.5 mm
TDA5051
SOT162-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 A1 pin 1 index Lp L 1 e bp 8 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT162-1 REFERENCES IEC 075E03 JEDEC MS-013AA EIAJ EUROPEAN PROJECTION A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 10.5 10.1 0.41 0.40 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
ISSUE DATE 95-01-24 97-05-22
1997 Sep 19
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Philips Semiconductors
Product specification
Home automation modem
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering
TDA5051
Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1997 Sep 19
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Philips Semiconductors
Product specification
Home automation modem
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA5051
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1997 Sep 19
25
Philips Semiconductors
Product specification
Home automation modem
NOTES
TDA5051
1997 Sep 19
26
Philips Semiconductors
Product specification
Home automation modem
NOTES
TDA5051
1997 Sep 19
27
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010, Fax. +43 160 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580920 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 Sao Paulo, SAO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1997
Internet: http://www.semiconductors.philips.com
SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
297027/1200/02/pp28
Date of release: 1997 Sep 19
Document order number:
9397 750 02513

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