PART |
Description |
Maker |
MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
SOD523 |
Surface mounted, 2 pin package Package outline
|
Zetex Semiconductors
|
AP2301BGN-HF AP2301BGN-HF-14 |
2.8 A, 20 V, 0.13 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp. Advanced Power Electron...
|
TQFN5X5-32 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP3X3-5 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN5X5-20 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN3X4-20 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN5X5-12 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP3X3-9 |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-28 |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-24 |
Package Outline
|
Global Mixed-mode Techn...
|