| PART |
Description |
Maker |
| FF1400R12IP4 |
IGBT Modules up to 1200V Dual ; Package: AG-PRIME3-1; IC (max): 1,400.0 A; VCE(sat) (typ): 1.75 V; Configuration: Dual Modules; Technology: IGBT4; Housing: PrimePACK 3;
PrimePACK? Modul mit Trench/Fieldstopp IGBT4 und Emitter Controlled 4 Diode und NTC
PrimePACK?? Modul mit Trench/Fieldstopp IGBT4 und Emitter Controlled 4 Diode und NTC
|
Infineon Technologies AG
|
| DFBM-CR220 |
Bluetooth Module Class 2 Wireless communication module compliant with Bluetooth Specification V1.2
|
Delta Electronics, Inc.
|
| BS616LV2016 BS616LV201 BS616LV2016DC BS616LV2016EI |
Very Low Power/Voltage CMOS SRAM 128K X 16 bit 非常低功电压CMOS SRAM28K的16
LM4935 Boomer ® Audio Power Amplifier Series Audio Sub-System with Dual-Mode Stereo Headphone & Mono High Efficiency Loudspeaker Amplifiers and Multi-Purpose ADC; Package: MICRO SMDXT; No of Pins: 49 非常低功电压CMOS SRAM28K的16
LM49370 Audio Sub-System with an Ultra Low EMI, Spread Spectrum, Class D Loudspeaker Amplifier, a Dual-Mode Stereo Headphone Amplifier, and a Dedicated PCM Interface for Bluetooth Transceivers; Package: MICRO SMDXT; No of Pins: 49
Asynchronous 2M(128Kx16) bits Static RAM
|
Brilliance Semiconducto...
BRILLIANCE SEMICONDUCTOR, INC.
BSI[Brilliance Semiconductor]
|
| T7024-TRS T7024 T7024-PGP T7024-PGQ T7024-TRQ |
The T7024 is a monolithic SiGe transmit/receive front-end IC with power amplifier, low-noise amplifier and T/R switch driver. It is especially designed for operation in TDMA systems like Bluetooth and WDCT.
BluetoothISM 2.4-GHz Front- End IC
Bluetooth?ISM 2.4-GHz Front- End IC
Bluetooth⑩/ISM 2.4-GHz Front- End IC
Bluetooth/ISM 2.4-GHz Front- End IC
|
Atmel Corp.
ATMEL[ATMEL Corporation]
|
| 24LC21 24LC21-SN 24LC21-IP 24LC21-ISN 24LC21-P |
1K 2.5V Dual Mode I 2 C Serial EEPROM 一.5V的双模式的I 2 C串行EEPROM
1K 2.5V Dual Mode I 2 C Serial EEPROM 一.5V的双模式I 2 C串行EEPROM
1K 2.5V Dual Mode I 2 C Serial EEPROM
1K2.5VDualModeI2CSerialEEPROM
|
Microchip Technology, Inc.
Microchip Technology Inc.
MicrochipTechnology
MICROCHIP[Microchip Technology]
|
| CGB240 |
2-Stage Bluetooth InGaP HBT Power Amplifier
2.4 to 2.5 GHz HBT Bluetooth Power Amplifier
|
TriQuint Semiconductor,Inc.
TRIQUINT[TriQuint Semiconductor]
|
| DD800S17H4-B2 |
IGBT-Modul
|
Infineon Technologies A...
|
| MC1602 |
MC1602 Modul
|
ASIX
|
| 5WG11118AA01 5WG11158AA01 BIMM115 BIMM111 |
BUS INTERFACE MODUL
|
Siemens Semiconductor G...
SIEMENS[Siemens Semiconductor Group]
|
| DDB2U50N08W1RB23 |
MOS-FET Modul
|
Infineon Technologies
|
| CMLDM7002A CMLDM7002AJ |
SMD Small Signal Mosfet Dual N-Channel Enhancement Mode
SURFACE MOUNT PICOmini DUAL N-CHANNEL ENHANCEMENT-MODE SILICON MOSFET
|
CENTRAL[Central Semiconductor Corp]
|
