| PART |
Description |
Maker |
| 35182-0193 |
1.78mm (.070) Tab, Wire-to-Wire Male Housing TPA? 1 Circuit, Vertical
|
Molex Electronics Ltd.
|
| 35182-0190 |
1.78mm (.070) Tab, Wire-to-Wire Male Housing TPA? 1 Circuit, Vertical
|
Molex Electronics Ltd.
|
| 35182-0192 |
1.78mm (.070) Tab, Wire-to-Wire Male Housing TPA? 1 Circuit, Vertical
|
Molex Electronics Ltd.
|
| 351810220 |
1.78mm (.070) Tab Multiple Wire-to-Wire Female Housing, 2 Circuits, Vertical, C-Type
|
Molex Electronics Ltd.
|
| STV0498 |
DOCSIS 2.0 cable modem chip with channel bonding
|
STMicroelectronics
|
| 35127-0400 0351270400 |
6.00mm (.236") Pitch Wire-to-Wire Male Housing, 4 Circuits, Vertical
6.00mm (.236) Pitch Wire-to-Wire Male Housing, 4 Circuits, Vertical
|
Molex Electronics Ltd.
|
| 0351820392 35182-0392 |
1.78mm (.070) Tab, 8.50mm (.335) Pitch Wire-to-Wire Female Housing TPA? 3Circuits, Vertical, Red
1.78mm (.070") Tab, 8.50mm (.335") Pitch Wire-to-Wire Female Housing TPA?? 3Circuits, Vertical, Red
|
Molex Electronics Ltd.
|
| 0351820390 35182-0390 |
1.78mm (.070) Tab, 8.50mm (.335) Pitch Wire-to-Wire Female Housing TPA? 3Circuits, Vertical, Natural
1.78mm (.070") Tab, 8.50mm (.335") Pitch Wire-to-Wire Female Housing TPA?? 3Circuits, Vertical, Natural
|
Molex Electronics Ltd.
|
| CYP15G0401DXB-BGXI |
Quad HOTLink II (TM) Transceiver; Features: Channel Bonding, 8B/10B, Redundancy, BIST, JTAG; Frequency Range: 0.2 to 1.5 Gbps; Standard: Ethernet, Fibre Channel, ESCON, DVB-ASI;
|
CYPRESS SEMICONDUCTOR CORP
|
| 0038000611 A-6410-5A-3 38-00-0611 |
2.54mm (.100) Pitch KK? Wire-to-Board Header, Vertical Square Pin, 5 Circuits, Circuit 3 Voided
2.54mm (.100") Pitch KK垄莽 Wire-to-Board Header, Vertical Square Pin, 5 Circuits, Circuit 3 Voided
MOLEX Connector
|
Molex Electronics Ltd.
|
|
