| PART |
Description |
Maker |
| M39P0R8070E2 M39P0R8070E2ZADE M39P0R8070E2ZADF |
256 or 512Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash memory 128 Mbit Low Power SDRAM, 1.8V supply, Multi-Chip Package
|
Numonyx B.V
|
| C1220X7R0J105M085AC |
Commercial Grade ( Low ESL Reverse Geometry )
|
TDK Electronics
|
| C0816X5R1A224M050AC |
Commercial Grade ( Low ESL Reverse Geometry )
|
TDK Electronics
|
| C1220X7R1C224M085AC |
Commercial Grade ( Low ESL Reverse Geometry )
|
TDK Electronics
|
| C1220X5R1H473M085AC |
Commercial Grade ( Low ESL Reverse Geometry )
|
TDK Electronics
|
| C1220X5R1E104M085AC |
Commercial Grade ( Low ESL Reverse Geometry )
|
TDK Electronics
|
| C0510X6S0G474M030AC |
Commercial Grade ( Low ESL Reverse Geometry )
|
TDK Electronics
|
| LLA185C70G105ME01L LLA31MR71A225MA01L LLA219R71A47 |
Eight Terminals Low ESL Type X7R(R7)/X7S(C7) Characteristics
|
Murata
|
| CS201212-5R6K CS201212-4R7K CS201212-R15K CS201212 |
Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 5600000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 4700000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 150000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 3300000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 820000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 680000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 180000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 68000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 33000000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns, Inc.
|
| S71NS032JA0BJWRT0 S71NS032J80BJWRA |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA56 Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品(MCP
|
Spansion, Inc.
|
| S75WS256NDFBFWLJ3 S75WS256NDFBAWLK2 S75WS256NDFBFW |
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品(MCP Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
|
Spansion, Inc. SPANSION LLC
|
|