| PART |
Description |
Maker |
| M368L3223FTN-CB3LAA M368L1624FTM-CB3AA M381L6423FT |
184pin Unbuffered Module based on 256Mb F-die with 64/72-bit Non-ECC / ECC 184pin缓冲模块，基56Mb的F -死去64/72-bit非ECC / ECC
|
Sanken Electric Co.,Ltd.
Sanken Electric Co., Ltd.
|
| M381L6423DTM-LCC_C4 M368L1624DTM M368L1624DTM-CCC |
184pin Unbuffered Module based on 256Mb D-die 64/72-bit Non ECC/ECC
|
Samsung Electronic
SAMSUNG[Samsung semiconductor]
|
| NAND08GW3B2CN1E NAND08GW3B2CN1F NAND08GW3B2CN6E NA |
4 Gbit, 8 Gbit, 2112 byte/1056 word page multiplane architecture, 1.8 V or 3 V, NAND Flash memories
|
Numonyx B.V
|
| HYM72V8010GS-60 HYM72V8010GS-50 HYM72V8000GS-60 HY |
8M x 72 Bit ECC FPM DRAM Module buffered
8M x 72-Bit Dynamic RAM Module (ECC - Module)
8M x 72-Bit Dynamic RAM Module 8米72位动态随机存储器模块
8M x 72-Bit Dynamic RAM Module 8M X 72 FAST PAGE DRAM MODULE, 60 ns, DMA168
Connector; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes 8M X 72 FAST PAGE DRAM MODULE, 50 ns, DMA168
|
SIEMENS[Siemens Semiconductor Group]
Infineon
SIEMENS AG
|
| H27U1G8F2B |
1 Gbit (128 M x 8 bit) NAND Flash
|
Hynix
|
| 72SD3232RPFK 72SD3232 72SD3232RPFE 72SD3232RPFH 72 |
1 Gbit SDRAM 32-Meg X 32-Bit X 4-Banks
|
MAXWELL[Maxwell Technologies]
|
| V23849-R35-C55 V23849-R36-C55 |
Transceivers by Form-factor MSA - iSFP? 1.25 Gbit/s GBE; 4.25/2.125/1.0625 Gbit/s FC, 850 nm; MM; LC; common ground sheme
Transceivers by Form-factor MSA - iSFP? 1.25 Gbit/s GBE; 4.25/2.125/1.0625 Gbit/s FC, 850 nm; MM; LC; separated ground sheme
|
Infineon
|
| RX1.25GBIT/S V23832-T2431-M101 |
PAROLI 2 Tx AC, 1.25 Gbit/s 帕罗2个发送，1.25千兆交流/
Parallel Optical Links (PAROLI) - PAROLI?2 Rx AC, 1.25 Gbit/s,
|
Infineon Technologies AG
|
| TZA3015HW/N1 |
TZA3015HW; 30 Mbit/s to 3.2 Gbit/s A-rate(tm) 4-bit fibre optic transceiver
|
Philips
|
| S34MS16G2 |
16 Gb, 4-Bit ECC, ×8 I/O, and 1.8 V VCC NAND Flash for Embedded
|
Cypress Semiconductor
|
