| PART |
Description |
Maker |
| MTSM5015-199-IR |
Circuit substrate: glass laminated epoxy
|
Marktech Corporate
|
| MTSM5015-843-IR |
Circuit substrate: glass laminated epoxy
|
Marktech Corporate
|
| NRC04J472TRF NRC01ZO NRC02 NRC02ZO NRC06F2741TRF N |
Thick Film Chip Resistors
DOUBLE GLASS OVERCOAT ASSURES STRONG MECHANICAL ..CONTRUCTION AND LONG LIFE, NICKEL BARRIER PREVENTS LEACHING
METAL GLAZED THICK FILM ON HIGH PURITY ALUMINA SUBSTRATE ..(CERMET) PROVIDES UNIFORM QUALITY AND HIGH RELIABILITY
|
NIC-Components Corp.
List of Unclassifed Manufacturers
List of Unclassifed Man...
|
| RN1001 RN1002 RN1006 RN1003 RN1004 RN1005 |
Transistor Silicon NPN Epitaxial Type (PCT Process) Switching, Inverter Circuit, Interface Circuit And Driver Circuit Applications
Switching/ Inverter Circuit/ Interface Circuit And Driver Circuit Applications
Switching, Inverter Circuit, Interface Circuit And Driver Circuit Applications 开关，逆变电路，接口电路及驱动电路应用
|
TOSHIBA[Toshiba Semiconductor]
Toshiba, Corp.
|
| BD-C406ND |
red chips, which are made from AlGaAs on GaAs substrate
|
BRIGHT LED ELECTRONICS CORP
|
| EM44GS28-32.768K-2.5-30 EM44GS3-32.768K-2.5-30 VEM |
Clipped Sinewave, 4 Pad FR4 substrate SMD
|
EUROQUARTZ limited
|
| BD-A304ND |
hi-eff red chips, GaAsP on GaP substrate
|
BRIGHT LED ELECTRONICS CORP
|
| BA-10Y1UD |
yellow chips, which are made from GaAsP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| EM62GS3-19.44-2.5-30 VEM62GS3-19.44-2.5-30 VEM62GS |
Clipped Sinewave, 6 Pad FR4 substrate SMD
|
EUROQUARTZ limited
|
| EM64S5-19.44-2.5-30 VEM64S5-19.44-2.5-30 VEM64S3-1 |
Clipped Sinewave, 6 Pad FR4 substrate SMD
|
EUROQUARTZ limited
|
| TA025 20K0J 24R0J TA605 TA050 TA100 5R00J 10K0J TA |
Power Chip? Thick Film on Alumina Substrate
|
Ohmite Mfg. Co.
|
