| PART |
Description |
Maker |
| JM-103R5-M5L201 JM-203R5-M5L201 |
Suitable for surface temperature measurement
|
Amphenol Corporation
|
| HVR100 |
Small Resin Package (SRP) is suitable for surface mount design
|
TY Semiconductor Co., L...
|
| HVD372B |
Super small Flat Lead Package (SFP) is suitable for surface mount design
|
TY Semiconductor Co., Ltd
|
| 1SMAF4728A 1SMAF4729A 1SMAF4730A 1SMAF4731A 1SMAF4 |
Small plastic package suitable for surface mounted design
Small plastic package suitable for surface mounted design
|
Chendahang Electronics ...
Jiangsu Yutai Electroni...
|
| RC5025 RC1608F105CS RC2012 RC1005F561CS RC2012F510 |
Suitable size and packaging for surface mount assembly
Low tolerance
Owing to the reduced lead inductance, the high frequency characteristic is excellent.
|
Samsung semiconductor
List of Unclassifed Manufacturers
List of Unclassifed Manufac...
List of Unclassifed Man...
|
| HSB88WA |
CMPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| HSM88AS |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| STP36N06FI |
OLD PRODUCT: NOT SUITABLE FOR NEW DESIGN-IN
|
ST Microelectronics
|
| STP2N60 STP2N60FI |
OLD PRODUCT: NOT SUITABLE FOR NEW DESIGN-IN
|
ST Microelectronics
|
| STP4NA40 STP4NA40FI |
OLD PRODUCT: NOT SUITABLE FOR NEW DESIGN-IN
|
ST Microelectronics
|
| STD2NA60 |
OLD PRODUCT: NOT SUITABLE FOR NEW DESIGN-IN
|
ST Microelectronics
|
| STP60NE03L-10 |
OLD PRODUCT: NOT SUITABLE FOR NEW DESIGN-IN
|
ST Microelectronics
|
